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JPS6030544U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6030544U
JPS6030544U JP12182183U JP12182183U JPS6030544U JP S6030544 U JPS6030544 U JP S6030544U JP 12182183 U JP12182183 U JP 12182183U JP 12182183 U JP12182183 U JP 12182183U JP S6030544 U JPS6030544 U JP S6030544U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
resin container
view
close contact
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12182183U
Other languages
Japanese (ja)
Inventor
透 鈴木
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP12182183U priority Critical patent/JPS6030544U/en
Publication of JPS6030544U publication Critical patent/JPS6030544U/en
Pending legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図a、b、cはそれぞれ従来の半導体装置の斜視図
、側面図、正面図である。第2図a。 b、 cはそれぞれ本考案の一実施例の斜視図、側面図
、正面図である。第3図a、 b、 cはそれぞれ本考
案の他の実施例の斜視図、側面図、正面図である。 1、 11.21・・・・・・樹脂容器、2・・・・・
・外部引出しリード、3・・・・・・他物体平面、4,
5・・・・・・密着接触防止用突起(突条)。
FIGS. 1A, 1B, and 1C are a perspective view, a side view, and a front view of a conventional semiconductor device, respectively. Figure 2a. b and c are a perspective view, a side view, and a front view, respectively, of an embodiment of the present invention. Figures 3a, 3b and 3c are respectively a perspective view, a side view and a front view of another embodiment of the present invention. 1, 11.21...Resin container, 2...
・External drawer lead, 3...Other object plane, 4,
5... Protrusions (protrusions) for preventing close contact.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 樹脂容器に半導体チップを収納してなる半導体装置にお
いて、前記樹脂容器の外表面に、外部物体の平面と密着
接触するのを防ぐための突起が設□けられていることを
特徴とする半導体装置。
A semiconductor device comprising a semiconductor chip housed in a resin container, characterized in that a projection is provided on the outer surface of the resin container to prevent it from coming into close contact with a flat surface of an external object. .
JP12182183U 1983-08-05 1983-08-05 semiconductor equipment Pending JPS6030544U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12182183U JPS6030544U (en) 1983-08-05 1983-08-05 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12182183U JPS6030544U (en) 1983-08-05 1983-08-05 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6030544U true JPS6030544U (en) 1985-03-01

Family

ID=30278677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12182183U Pending JPS6030544U (en) 1983-08-05 1983-08-05 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6030544U (en)

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