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JPS572890A - Gold alloy plating bath - Google Patents

Gold alloy plating bath

Info

Publication number
JPS572890A
JPS572890A JP7739880A JP7739880A JPS572890A JP S572890 A JPS572890 A JP S572890A JP 7739880 A JP7739880 A JP 7739880A JP 7739880 A JP7739880 A JP 7739880A JP S572890 A JPS572890 A JP S572890A
Authority
JP
Japan
Prior art keywords
gold
metals
plating bath
excess
complexing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7739880A
Other languages
Japanese (ja)
Other versions
JPS6312954B2 (en
Inventor
Eiji Togawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP7739880A priority Critical patent/JPS572890A/en
Publication of JPS572890A publication Critical patent/JPS572890A/en
Publication of JPS6312954B2 publication Critical patent/JPS6312954B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)

Abstract

PURPOSE: To obtain a gold alloy plating bath for stable strike by which bright plating is obtained by specifying the amounts of the gold, stannous ions, 3rd element and complexing agent of the gold-in base alloy plating bath.
CONSTITUTION: An aqueous bath for electrodeposition of gold alloy is prepd. by 0.05W1g/l gold added as potassium gold cyanide, 0.05W100g/l Sn+2 or ≤80g/l ions of ≥1 kinds of metals of Ia, IVaWVIIIa groups of periodic table and non-metals of IVbWVIb groups, and 0.05W100g/l Sn+2, and 5W800g/l compounds of ≥1 kinds which complex said metals and non-metals even slightly. Here, if gold is below the lower limit, its consumption is consideable and if it is in excess of the upper limit, adhesiveness is poor. Sn+2 is similar to gold if it is below the lower limit, and corrosion resistance will lower if it is above the upper limit. If the above-described metals and non-metals for the purpose of enhancing the mechanical strength of the gold-tin alloy are in excess of the upper limits, complexing will be difficult and will not meet the object. The complexing agent is low in complexing effect and is unstable in plating bath if it is below the lower limit and will increase its viscosity if in excess of the upper limit.
COPYRIGHT: (C)1982,JPO&Japio
JP7739880A 1980-06-09 1980-06-09 Gold alloy plating bath Granted JPS572890A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7739880A JPS572890A (en) 1980-06-09 1980-06-09 Gold alloy plating bath

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7739880A JPS572890A (en) 1980-06-09 1980-06-09 Gold alloy plating bath

Publications (2)

Publication Number Publication Date
JPS572890A true JPS572890A (en) 1982-01-08
JPS6312954B2 JPS6312954B2 (en) 1988-03-23

Family

ID=13632785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7739880A Granted JPS572890A (en) 1980-06-09 1980-06-09 Gold alloy plating bath

Country Status (1)

Country Link
JP (1) JPS572890A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1300487A1 (en) * 2001-10-02 2003-04-09 Shipley Co. L.L.C. Plating bath and method for depositing a metal layer on a substrate

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455839U (en) * 1990-09-19 1992-05-13

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1300487A1 (en) * 2001-10-02 2003-04-09 Shipley Co. L.L.C. Plating bath and method for depositing a metal layer on a substrate
US6773573B2 (en) 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate

Also Published As

Publication number Publication date
JPS6312954B2 (en) 1988-03-23

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