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JPS57204154A - Structure of chip carrier - Google Patents

Structure of chip carrier

Info

Publication number
JPS57204154A
JPS57204154A JP8896881A JP8896881A JPS57204154A JP S57204154 A JPS57204154 A JP S57204154A JP 8896881 A JP8896881 A JP 8896881A JP 8896881 A JP8896881 A JP 8896881A JP S57204154 A JPS57204154 A JP S57204154A
Authority
JP
Japan
Prior art keywords
substrate
chip
chip carrier
bonding
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8896881A
Other languages
Japanese (ja)
Other versions
JPS634708B2 (en
Inventor
Katsuhiko Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP8896881A priority Critical patent/JPS57204154A/en
Publication of JPS57204154A publication Critical patent/JPS57204154A/en
Publication of JPS634708B2 publication Critical patent/JPS634708B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49805—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To improve the mounting density of an IC by connecting an IC lead bonding pad on a face-down type chip carrier substrate to the latticed bonding pad of the back of the substrate through wiring in the substrate. CONSTITUTION:An IC chip 6 is connected to the bonding pads 3 on the chip carrier substrate 1 through a lead 7 protected together with the IC chip 6 by a layer such as an organic resin insulating layer 12. The bonding pads 3 are connected to the latticed pads 11 for solder bonding to the multilayer wiring substrate of the back by the wiring 4 in the substrate 1, and make the size of the chip carrier small. The IC chip 6 is directly solder-die bonded 8 to the inside of a cap 8, the outside thereof has radiators, and radiates heat generated from the IC by low heat and low resistance.
JP8896881A 1981-06-09 1981-06-09 Structure of chip carrier Granted JPS57204154A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8896881A JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8896881A JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Publications (2)

Publication Number Publication Date
JPS57204154A true JPS57204154A (en) 1982-12-14
JPS634708B2 JPS634708B2 (en) 1988-01-30

Family

ID=13957607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8896881A Granted JPS57204154A (en) 1981-06-09 1981-06-09 Structure of chip carrier

Country Status (1)

Country Link
JP (1) JPS57204154A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125642A (en) * 1983-01-05 1984-07-20 Nec Corp Leadless chip carrier
JPS59125641A (en) * 1983-01-05 1984-07-20 Nec Corp Leadless chip carrier
JPS629640A (en) * 1985-07-08 1987-01-17 Nec Corp Mounting structure of semiconductor parts
JPH06224259A (en) * 1992-11-18 1994-08-12 Matsushita Electron Corp Semiconductor device and manufacture thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS55176571U (en) * 1979-06-05 1980-12-18

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5370672A (en) * 1976-12-06 1978-06-23 Ibm Ic assembly
JPS55176571U (en) * 1979-06-05 1980-12-18

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59125642A (en) * 1983-01-05 1984-07-20 Nec Corp Leadless chip carrier
JPS59125641A (en) * 1983-01-05 1984-07-20 Nec Corp Leadless chip carrier
JPS629640A (en) * 1985-07-08 1987-01-17 Nec Corp Mounting structure of semiconductor parts
JPH06224259A (en) * 1992-11-18 1994-08-12 Matsushita Electron Corp Semiconductor device and manufacture thereof

Also Published As

Publication number Publication date
JPS634708B2 (en) 1988-01-30

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