JPS5858343U - hybrid integrated circuit - Google Patents
hybrid integrated circuitInfo
- Publication number
- JPS5858343U JPS5858343U JP15164281U JP15164281U JPS5858343U JP S5858343 U JPS5858343 U JP S5858343U JP 15164281 U JP15164281 U JP 15164281U JP 15164281 U JP15164281 U JP 15164281U JP S5858343 U JPS5858343 U JP S5858343U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- package made
- covered
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の混成集積回路のパッケージング構造を示
す断面図、第２図は本考案による混成集積回路のパッケ
ージング構造の第１実施例を示す断面図、第３図は第２
の実施例を示す断面図である。
１・・・絶縁基板、２・・・部品、３・・・第１のパッ
ダー゛ ジ、５・・・第２のパッケージ。FIG. 1 is a sectional view showing a conventional packaging structure for a hybrid integrated circuit, FIG. 2 is a sectional view showing a first embodiment of a packaging structure for a hybrid integrated circuit according to the present invention, and FIG.
FIG. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Components, 3... First padage, 5... Second package.
Claims (1)
パッケージで覆い、さらにその全体を磁性材料を含む材
料からなる第２のパッケージで覆ったことを特徴とする
混成集積回路。A hybrid integrated circuit characterized in that the entire mounted component including an insulating substrate is covered with a first package made of an insulating material, and the whole is further covered with a second package made of a material containing a magnetic material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15164281U JPS5858343U (en) | 1981-10-14 | 1981-10-14 | hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15164281U JPS5858343U (en) | 1981-10-14 | 1981-10-14 | hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5858343U true JPS5858343U (en) | 1983-04-20 |
Family
ID=29944331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15164281U Pending JPS5858343U (en) | 1981-10-14 | 1981-10-14 | hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5858343U (en) |
-
1981
- 1981-10-14 JP JP15164281U patent/JPS5858343U/en active Pending
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