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JPS6016547U - 3-terminal semiconductor device mounting device - Google Patents

3-terminal semiconductor device mounting device

Info

Publication number
JPS6016547U
JPS6016547U JP10676283U JP10676283U JPS6016547U JP S6016547 U JPS6016547 U JP S6016547U JP 10676283 U JP10676283 U JP 10676283U JP 10676283 U JP10676283 U JP 10676283U JP S6016547 U JPS6016547 U JP S6016547U
Authority
JP
Japan
Prior art keywords
terminal semiconductor
semiconductor device
mounting device
device mounting
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10676283U
Other languages
Japanese (ja)
Inventor
俊夫 荒井
隆 小塩
泰夫 小河
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP10676283U priority Critical patent/JPS6016547U/en
Publication of JPS6016547U publication Critical patent/JPS6016547U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図aは従来の3端子半導体素子の取付装置の分解斜
視図、同図すは同側面図、第2図aは他の従来の3端子
半導体素子の取付装置の斜視図、   −同図すは同側
面図、第3図は本考案の一実施例による3端子半導体素
子の取付装置の側面図、第4図は同上面図、第5図は同
下面図、第6図は同斜視図である。 11・・・・・・基板、12・・・・・・開口部、13
・・曲3端子半導体素子、14・・・・・・名称を記し
た面。 會 會 第3図
FIG. 1a is an exploded perspective view of a conventional mounting device for a 3-terminal semiconductor device, and FIG. 2a is a perspective view of another conventional mounting device for a 3-terminal semiconductor device. 3 is a side view of a mounting device for a three-terminal semiconductor device according to an embodiment of the present invention, FIG. 4 is a top view of the same, FIG. 5 is a bottom view of the same, and FIG. 6 is a perspective view of the same. It is a diagram. 11...Substrate, 12...Opening, 13
...Song 3-terminal semiconductor element, 14...Side with name written on it. Meeting Meeting Diagram 3

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 開口部を有する基板と、3端子半導体素子とを備え、前
記開口部に3端子半導体素子の名称を記した面を対向さ
せた3端子半導体素子の取付装置。
A mounting device for a 3-terminal semiconductor device, comprising a substrate having an opening and a 3-terminal semiconductor device, the surface having a name of the 3-terminal semiconductor device facing the opening.
JP10676283U 1983-07-08 1983-07-08 3-terminal semiconductor device mounting device Pending JPS6016547U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10676283U JPS6016547U (en) 1983-07-08 1983-07-08 3-terminal semiconductor device mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10676283U JPS6016547U (en) 1983-07-08 1983-07-08 3-terminal semiconductor device mounting device

Publications (1)

Publication Number Publication Date
JPS6016547U true JPS6016547U (en) 1985-02-04

Family

ID=30249703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10676283U Pending JPS6016547U (en) 1983-07-08 1983-07-08 3-terminal semiconductor device mounting device

Country Status (1)

Country Link
JP (1) JPS6016547U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021007119A (en) * 2019-06-27 2021-01-21 三菱電機株式会社 Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021007119A (en) * 2019-06-27 2021-01-21 三菱電機株式会社 Semiconductor device

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