ATE110124T1 - ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS. - Google Patents
ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS.Info
- Publication number
- ATE110124T1 ATE110124T1 AT90301749T AT90301749T ATE110124T1 AT E110124 T1 ATE110124 T1 AT E110124T1 AT 90301749 T AT90301749 T AT 90301749T AT 90301749 T AT90301749 T AT 90301749T AT E110124 T1 ATE110124 T1 AT E110124T1
- Authority
- AT
- Austria
- Prior art keywords
- gold
- bath
- containing alloys
- electric plating
- cyanide
- Prior art date
Links
- 229910045601 alloy Inorganic materials 0.000 title 1
- 239000000956 alloy Substances 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
- -1 cyanide compound Chemical class 0.000 abstract 5
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 229910000881 Cu alloy Inorganic materials 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 abstract 1
- 230000007797 corrosion Effects 0.000 abstract 1
- 238000005260 corrosion Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 150000002739 metals Chemical class 0.000 abstract 1
- 150000002825 nitriles Chemical class 0.000 abstract 1
- 150000003839 salts Chemical class 0.000 abstract 1
- VOADVZVYWFSHSM-UHFFFAOYSA-L sodium tellurite Chemical compound [Na+].[Na+].[O-][Te]([O-])=O VOADVZVYWFSHSM-UHFFFAOYSA-L 0.000 abstract 1
- 239000004094 surface-active agent Substances 0.000 abstract 1
- 229910052714 tellurium Inorganic materials 0.000 abstract 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
A gold-copper alloy of good corrosion resistance is electrolytically deposited from a bath containing a cyanide compound of gold (e.g. KAu(CN)2), a cyanide compound of copper and tellurium or bismuth in the form of a soluble salt (e.g. sodium tellurite), the bath being substantially free of any other metal in an electrolytically depositable form. The bath generally also contains a cyanide salt (e.g. KCN) and may also contain a surface-active agent. Foreign metals, e.g. zinc, may be chelated or complexed to prevent deposition thereof.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB898903818A GB8903818D0 (en) | 1989-02-20 | 1989-02-20 | Electrolytic deposition of gold-containing alloys |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE110124T1 true ATE110124T1 (en) | 1994-09-15 |
Family
ID=10651985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT90301749T ATE110124T1 (en) | 1989-02-20 | 1990-02-19 | ELECTRIC PLATING OF GOLD-CONTAINING ALLOYS. |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0384679B1 (en) |
| AT (1) | ATE110124T1 (en) |
| DE (1) | DE69011549T2 (en) |
| GB (1) | GB8903818D0 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1983077B1 (en) | 2007-04-19 | 2016-12-28 | Enthone, Inc. | Electrolyte and method for electrolytic deposition of gold-copper alloys |
| CH710184B1 (en) | 2007-09-21 | 2016-03-31 | Aliprandini Laboratoires G | Process for obtaining a yellow gold alloy deposit by electroplating without the use of toxic metals or metalloids. |
| EP2312021B1 (en) | 2009-10-15 | 2020-03-18 | The Swatch Group Research and Development Ltd. | Method for obtaining a deposit of a yellow gold alloy by galvanoplasty without using toxic metals |
| DE102011056318B3 (en) * | 2011-12-13 | 2013-04-18 | Doduco Gmbh | Electrolytic bath for depositing a gold-copper alloy |
| IT201900001769A1 (en) * | 2019-02-07 | 2020-08-07 | Italfimet Srl | Rose gold alloy, manufacturing process and use. |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3319772A1 (en) * | 1983-05-27 | 1984-11-29 | Schering AG, 1000 Berlin und 4709 Bergkamen | BATH FOR GALVANIC DEPOSITION OF GOLD ALLOYS |
| DE3505473C1 (en) * | 1985-02-16 | 1986-06-05 | Degussa Ag, 6000 Frankfurt | Electroplating bath for gold-indium alloy coatings |
| CH662583A5 (en) * | 1985-03-01 | 1987-10-15 | Heinz Emmenegger | GALVANIC BATH FOR THE ELECTROLYTIC DEPOSITION OF GOLD-COPPER-CADMIUM-ZINC ALLOYS. |
-
1989
- 1989-02-20 GB GB898903818A patent/GB8903818D0/en active Pending
-
1990
- 1990-02-19 EP EP90301749A patent/EP0384679B1/en not_active Expired - Lifetime
- 1990-02-19 AT AT90301749T patent/ATE110124T1/en not_active IP Right Cessation
- 1990-02-19 DE DE69011549T patent/DE69011549T2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP0384679B1 (en) | 1994-08-17 |
| DE69011549T2 (en) | 1995-04-06 |
| GB8903818D0 (en) | 1989-04-05 |
| DE69011549D1 (en) | 1994-09-22 |
| EP0384679A1 (en) | 1990-08-29 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |