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JPS6436098A - Wiring board - Google Patents

Wiring board

Info

Publication number
JPS6436098A
JPS6436098A JP19280687A JP19280687A JPS6436098A JP S6436098 A JPS6436098 A JP S6436098A JP 19280687 A JP19280687 A JP 19280687A JP 19280687 A JP19280687 A JP 19280687A JP S6436098 A JPS6436098 A JP S6436098A
Authority
JP
Japan
Prior art keywords
coating layer
thermal expansion
expansion coefficient
shape
low thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19280687A
Other languages
Japanese (ja)
Other versions
JP2576138B2 (en
Inventor
Yoshiyuki Tsuru
Hiroshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP62192806A priority Critical patent/JP2576138B2/en
Publication of JPS6436098A publication Critical patent/JPS6436098A/en
Application granted granted Critical
Publication of JP2576138B2 publication Critical patent/JP2576138B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To reduce the quantity of deformed strain in the direction of the surface in thermal expansion between terminals by forming the coating layer of a low thermal expansion coefficient material considering a part shape and the connecting terminals and the shape of the arrangement of the terminals around the connecting terminals. CONSTITUTION:A coating layer 3 consisting of a low thermal expansion coefficient material is shaped around part connecting terminals 2 with the exception of terminal sections required for the soldered joint of a part. The thickness and shape of the coating layer are determined by the thermal expansion coefficient of a substrate used, the thermal expansion coefficient of the material of the coating layer and connection reliability required. The shape of the low thermal expansion coefficient coating layer is formed by cutting a resin- impregnated prepreg to a desired shape and heating and contact-bonding the cut prepreg when the prepreg is employed. A section needing no coating layer is coated previously with a removable resist in a flame coating method or a vapor growth method, the coating layer of the low thermal expansion coefficient material is shaped, and the unnecessary coating layer is taken off together with the resist.
JP62192806A 1987-07-31 1987-07-31 Wiring board Expired - Lifetime JP2576138B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62192806A JP2576138B2 (en) 1987-07-31 1987-07-31 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62192806A JP2576138B2 (en) 1987-07-31 1987-07-31 Wiring board

Publications (2)

Publication Number Publication Date
JPS6436098A true JPS6436098A (en) 1989-02-07
JP2576138B2 JP2576138B2 (en) 1997-01-29

Family

ID=16297300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62192806A Expired - Lifetime JP2576138B2 (en) 1987-07-31 1987-07-31 Wiring board

Country Status (1)

Country Link
JP (1) JP2576138B2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618448A (en) * 1979-07-24 1981-02-21 Sony Corp Composite electronic part

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5618448A (en) * 1979-07-24 1981-02-21 Sony Corp Composite electronic part

Also Published As

Publication number Publication date
JP2576138B2 (en) 1997-01-29

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