JPS5892754U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS5892754U JPS5892754U JP18654381U JP18654381U JPS5892754U JP S5892754 U JPS5892754 U JP S5892754U JP 18654381 U JP18654381 U JP 18654381U JP 18654381 U JP18654381 U JP 18654381U JP S5892754 U JPS5892754 U JP S5892754U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- copper foil
- soldered
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はこの考案のプリント配線基板の一実施例の構成
を示す平面図、第２図は同上プリント配線基板の他の実
施例の構成を示す断面図、第３図はこの考案の他の実施
例を示す図である。
１・・・・・・プリント配線基板、１ａ・・・・・・銅
箔面、１ｂ・・・・・・表示印刷側、２・・・・・・金
属板、３・・・・・・ジャンパ線、３ａ、 ３ｂ、
８ａ、 ８ｂ−−−−−−ＩＪ−ｔ’線、４・・・
・・・コンデンサ、５・・・・・・抵抗、６・・・・・
・コネクタ、７・・・・・・半田、８・・・・・・部品
。Fig. 1 is a plan view showing the structure of one embodiment of the printed wiring board of this invention, Fig. 2 is a sectional view showing the structure of another embodiment of the same printed wiring board, and Fig. 3 is a plan view showing the structure of another embodiment of the printed wiring board of this invention. It is a figure showing an example. 1...Printed wiring board, 1a...Copper foil surface, 1b...Display printing side, 2...Metal plate, 3... jumper wire, 3a, 3b,
8a, 8b---IJ-t' line, 4...
... Capacitor, 5 ... Resistor, 6 ...
・Connector, 7...Solder, 8...Parts.
Claims (1)
る部品以外の部品、あるいはジャンパ線のリード線を上
記プリント配線基板の銅箔面で半・田付けするか、ある
いはアースとして用いる銅箔パターンの部分を半田付け
して盛り上がらせ、こ−の盛り上がらせた部分で上記銅
箔薗店近接して配設される金属板に接触させて、この金
属板と上記銅箔面間の間隙のスペーサとしての機能をも
たせることを特徴とするプリント配線基板。Components other than those mounted on a printed wiring board as parts constituting a circuit, or lead wires of jumper wires are soldered or soldered to the copper foil surface of the printed wiring board, or a part of a copper foil pattern used as a ground. The raised portion is brought into contact with a metal plate disposed adjacent to the copper foil, and is used as a spacer between the metal plate and the copper foil surface. A printed wiring board characterized by having functions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18654381U JPS5892754U (en) | 1981-12-15 | 1981-12-15 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18654381U JPS5892754U (en) | 1981-12-15 | 1981-12-15 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5892754U true JPS5892754U (en) | 1983-06-23 |
Family
ID=29988577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18654381U Pending JPS5892754U (en) | 1981-12-15 | 1981-12-15 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5892754U (en) |
-
1981
- 1981-12-15 JP JP18654381U patent/JPS5892754U/en active Pending
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