JPS56105468A - Chemical copper plating solution - Google Patents
Chemical copper plating solutionInfo
- Publication number
- JPS56105468A JPS56105468A JP574680A JP574680A JPS56105468A JP S56105468 A JPS56105468 A JP S56105468A JP 574680 A JP574680 A JP 574680A JP 574680 A JP574680 A JP 574680A JP S56105468 A JPS56105468 A JP S56105468A
- Authority
- JP
- Japan
- Prior art keywords
- copper plating
- chemical copper
- plating solution
- dipyridyl
- polyethylene glycol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000000126 substance Substances 0.000 title abstract 3
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 abstract 3
- REYJJPSVUYRZGE-UHFFFAOYSA-N Octadecylamine Chemical compound CCCCCCCCCCCCCCCCCCN REYJJPSVUYRZGE-UHFFFAOYSA-N 0.000 abstract 3
- 239000002202 Polyethylene glycol Substances 0.000 abstract 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 abstract 3
- 229910052946 acanthite Inorganic materials 0.000 abstract 3
- 229920001223 polyethylene glycol Polymers 0.000 abstract 3
- FSJWWSXPIWGYKC-UHFFFAOYSA-M silver;silver;sulfanide Chemical compound [SH-].[Ag].[Ag+] FSJWWSXPIWGYKC-UHFFFAOYSA-M 0.000 abstract 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 abstract 1
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 230000007423 decrease Effects 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To provide a chemical copper plating solution capable of improving bath stability, plating speed, and mechanical properties of plated film by having the composition to include a specific amount of polyethylene glycol stearyl amine, 2,2'- dipyridyl, and Ag2S.
CONSTITUTION: A chemical copper plating solution consists of: CuSO4.5H2O: 5W 18g/l, EDTA.2Na: 15W54g/l, formalin: 1W10ml/l polyethylene glycol stearyl amine: 5W500ml/l, 2,2'-dipyridyl: 1W30mg/l, and Ag2S: 2.5×10-15W5g/l, with pH adjusted to 11.9W12.8 by using NaOH, etc. In this composition, the added Ag2S enters, as colloidal particles, the intergrains of crystal of the plated film and decreases the internal stress of the film and increases the toughness of the film. Polyethylene glycol stearyl amine and 2,2'-dipyridyl contribute to enhance plating speed and stabilize the solution.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP574680A JPS56105468A (en) | 1980-01-23 | 1980-01-23 | Chemical copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP574680A JPS56105468A (en) | 1980-01-23 | 1980-01-23 | Chemical copper plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56105468A true JPS56105468A (en) | 1981-08-21 |
Family
ID=11619662
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP574680A Pending JPS56105468A (en) | 1980-01-23 | 1980-01-23 | Chemical copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56105468A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6831009B2 (en) | 2000-10-03 | 2004-12-14 | Hitachi, Ltd. | Wiring substrate and an electroless copper plating solution for providing interlayer connections |
-
1980
- 1980-01-23 JP JP574680A patent/JPS56105468A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6831009B2 (en) | 2000-10-03 | 2004-12-14 | Hitachi, Ltd. | Wiring substrate and an electroless copper plating solution for providing interlayer connections |
| US6989329B2 (en) | 2000-10-03 | 2006-01-24 | Hitachi, Ltd. | Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS56156749A (en) | Chemical copper plating solution | |
| JPS5743995A (en) | Silver plating liquid and silver plating method | |
| JPS569386A (en) | Production of electro-zinc plated steel plate | |
| JPS56105468A (en) | Chemical copper plating solution | |
| LV10317A (en) | Liquid dispersive composition and method for preparing iron-containing metal products for surface treatment | |
| JPS57140891A (en) | Pretreating solution for silver plating | |
| KR840004185A (en) | Chelation of metals | |
| JPS5770286A (en) | Plating bath composition and plating method | |
| JPS56136965A (en) | Plating method | |
| JPS5419430A (en) | Chemical copper plating solution | |
| JPS53124130A (en) | Manufacture of amorphous alloy | |
| JPS575856A (en) | Plating method | |
| JPS5794599A (en) | Silver plated film and electroplating method | |
| JPS56136970A (en) | Chemical copper plating bath | |
| JPS5554589A (en) | Plating method of electronic parts which prevent production of zinc whisker | |
| JPS57120664A (en) | Formation of nickel film | |
| JPS572890A (en) | Gold alloy plating bath | |
| JPS579865A (en) | Electroless copper plating solution | |
| JPS5415433A (en) | Method of producing tin electro-plate | |
| JPS56123363A (en) | Pretreating liquid for chemical plating | |
| JPS579867A (en) | Electroless copper plating solution | |
| JPS5770288A (en) | Highly corrosion reistant surface treated steel and preparation thereof | |
| JPS579866A (en) | Electroless copper plating solution | |
| JPS53144837A (en) | Electroless copper plating bath | |
| JPS5760091A (en) | Copper-tin alloy plating bath |