JPS579865A - Electroless copper plating solution - Google Patents
Electroless copper plating solutionInfo
- Publication number
- JPS579865A JPS579865A JP8291380A JP8291380A JPS579865A JP S579865 A JPS579865 A JP S579865A JP 8291380 A JP8291380 A JP 8291380A JP 8291380 A JP8291380 A JP 8291380A JP S579865 A JPS579865 A JP S579865A
- Authority
- JP
- Japan
- Prior art keywords
- soln
- electroless copper
- complexing agents
- copper plating
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title abstract 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- 229910052802 copper Inorganic materials 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000008139 complexing agent Substances 0.000 abstract 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract 2
- 239000003381 stabilizer Substances 0.000 abstract 2
- 239000004094 surface-active agent Substances 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract 1
- 239000013522 chelant Substances 0.000 abstract 1
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- 150000001879 copper Chemical class 0.000 abstract 1
- 229910001431 copper ion Inorganic materials 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000002156 mixing Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Chemically Coating (AREA)
Abstract
PURPOSE: To improve the stability of an electroless copper plating soln. while enhancing the deposition speed and the characteristics of a film by specifying the stabilizing agent and the complexing agent in the composition of the plating soln.
CONSTITUTION: This electroless copper plating soln. is prepared by blending water with water-soluble copper salt, a reducing agent, a pH regulator, 1 kinds of nonionic polyoxyalkyleneamine surfactants represented by formula I or II as a stabilizer and ≥1 kinds of cupric ion complexing agents having amine, carboxylic acid and OH groups and represented by formula III or IV. By the complexing agents in the composition of the soln. the copper ion releasability of the chelate is improved, the plating speed is increased, and the mechanical properties of a film are enhanced. In addition, by the specified surfactants used in combination with the complexing agents the stability of the plating soln. is increased remarkably.
COPYRIGHT: (C)1982,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8291380A JPS579865A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8291380A JPS579865A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS579865A true JPS579865A (en) | 1982-01-19 |
| JPS6259180B2 JPS6259180B2 (en) | 1987-12-09 |
Family
ID=13787485
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8291380A Granted JPS579865A (en) | 1980-06-20 | 1980-06-20 | Electroless copper plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS579865A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | chemical copper plating liquid |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| US5059243A (en) * | 1989-04-28 | 1991-10-22 | International Business Machines Corporation | Tetra aza ligand systems as complexing agents for electroless deposition of copper |
-
1980
- 1980-06-20 JP JP8291380A patent/JPS579865A/en active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59116366A (en) * | 1982-12-24 | 1984-07-05 | Hitachi Ltd | chemical copper plating liquid |
| US4814009A (en) * | 1986-11-14 | 1989-03-21 | Nippondenso Co., Ltd. | Electroless copper plating solution |
| US5059243A (en) * | 1989-04-28 | 1991-10-22 | International Business Machines Corporation | Tetra aza ligand systems as complexing agents for electroless deposition of copper |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6259180B2 (en) | 1987-12-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES8501823A1 (en) | Method for washing of textiles in hard water and phosphate-free detergent compositions for use therein. | |
| EP0039757B1 (en) | Chemical copper-plating bath | |
| JPS54121127A (en) | Photographic processing composition | |
| JPS579865A (en) | Electroless copper plating solution | |
| GB1286941A (en) | Chemical reduction copper plating | |
| JPS5672196A (en) | Bright plating bath for copper-tin alloy | |
| GB1414896A (en) | Electroless copper plating | |
| JPS579867A (en) | Electroless copper plating solution | |
| JPS56271A (en) | Non-electrolytic copper plating solution | |
| BR8206611A (en) | FUNGICIDE COMPOSITION | |
| EP0104012A3 (en) | Composition and method for simultaneously removing iron and copper scales from ferrous metal surfaces | |
| JPS56108892A (en) | Plating solution with pure gold | |
| US2794818A (en) | Germicidally active phenolic copper chelate compounds | |
| IE800313L (en) | Detergent composition containing soluble citric acid salts. | |
| JPS579866A (en) | Electroless copper plating solution | |
| JPS5419430A (en) | Chemical copper plating solution | |
| JPS60218480A (en) | chemical copper plating liquid | |
| JPS56136970A (en) | Chemical copper plating bath | |
| JPS5662974A (en) | Corrosion preventing method of underwater metal | |
| JPS57174445A (en) | Chemical copper plating solution | |
| JPS56142873A (en) | Anticorrosive agent for metal | |
| JPS56272A (en) | Non-electrolytic copper plating solution | |
| JPS57116768A (en) | Chemical copper plating solution | |
| JPS5658960A (en) | Chemical copper-plating solution | |
| JPS57114657A (en) | Chemical copper plating method |