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JPS587364U - 発光ダイオ−ドランプ - Google Patents

発光ダイオ−ドランプ

Info

Publication number
JPS587364U
JPS587364U JP1981100817U JP10081781U JPS587364U JP S587364 U JPS587364 U JP S587364U JP 1981100817 U JP1981100817 U JP 1981100817U JP 10081781 U JP10081781 U JP 10081781U JP S587364 U JPS587364 U JP S587364U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode lamp
lead frame
reflective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1981100817U
Other languages
English (en)
Other versions
JPS6234469Y2 (ja
Inventor
中矢　富夫
進 武田
俊一 石川
酒井　弘生
Original Assignee
スタンレー電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by スタンレー電気株式会社 filed Critical スタンレー電気株式会社
Priority to JP1981100817U priority Critical patent/JPS587364U/ja
Publication of JPS587364U publication Critical patent/JPS587364U/ja
Application granted granted Critical
Publication of JPS6234469Y2 publication Critical patent/JPS6234469Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は本考案に係不第１実施例を示す発光ダイオード
ランプの縦断面図、第２図は同第２実施例の縦断面図で
ある。　゛ １・・・・・・リードフレーム、２・・・・・・発光ダ
イオード素子、３・・・・・・ワイヤー、４・・・・・
・反射枠、４ａ・・・・・・テーパー面、４ｂ・・・・
］・反射部、５・・・・・・レンズ部、６・・・・・・
樹脂。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームと発光ダイオード素子とを樹脂モールド
    した構造の発光ダイオードにおいて、リードフレームの
    位置決めをし、且つリードフレームの先端と発光ダイオ
    ード素子が臨む部分を放物面に形成して反射部とした反
    射枠をレンズ部形成の光透過性樹脂で同時にモールドし
    たことを特徴とす６発光’；”！；’ｒ　　ｌ’５７７
    °、　　　　、
JP1981100817U 1981-07-07 1981-07-07 発光ダイオ−ドランプ Granted JPS587364U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981100817U JPS587364U (ja) 1981-07-07 1981-07-07 発光ダイオ−ドランプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981100817U JPS587364U (ja) 1981-07-07 1981-07-07 発光ダイオ−ドランプ

Publications (2)

Publication Number Publication Date
JPS587364U true JPS587364U (ja) 1983-01-18
JPS6234469Y2 JPS6234469Y2 (ja) 1987-09-02

Family

ID=29895497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981100817U Granted JPS587364U (ja) 1981-07-07 1981-07-07 発光ダイオ−ドランプ

Country Status (1)

Country Link
JP (1) JPS587364U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186412U (ja) * 1984-05-23 1985-12-10 沖電線株式会社 強化被覆光フアイバ
JPH0367461U (ja) * 1989-10-31 1991-07-01

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53164772U (ja) * 1977-05-31 1978-12-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53164772U (ja) * 1977-05-31 1978-12-23

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186412U (ja) * 1984-05-23 1985-12-10 沖電線株式会社 強化被覆光フアイバ
JPH046003Y2 (ja) * 1984-05-23 1992-02-19
JPH0367461U (ja) * 1989-10-31 1991-07-01

Also Published As

Publication number Publication date
JPS6234469Y2 (ja) 1987-09-02

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