JPS5487181A - Resin sealing method for semiconductor element - Google Patents
Resin sealing method for semiconductor elementInfo
- Publication number
- JPS5487181A JPS5487181A JP15444577A JP15444577A JPS5487181A JP S5487181 A JPS5487181 A JP S5487181A JP 15444577 A JP15444577 A JP 15444577A JP 15444577 A JP15444577 A JP 15444577A JP S5487181 A JPS5487181 A JP S5487181A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- sealing
- plate
- shape
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title abstract 8
- 229920005989 resin Polymers 0.000 title abstract 8
- 238000007789 sealing Methods 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 title 1
- 239000007788 liquid Substances 0.000 abstract 2
- 239000008188 pellet Substances 0.000 abstract 2
- 238000004382 potting Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
PURPOSE: To make thin to arbitrary shape, by attaching the resin thin plate at the part where resin sealing is made to one side of subassembly and coating liquid resin with potting from another side of the subasembly.
CONSTITUTION: The pellet 2 is bonded 7 on the tab 11 of the lead frame and the subassembly is formed by connecting 3 it with the lead piece 12. Next, the resin thin plate 8 is attached on opposite side tab of the pellet 2 and the lead piece. The plate 8 has the size corresponding to the sealing schedule part and has the shape corresponding to the sealing shape. With the condition touching the plate 8, the resin 9 of liquid nature is coated with potting method and hardened, forming the sealing section with the shape equal to the plate 8. With this constitution, the resin sealing part is made small in size and thin, and since no amount of useless resin is present, the removal work after sealing is eliminated and no burr removal is required because no metal mold is used.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15444577A JPS5487181A (en) | 1977-12-23 | 1977-12-23 | Resin sealing method for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15444577A JPS5487181A (en) | 1977-12-23 | 1977-12-23 | Resin sealing method for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5487181A true JPS5487181A (en) | 1979-07-11 |
Family
ID=15584354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15444577A Pending JPS5487181A (en) | 1977-12-23 | 1977-12-23 | Resin sealing method for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5487181A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60101954A (en) * | 1983-11-08 | 1985-06-06 | Seikosha Co Ltd | Ic package and manufacture thereof |
| JPH03254135A (en) * | 1990-03-05 | 1991-11-13 | Sankyo Seiki Mfg Co Ltd | Structure of lead frame with semiconductor device attached |
-
1977
- 1977-12-23 JP JP15444577A patent/JPS5487181A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60101954A (en) * | 1983-11-08 | 1985-06-06 | Seikosha Co Ltd | Ic package and manufacture thereof |
| JPH03254135A (en) * | 1990-03-05 | 1991-11-13 | Sankyo Seiki Mfg Co Ltd | Structure of lead frame with semiconductor device attached |
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