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JPS57171681A - Lead frame and its manufacture - Google Patents

Lead frame and its manufacture

Info

Publication number
JPS57171681A
JPS57171681A JP5713981A JP5713981A JPS57171681A JP S57171681 A JPS57171681 A JP S57171681A JP 5713981 A JP5713981 A JP 5713981A JP 5713981 A JP5713981 A JP 5713981A JP S57171681 A JPS57171681 A JP S57171681A
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor element
electroforming
alloy
thermal expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5713981A
Other languages
Japanese (ja)
Inventor
Hirozo Sugai
Toshio Kumiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5713981A priority Critical patent/JPS57171681A/en
Publication of JPS57171681A publication Critical patent/JPS57171681A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To obtain a lead frame which is a constituent part of a metallic body formed by electroforming, is free from working distortion due to conventional punching, etc., is satisfactory in dimension accuracy, and also is capable of making its thermal expansion characteristic conform with that of a semiconductor element.
CONSTITUTION: Said lead frame is constituted of a substance which has peeled off that which has performed thick plating of a prescribed metal to a prescribed part on a basic matrix, from the matrix, that is to say, a metallic body formed by electroforming. As for this lead frame, that which has multi-terminal exceeding 40 terminals, or that which has a complicated shape can be used. Also, this lead frame can be obtained by depositing a metal (alloy) to only a necessary part as a frame, therefore, the material is scarcely lost as compared with a lead press obtained by a press. In this regard, as for this lead frame, since its coefficient of thermal expansion is made to conform with that of a semiconductor element, it is desirable that the surface for placing the semiconductor element is formed by 35W45 Ni-Fe alloy.
COPYRIGHT: (C)1982,JPO&Japio
JP5713981A 1981-04-17 1981-04-17 Lead frame and its manufacture Pending JPS57171681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5713981A JPS57171681A (en) 1981-04-17 1981-04-17 Lead frame and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5713981A JPS57171681A (en) 1981-04-17 1981-04-17 Lead frame and its manufacture

Publications (1)

Publication Number Publication Date
JPS57171681A true JPS57171681A (en) 1982-10-22

Family

ID=13047231

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5713981A Pending JPS57171681A (en) 1981-04-17 1981-04-17 Lead frame and its manufacture

Country Status (1)

Country Link
JP (1) JPS57171681A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234061A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
JPS61234060A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
US5656855A (en) * 1992-12-23 1997-08-12 Shinko Electric Industries Co., Ltd. Lead frame and method for manufacturing same

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61234061A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
JPS61234060A (en) * 1985-04-10 1986-10-18 Kyushu Hitachi Maxell Ltd Manufacture of lead frame of semiconductor device
US5656855A (en) * 1992-12-23 1997-08-12 Shinko Electric Industries Co., Ltd. Lead frame and method for manufacturing same
US5909053A (en) * 1992-12-23 1999-06-01 Shinko Electric Industries Co. Ltd. Lead frame and method for manufacturing same

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