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JPS5618448A - Composite electronic part - Google Patents

Composite electronic part

Info

Publication number
JPS5618448A
JPS5618448A JP9322879A JP9322879A JPS5618448A JP S5618448 A JPS5618448 A JP S5618448A JP 9322879 A JP9322879 A JP 9322879A JP 9322879 A JP9322879 A JP 9322879A JP S5618448 A JPS5618448 A JP S5618448A
Authority
JP
Japan
Prior art keywords
printed circuit
electrodes
soldered
composite electronic
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9322879A
Other languages
Japanese (ja)
Inventor
Shoichi Muramoto
Toshifumi Nakamura
Saburo Osawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP9322879A priority Critical patent/JPS5618448A/en
Publication of JPS5618448A publication Critical patent/JPS5618448A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To prevent improper insulation between electrodes in a composite electronic part and to improve the reliability thereof by coating a protective coating layer on a wiring substrate excluding a soldered part of a printed circuit element and a printed circuit pattern and connecting lead terminals and the part with solder. CONSTITUTION:A printed circuit element 12 and a printed circuit pattern 13 are formed on a printed circuit board 11, and a protective coating layer 21 of glass or epoxy or the like is coated on the part excluding soldered part of a terminal electrode 17 or the like for mounting electronic parts 14 and clip-type lead terminal 16. The electronic part 14 and the lead terminal 16 are soldered to the terminal electrodes 15, 17, respectively. In this manner, it prevents improper insulation between the electrodes by the protective film and improves the reliability of the composite electronic parts.
JP9322879A 1979-07-24 1979-07-24 Composite electronic part Pending JPS5618448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9322879A JPS5618448A (en) 1979-07-24 1979-07-24 Composite electronic part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9322879A JPS5618448A (en) 1979-07-24 1979-07-24 Composite electronic part

Publications (1)

Publication Number Publication Date
JPS5618448A true JPS5618448A (en) 1981-02-21

Family

ID=14076675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9322879A Pending JPS5618448A (en) 1979-07-24 1979-07-24 Composite electronic part

Country Status (1)

Country Link
JP (1) JPS5618448A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127675U (en) * 1982-02-19 1983-08-30 株式会社山武 Printed board
JPS5923775U (en) * 1982-08-06 1984-02-14 株式会社和光産業 Lead terminal strip for circuit board
JPS5970353U (en) * 1982-11-01 1984-05-12 アイワ株式会社 Flat package IC for solder immersion
JPS60202958A (en) * 1984-03-28 1985-10-14 Nec Corp Hybrid integrated circuit device
JPS6127664A (en) * 1984-07-18 1986-02-07 Wako Sangyo:Kk Installation of lead terminal
JPS61182045U (en) * 1985-05-07 1986-11-13
JPS6369292A (en) * 1986-09-10 1988-03-29 松下電器産業株式会社 Thick film substrate for hybrid integrated circuit
JPS6436098A (en) * 1987-07-31 1989-02-07 Hitachi Chemical Co Ltd Wiring board
JPH0341810A (en) * 1989-07-07 1991-02-22 Murata Mfg Co Ltd Lc filter

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58127675U (en) * 1982-02-19 1983-08-30 株式会社山武 Printed board
JPS5923775U (en) * 1982-08-06 1984-02-14 株式会社和光産業 Lead terminal strip for circuit board
JPS5970353U (en) * 1982-11-01 1984-05-12 アイワ株式会社 Flat package IC for solder immersion
JPS60202958A (en) * 1984-03-28 1985-10-14 Nec Corp Hybrid integrated circuit device
JPS6127664A (en) * 1984-07-18 1986-02-07 Wako Sangyo:Kk Installation of lead terminal
JPH0470777B2 (en) * 1984-07-18 1992-11-11 Wako Sangyo Kk
JPS61182045U (en) * 1985-05-07 1986-11-13
JPH0331085Y2 (en) * 1985-05-07 1991-07-01
JPS6369292A (en) * 1986-09-10 1988-03-29 松下電器産業株式会社 Thick film substrate for hybrid integrated circuit
JPS6436098A (en) * 1987-07-31 1989-02-07 Hitachi Chemical Co Ltd Wiring board
JPH0341810A (en) * 1989-07-07 1991-02-22 Murata Mfg Co Ltd Lc filter

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