JPS5633881A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5633881A JPS5633881A JP10915579A JP10915579A JPS5633881A JP S5633881 A JPS5633881 A JP S5633881A JP 10915579 A JP10915579 A JP 10915579A JP 10915579 A JP10915579 A JP 10915579A JP S5633881 A JPS5633881 A JP S5633881A
- Authority
- JP
- Japan
- Prior art keywords
- type
- layer
- saurce
- policrystalline
- side direction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
Landscapes
- Electrodes Of Semiconductors (AREA)
Abstract
PURPOSE:To readily obtain a high gm element by a method wherein an N type decisive impurity is diffused partially from the side direction against a policrystalline silicon layer forming a gate electrode too, and channel length is shortened practically as large as the diffused depth from the side direction. CONSTITUTION:After an N<-> type layer 2 for channel is formd on a P type silicon substrate 1, a thick field SiO2 film 3 is formed to enclose an FET arranged portion. Then, the policrystalline silicon layer 5 and Si3N4 layer 6 are sequently formed after the SiO2 film 4 is formed on the N<-> type layer 2. Next thereto, the hold drilling to reach the N<-> type layer 2 is made at the saurce and the drain forming portion. In the following, while the saurce region 7 and the drain region 8 are formed, the N type decisive impurity is diffused to the policrystalline silicone layer 5 from the side direction to convert the saurce adjacent portion and the drain adjacent portion in the policrystalline silicon layer 5 to the N<+> type region 9a and 9b.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10915579A JPS5633881A (en) | 1979-08-29 | 1979-08-29 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10915579A JPS5633881A (en) | 1979-08-29 | 1979-08-29 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5633881A true JPS5633881A (en) | 1981-04-04 |
Family
ID=14503021
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10915579A Pending JPS5633881A (en) | 1979-08-29 | 1979-08-29 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5633881A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6132462A (en) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | Manufacturing method of semiconductor device |
JPS62162360A (en) * | 1986-01-13 | 1987-07-18 | Hitachi Ltd | Manufacturing method of semiconductor device |
JPS6442854A (en) * | 1987-08-10 | 1989-02-15 | Toshiba Corp | Manufacture of semiconductor device |
US4811066A (en) * | 1987-10-19 | 1989-03-07 | Motorola, Inc. | Compact multi-state ROM cell |
US5510648A (en) * | 1994-01-04 | 1996-04-23 | Motorola, Inc. | Insulated gate semiconductor device and method of fabricating |
US5541132A (en) * | 1995-03-21 | 1996-07-30 | Motorola, Inc. | Insulated gate semiconductor device and method of manufacture |
US5612244A (en) * | 1995-03-21 | 1997-03-18 | Motorola, Inc. | Insulated gate semiconductor device having a cavity under a portion of a gate structure and method of manufacture |
US5661048A (en) * | 1995-03-21 | 1997-08-26 | Motorola, Inc. | Method of making an insulated gate semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5122348A (en) * | 1974-08-20 | 1976-02-23 | Hitachi Ltd | JOHOSHORISOCHI |
JPS52123879A (en) * | 1976-04-09 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Mos type semiconductor device and its production |
-
1979
- 1979-08-29 JP JP10915579A patent/JPS5633881A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5122348A (en) * | 1974-08-20 | 1976-02-23 | Hitachi Ltd | JOHOSHORISOCHI |
JPS52123879A (en) * | 1976-04-09 | 1977-10-18 | Matsushita Electric Ind Co Ltd | Mos type semiconductor device and its production |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6132462A (en) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | Manufacturing method of semiconductor device |
JPS62162360A (en) * | 1986-01-13 | 1987-07-18 | Hitachi Ltd | Manufacturing method of semiconductor device |
JPS6442854A (en) * | 1987-08-10 | 1989-02-15 | Toshiba Corp | Manufacture of semiconductor device |
US4811066A (en) * | 1987-10-19 | 1989-03-07 | Motorola, Inc. | Compact multi-state ROM cell |
US5510648A (en) * | 1994-01-04 | 1996-04-23 | Motorola, Inc. | Insulated gate semiconductor device and method of fabricating |
US5541132A (en) * | 1995-03-21 | 1996-07-30 | Motorola, Inc. | Insulated gate semiconductor device and method of manufacture |
US5612244A (en) * | 1995-03-21 | 1997-03-18 | Motorola, Inc. | Insulated gate semiconductor device having a cavity under a portion of a gate structure and method of manufacture |
US5661048A (en) * | 1995-03-21 | 1997-08-26 | Motorola, Inc. | Method of making an insulated gate semiconductor device |
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