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JPS5844842U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5844842U
JPS5844842U JP13997981U JP13997981U JPS5844842U JP S5844842 U JPS5844842 U JP S5844842U JP 13997981 U JP13997981 U JP 13997981U JP 13997981 U JP13997981 U JP 13997981U JP S5844842 U JPS5844842 U JP S5844842U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
mount portion
abstract
lead frame
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13997981U
Other languages
Japanese (ja)
Inventor
嶋田　利泰
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13997981U priority Critical patent/JPS5844842U/en
Publication of JPS5844842U publication Critical patent/JPS5844842U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3205—Shape
    • H01L2224/32057—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａ、　　ｂはそれぞれ従来の半導体装置を示す部
分断面図、第２図は本考案の一実施例を示す部分断面図
である。 １・・・・・・リードフレーム、２・・・・・・ろう材
、３−−−−−−半導体チップ、４・・・・・・スルー
ホール。1A and 1B are partial sectional views showing a conventional semiconductor device, respectively, and FIG. 2 is a partial sectional view showing an embodiment of the present invention. 1...Lead frame, 2...Brazing material, 3---Semiconductor chip, 4...Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チップがリードフレームのマウント部にろう材を
介して接着固定された半導体装置において、上記マウン
ト部にスルーホールが形成されていることを特徴とする
半導体装置。1. A semiconductor device in which a semiconductor chip is adhesively fixed to a mount portion of a lead frame via a brazing material, characterized in that a through hole is formed in the mount portion.
JP13997981U 1981-09-21 1981-09-21 semiconductor equipment Pending JPS5844842U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13997981U JPS5844842U (en) 1981-09-21 1981-09-21 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13997981U JPS5844842U (en) 1981-09-21 1981-09-21 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5844842U true JPS5844842U (en) 1983-03-25

Family

ID=29933154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13997981U Pending JPS5844842U (en) 1981-09-21 1981-09-21 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5844842U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413903U (en) * 1987-07-17 1989-01-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6413903U (en) * 1987-07-17 1989-01-24

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