JPS59176154U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS59176154U JPS59176154U JP6990983U JP6990983U JPS59176154U JP S59176154 U JPS59176154 U JP S59176154U JP 6990983 U JP6990983 U JP 6990983U JP 6990983 U JP6990983 U JP 6990983U JP S59176154 U JPS59176154 U JP S59176154U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- metallized layer
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のハイブリッドＩＣの平面図、第２図は本
考案の一実施例の平面図、第３図ａ、 ｂは夫々本考
案のリード部の構造を示す側面図である。
１・・・・・・外部リード（金属体）、１０・・・・・
・樹脂、１１・・・・・・基板、１２・・・・・・メタ
ライズ層、１３・・・・・・テーパ。FIG. 1 is a plan view of a conventional hybrid IC, FIG. 2 is a plan view of an embodiment of the present invention, and FIGS. 3a and 3b are side views showing the structure of the lead portion of the present invention. 1... External lead (metal body), 10...
- Resin, 11... Substrate, 12... Metallized layer, 13... Taper.
Claims (1)
で形成し、このメタライズ層は部分的に離間していない
装置の絶縁基板上に設けられている事を特徴とする混成
集積回路装置。A hybrid integrated circuit device characterized in that a plurality of required external lead portions are formed of a metallized layer, and the metallized layer is provided on an insulating substrate of the device that is not partially spaced apart.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6990983U JPS59176154U (en) | 1983-05-11 | 1983-05-11 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6990983U JPS59176154U (en) | 1983-05-11 | 1983-05-11 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59176154U true JPS59176154U (en) | 1984-11-24 |
Family
ID=30200057
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6990983U Pending JPS59176154U (en) | 1983-05-11 | 1983-05-11 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59176154U (en) |
-
1983
- 1983-05-11 JP JP6990983U patent/JPS59176154U/en active Pending
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