JPS59107152U - Lead frame for semiconductor devices - Google Patents
Lead frame for semiconductor devicesInfo
- Publication number
- JPS59107152U JPS59107152U JP65283U JP65283U JPS59107152U JP S59107152 U JPS59107152 U JP S59107152U JP 65283 U JP65283 U JP 65283U JP 65283 U JP65283 U JP 65283U JP S59107152 U JPS59107152 U JP S59107152U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor devices
- resin
- sealed
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のリードフレームを示す斜視図、第２図及
び第３図は本考案の実施例を示す斜視図である。
１・・・・・・くびれ、２・・・・・・穴、３及び４・
・・・・・樹脂と噛み合う面、５及び６・・・・・・リ
ードフレームの曲げられた部分。FIG. 1 is a perspective view showing a conventional lead frame, and FIGS. 2 and 3 are perspective views showing an embodiment of the present invention. 1... Constriction, 2... Hole, 3 and 4.
...The surface that engages with the resin, 5 and 6...The bent portion of the lead frame.
Claims (1)
いて、樹脂により封止される部分の一部分が半導体素子
の乗っている面に対し７平行以外の方向に曲がった外観
を呈していることを特徴とする半導体装置用リードフレ
ーム。A lead frame for a semiconductor device sealed with resin, characterized in that a part of the part sealed with resin has an appearance bent in a direction other than 7 parallel to the surface on which the semiconductor element is mounted. Lead frame for equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP65283U JPS59107152U (en) | 1983-01-07 | 1983-01-07 | Lead frame for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP65283U JPS59107152U (en) | 1983-01-07 | 1983-01-07 | Lead frame for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59107152U true JPS59107152U (en) | 1984-07-19 |
Family
ID=30132401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP65283U Pending JPS59107152U (en) | 1983-01-07 | 1983-01-07 | Lead frame for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107152U (en) |
-
1983
- 1983-01-07 JP JP65283U patent/JPS59107152U/en active Pending
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