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JPS594657U - 発光ダイオ−ド - Google Patents

発光ダイオ−ド

Info

Publication number
JPS594657U
JPS594657U JP1982120185U JP12018582U JPS594657U JP S594657 U JPS594657 U JP S594657U JP 1982120185 U JP1982120185 U JP 1982120185U JP 12018582 U JP12018582 U JP 12018582U JP S594657 U JPS594657 U JP S594657U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
light
section
plastic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982120185U
Other languages
English (en)
Inventor
上村　幸守
小野　虎文
Original Assignee
サンケン電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by サンケン電気株式会社 filed Critical サンケン電気株式会社
Priority to JP1982120185U priority Critical patent/JPS594657U/ja
Publication of JPS594657U publication Critical patent/JPS594657U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案の発光ダイオードを使用した面照明装置
を示す斜視図、第２図は第１図のＩ−Ｉ線に沿う断面図
、第３図は第１図の■−■線に沿う断面図、第４図は本
考案の発光ダイオードの光度の指向性を示すグラフであ
る。 図面において、１は発光ダイオード、２は発光　　゛ダ
イオードチップ、３．５はリード線、４はチップマウン
ト用皿状部分、６は内部接続用ワイヤ、７は円筒形プラ
スチック体、８は外形断面が略Ｍ字形の発光側頂部、９
は断面略Ｖ字形の凹部、１１は外囲器、１２は光散乱板
、１３はマスク部材、１４．１５は光反射壁である。

Claims (4)

    【実用新案登録請求の範囲】
  1. （１）　　発光ダイオードチップとこれを被覆するプラ
    スチック体を少なくとも有し、このプラスチック体の発
    光側頂部の外形断面は略Ｍ字形であって、この発光側頂
    部における断面略Ｖ字形凹部の底部の直下に前記発光ダ
    イオードチップを配置したことを特徴とする発光ダイオ
    ード。
  2. （２）前記プラスチック体は光散乱性の少ない半透明な
    プラスチック材料で構成されている実用新案登録請求の
    範囲第１項記載の発光ダイオード。
  3. （３）前記発光側頂部における断面略Ｖ字形の凹部の開
    き角度が８０〜１３０°である実用新案登録請求の範囲
    第１項または第２項記載の発光ダイオード。
  4. （４）前記発光側頂部における断面略Ｖ字形の凹部の底
    部と前記発光ダイオードチップの上面との距離が０．５
    〜１．０ｍｍである実用新案登録請求の範囲第１項、第
    ２項または第３項記載の発光ダイオード。
JP1982120185U 1982-08-07 1982-08-07 発光ダイオ−ド Pending JPS594657U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982120185U JPS594657U (ja) 1982-08-07 1982-08-07 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982120185U JPS594657U (ja) 1982-08-07 1982-08-07 発光ダイオ−ド

Publications (1)

Publication Number Publication Date
JPS594657U true JPS594657U (ja) 1984-01-12

Family

ID=30275541

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982120185U Pending JPS594657U (ja) 1982-08-07 1982-08-07 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS594657U (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111426U (ja) * 1989-02-21 1990-09-06
JP2006148147A (ja) * 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Ｌｅｄダイ上のオーバーモールドレンズ
WO2006103582A1 (en) 2005-03-29 2006-10-05 Koninklijke Philips Electronics N.V. Wide emitting lens for led useful for backlighting

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038262B2 (ja) * 1971-09-30 1975-12-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038262B2 (ja) * 1971-09-30 1975-12-08

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02111426U (ja) * 1989-02-21 1990-09-06
JPH0342911Y2 (ja) * 1989-02-21 1991-09-09
JP2006148147A (ja) * 2004-11-15 2006-06-08 Lumileds Lighting Us Llc Ｌｅｄダイ上のオーバーモールドレンズ
WO2006103582A1 (en) 2005-03-29 2006-10-05 Koninklijke Philips Electronics N.V. Wide emitting lens for led useful for backlighting
EP1866975B1 (en) * 2005-03-29 2016-12-21 Koninklijke Philips N.V. LED structure with wide emitting lens useful for backlighting, and method of manufacture.

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