JPS6469095A - Electronic circuit module board - Google Patents
Electronic circuit module boardInfo
- Publication number
- JPS6469095A JPS6469095A JP22684887A JP22684887A JPS6469095A JP S6469095 A JPS6469095 A JP S6469095A JP 22684887 A JP22684887 A JP 22684887A JP 22684887 A JP22684887 A JP 22684887A JP S6469095 A JPS6469095 A JP S6469095A
- Authority
- JP
- Japan
- Prior art keywords
- electronic parts
- resin
- board
- thickness
- module board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 abstract 5
- 229920005989 resin Polymers 0.000 abstract 5
- 239000010408 film Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
PURPOSE:To make a module board thin, and improve the reliability of humidity resistance, by using a structure wherein mounting electronic parts are sealed in a main body of resin board. CONSTITUTION:The structure of a board is as follows; on one side of an insulating film 7, a wiring pattern is formed, and thereon electronic parts are mounted. In a state where external leads 4 or electrode terminals 5 of the electronic parts 3 are joined to the wiring by using solder 6, the electronic parts 3 are sealed with resin 8. In this structure, the resin 8 is constituted in the manner in which the distance between a resin surface 9 and the insulating thin film 7 becomes constant, that is, the thickness of an electronic circuit module becomes constant. By using a structure like this, the thickness of module board can be reduce by the amount approximate to the thickness of electronic parts, and by the effect of resin sealing, the reliability of humidity resistance of electronic parts can be remarkably improved.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22684887A JPS6469095A (en) | 1987-09-10 | 1987-09-10 | Electronic circuit module board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22684887A JPS6469095A (en) | 1987-09-10 | 1987-09-10 | Electronic circuit module board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6469095A true JPS6469095A (en) | 1989-03-15 |
Family
ID=16851511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22684887A Pending JPS6469095A (en) | 1987-09-10 | 1987-09-10 | Electronic circuit module board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6469095A (en) |
-
1987
- 1987-09-10 JP JP22684887A patent/JPS6469095A/en active Pending
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