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JPS6037243U - hybrid integrated circuit - Google Patents

hybrid integrated circuit

Info

Publication number
JPS6037243U
JPS6037243U JP12808283U JP12808283U JPS6037243U JP S6037243 U JPS6037243 U JP S6037243U JP 12808283 U JP12808283 U JP 12808283U JP 12808283 U JP12808283 U JP 12808283U JP S6037243 U JPS6037243 U JP S6037243U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
container
substrate
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12808283U
Other languages
Japanese (ja)
Inventor
篤 丸山
鳥羽 進
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP12808283U priority Critical patent/JPS6037243U/en
Publication of JPS6037243U publication Critical patent/JPS6037243U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のシールド混成集積回路の断面図、第2図
は本考案の一実施例の断面図である。 1・・・基板、2・・・電子部品、5・・・樹脂成形容
器、6・・・金属層、4・・・注型樹脂。
FIG. 1 is a sectional view of a conventional shielded hybrid integrated circuit, and FIG. 2 is a sectional view of an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Electronic component, 5...Resin molded container, 6...Metal layer, 4...Casting resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 電子部品が固定された基板を内部に収容する容器が樹脂
成形品であり、その外面に金属層が被着されたことを特
徴とする混成集積回路。
1. A hybrid integrated circuit characterized in that a container that houses a substrate on which electronic components are fixed is a resin molded product, and a metal layer is adhered to the outer surface of the container.
JP12808283U 1983-08-19 1983-08-19 hybrid integrated circuit Pending JPS6037243U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12808283U JPS6037243U (en) 1983-08-19 1983-08-19 hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12808283U JPS6037243U (en) 1983-08-19 1983-08-19 hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS6037243U true JPS6037243U (en) 1985-03-14

Family

ID=30290678

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12808283U Pending JPS6037243U (en) 1983-08-19 1983-08-19 hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS6037243U (en)

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