JPS5468752A - Conductive material of substrate for holding electronic parts - Google Patents
Conductive material of substrate for holding electronic partsInfo
- Publication number
- JPS5468752A JPS5468752A JP13562477A JP13562477A JPS5468752A JP S5468752 A JPS5468752 A JP S5468752A JP 13562477 A JP13562477 A JP 13562477A JP 13562477 A JP13562477 A JP 13562477A JP S5468752 A JPS5468752 A JP S5468752A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- filler
- metal
- substrate
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract 5
- 239000004020 conductor Substances 0.000 title abstract 3
- 239000010970 precious metal Substances 0.000 abstract 4
- 229910052782 aluminium Inorganic materials 0.000 abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000005219 brazing Methods 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000000945 filler Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
PURPOSE: To titled material which can improve the reliability of electronic parts being held in the substrate, because of the small contact resistance of tis contact parts; the titled material is prepared by welding the precious metal to the surface of aluminum substrate interposing the aluminum-brazing-filler-metal-layer.
CONSTITUTION: The aluminum-brazing-filler-metal-layer 2, including Al, Sn, Zn, Pb, Cu, etc., is prepared on the surface on the aluminum substrate 3. A precious metal sheet of gold, silver, etc., is hot pressed tight on the surface of this brazing-filler-metal-layer at a temperature, 200°C for instance, somewhat lower than the melting point of the brazing filler metal; hereby, the precious metal sheet is well joined to the surface of the brazing-filler-metal layer 2. The surface of thus prepared conductive material 6 for holding electronic parts is covered by the precious metal layer 1, so that the contact portion between this conductive material 6 and other conductive body or support, etc., is low and is maintained constant over a period of long hours. Accordingly, the reliability of electronic equipment held by the substrate through the support is improved, and its life is also extended.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13562477A JPS5468752A (en) | 1977-11-14 | 1977-11-14 | Conductive material of substrate for holding electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13562477A JPS5468752A (en) | 1977-11-14 | 1977-11-14 | Conductive material of substrate for holding electronic parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5468752A true JPS5468752A (en) | 1979-06-02 |
Family
ID=15156148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13562477A Pending JPS5468752A (en) | 1977-11-14 | 1977-11-14 | Conductive material of substrate for holding electronic parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5468752A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005034166A1 (en) * | 2003-10-01 | 2005-04-14 | Matsushita Electric Industrial Co., Ltd. | Lighting inspection device for display panel and display panel producing method |
| JP2005129516A (en) * | 2003-10-01 | 2005-05-19 | Matsushita Electric Ind Co Ltd | Lighting inspection device for display panel, and manufacturing method of display panel |
-
1977
- 1977-11-14 JP JP13562477A patent/JPS5468752A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005034166A1 (en) * | 2003-10-01 | 2005-04-14 | Matsushita Electric Industrial Co., Ltd. | Lighting inspection device for display panel and display panel producing method |
| JP2005129516A (en) * | 2003-10-01 | 2005-05-19 | Matsushita Electric Ind Co Ltd | Lighting inspection device for display panel, and manufacturing method of display panel |
| US7355434B2 (en) | 2003-10-01 | 2008-04-08 | Matsushita Electric Industrial Co., Ltd. | Lighting inspection device for plasma display panel and display panel producing method |
| JP4665474B2 (en) * | 2003-10-01 | 2011-04-06 | パナソニック株式会社 | Display panel lighting inspection device and display panel manufacturing method |
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