[go: up one dir, main page]

JPS5563854A - Method of manufacturing semiconductor device - Google Patents

Method of manufacturing semiconductor device

Info

Publication number
JPS5563854A
JPS5563854A JP13749878A JP13749878A JPS5563854A JP S5563854 A JPS5563854 A JP S5563854A JP 13749878 A JP13749878 A JP 13749878A JP 13749878 A JP13749878 A JP 13749878A JP S5563854 A JPS5563854 A JP S5563854A
Authority
JP
Japan
Prior art keywords
semiconductor device
leads
lead frame
outer lead
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13749878A
Other languages
Japanese (ja)
Other versions
JPS6352463B2 (en
Inventor
Ryuichi Imazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP13749878A priority Critical patent/JPS5563854A/en
Publication of JPS5563854A publication Critical patent/JPS5563854A/en
Publication of JPS6352463B2 publication Critical patent/JPS6352463B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE: To prevent leads from being bent during inspection, by cutting off the coupled portions of an outer lead frame and tie bars which connects the leads to each other, as the outer lead frame remains mounted and by fixing a semiconductor device and inspecting it.
CONSTITUTION: Tie bars are cut off and their tips are also cut off as an outer lead frame 13 remains mounted. A semiconductor device is then fixed. The semiconductor device is positioned on the top of a measuring socket 17. A lead hold-down block 16 is moved down to hold leads down into contact with the socket 17 to inspect the semiconductor device. If the device is regarded as all right, the leads are bent and the outer lead frame is cut off to supply the semiconductor device as a product. Because inspection steps are effected as the outer lead frame remains mounted, ambient forces do not directly act on the leads. Therefore, the leads are prevented from being bent.
COPYRIGHT: (C)1980,JPO&Japio
JP13749878A 1978-11-08 1978-11-08 Method of manufacturing semiconductor device Granted JPS5563854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13749878A JPS5563854A (en) 1978-11-08 1978-11-08 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13749878A JPS5563854A (en) 1978-11-08 1978-11-08 Method of manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
JPS5563854A true JPS5563854A (en) 1980-05-14
JPS6352463B2 JPS6352463B2 (en) 1988-10-19

Family

ID=15200056

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13749878A Granted JPS5563854A (en) 1978-11-08 1978-11-08 Method of manufacturing semiconductor device

Country Status (1)

Country Link
JP (1) JPS5563854A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPH0529427A (en) * 1991-07-24 1993-02-05 Nec Corp Method for manufacturing semiconductor device
JPH0582617A (en) * 1991-09-18 1993-04-02 Sharp Corp Semiconductor element manufacturing equipment

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7157314B2 (en) 1998-11-16 2007-01-02 Sandisk Corporation Vertically stacked field programmable nonvolatile memory and method of fabrication
US6888750B2 (en) 2000-04-28 2005-05-03 Matrix Semiconductor, Inc. Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
EP2988331B1 (en) 2000-08-14 2019-01-09 SanDisk Technologies LLC Semiconductor memory device
US6897514B2 (en) 2001-03-28 2005-05-24 Matrix Semiconductor, Inc. Two mask floating gate EEPROM and method of making
US6841813B2 (en) 2001-08-13 2005-01-11 Matrix Semiconductor, Inc. TFT mask ROM and method for making same
US6731011B2 (en) 2002-02-19 2004-05-04 Matrix Semiconductor, Inc. Memory module having interconnected and stacked integrated circuits
US6853049B2 (en) 2002-03-13 2005-02-08 Matrix Semiconductor, Inc. Silicide-silicon oxide-semiconductor antifuse device and method of making
US6737675B2 (en) 2002-06-27 2004-05-18 Matrix Semiconductor, Inc. High density 3D rail stack arrays
JP7177981B2 (en) 2018-10-25 2022-11-25 マツダ株式会社 Virtual currency management device and virtual currency management method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259573A (en) * 1975-11-11 1977-05-17 Mitsubishi Electric Corp Production of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5259573A (en) * 1975-11-11 1977-05-17 Mitsubishi Electric Corp Production of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57188858A (en) * 1981-05-18 1982-11-19 Matsushita Electronics Corp Plastic molded type semiconductor device
JPH0529427A (en) * 1991-07-24 1993-02-05 Nec Corp Method for manufacturing semiconductor device
JPH0582617A (en) * 1991-09-18 1993-04-02 Sharp Corp Semiconductor element manufacturing equipment

Also Published As

Publication number Publication date
JPS6352463B2 (en) 1988-10-19

Similar Documents

Publication Publication Date Title
JPS5563854A (en) Method of manufacturing semiconductor device
JPS51131274A (en) Tip bonding method
JPS52149070A (en) Locating and inspecting method for semiconductor parts and die bonding device using the same
JPS526465A (en) Manufacturing method of semi-conductor pellet slices for integrated ci rcuit
JPS544078A (en) Inspection method of performance of circuit element
JPS5427772A (en) Production of semiconductor devices
JPS53108368A (en) Manufacture for resin seal type semiconductor device and its lead frame for its manufacture
JPS52132777A (en) Ic pin number display method
JPS5441665A (en) Manufacture for semiconductor device
JPS5571034A (en) Measuring method for resistance distribution of compound semiconductor single crystal
JPS51151390A (en) Process for preparing long chain alpha-oxycarboxylic acids
JPS53137054A (en) Testing method of soldering
JPS5439576A (en) Inspection method for semiconductor device
JPS52104286A (en) Eddy current inspection method
JPS5318972A (en) Monitoring method of wafer positioning state by probes
JPS51137382A (en) Measuring method for junction point within semi conductor wafer
JPS5286376A (en) Method of contact inspection for electric parts or like
JPS54128677A (en) Manufacture for semiconductor device
JPS5593072A (en) Plug tester
JPS5294073A (en) Leading-in frame and process for preparing it
JPS51140638A (en) Positioning method
JPS548473A (en) Inspection method for semiconductor device
JPS52116063A (en) Inspection method for electron tube oxide cathode
JPS5344180A (en) Semiconductor inspecting method
JPS5389676A (en) Extracting method for non-defective or defective semiconductor pelletsbased on memory means