JPS61182045U - - Google Patents
Info
- Publication number
- JPS61182045U JPS61182045U JP6647685U JP6647685U JPS61182045U JP S61182045 U JPS61182045 U JP S61182045U JP 6647685 U JP6647685 U JP 6647685U JP 6647685 U JP6647685 U JP 6647685U JP S61182045 U JPS61182045 U JP S61182045U
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- metal substrate
- solder
- conductor terminal
- clamped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000010953 base metal Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案のクリツプタイプリードピンを
金属基板に接合した実施例の構造を示す断面図。
第２図は斜視図である。第３図は従来の金属基板
へのリードピン接合構造を示す断面図。
１……ベース金属板、２……絶縁層、３……導
体端子部、４……リードピン、５……ハンダ、６
……絶縁部分、７……非絶縁リードピン部。
FIG. 1 is a sectional view showing the structure of an embodiment in which the clip-type lead pin of the present invention is bonded to a metal substrate.
FIG. 2 is a perspective view. FIG. 3 is a sectional view showing a conventional lead pin bonding structure to a metal substrate. DESCRIPTION OF SYMBOLS 1... Base metal plate, 2... Insulating layer, 3... Conductor terminal part, 4... Lead pin, 5... Solder, 6
...Insulated part, 7...Non-insulated lead pin part.
Claims (1)
基板に挾着させ、該リードピンと導体端子部をハ
ンダにて固着させたことを特徴とするリードピン
接合構造。 A lead pin joining structure characterized in that a lead pin partially covered with an insulating material is clamped to a metal substrate, and the lead pin and a conductor terminal portion are fixed with solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066476U JPH0331085Y2 (en) | 1985-05-07 | 1985-05-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985066476U JPH0331085Y2 (en) | 1985-05-07 | 1985-05-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61182045U true JPS61182045U (en) | 1986-11-13 |
| JPH0331085Y2 JPH0331085Y2 (en) | 1991-07-01 |
Family
ID=30599417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985066476U Expired JPH0331085Y2 (en) | 1985-05-07 | 1985-05-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0331085Y2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51141356U (en) * | 1975-05-09 | 1976-11-13 | ||
| JPS5488666U (en) * | 1977-12-07 | 1979-06-22 | ||
| JPS5618448A (en) * | 1979-07-24 | 1981-02-21 | Sony Corp | Composite electronic part |
| JPS5794959U (en) * | 1980-12-02 | 1982-06-11 |
-
1985
- 1985-05-07 JP JP1985066476U patent/JPH0331085Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51141356U (en) * | 1975-05-09 | 1976-11-13 | ||
| JPS5488666U (en) * | 1977-12-07 | 1979-06-22 | ||
| JPS5618448A (en) * | 1979-07-24 | 1981-02-21 | Sony Corp | Composite electronic part |
| JPS5794959U (en) * | 1980-12-02 | 1982-06-11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0331085Y2 (en) | 1991-07-01 |