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JPS5571034A - Measuring method for resistance distribution of compound semiconductor single crystal - Google Patents

Measuring method for resistance distribution of compound semiconductor single crystal

Info

Publication number
JPS5571034A
JPS5571034A JP14459878A JP14459878A JPS5571034A JP S5571034 A JPS5571034 A JP S5571034A JP 14459878 A JP14459878 A JP 14459878A JP 14459878 A JP14459878 A JP 14459878A JP S5571034 A JPS5571034 A JP S5571034A
Authority
JP
Japan
Prior art keywords
probes
wafer
compound semiconductor
single crystal
contacted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14459878A
Other languages
Japanese (ja)
Inventor
Kazutaka Terajima
Shoichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP14459878A priority Critical patent/JPS5571034A/en
Publication of JPS5571034A publication Critical patent/JPS5571034A/en
Pending legal-status Critical Current

Links

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  • Measurement Of Resistance Or Impedance (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To effect measurement simple and high in reliability on a compound semiconductor single srystal for resistance distribution by a method whrerin said single crystal wafer is soaked in a coolant, at least two pieces of probes are contacted with the wafer surface at given intervals under a constant pressure, and then current is carried between the probes.
CONSTITUTION: A compound semiconductor single crystal wafer 14 is soaked in a coolant 15. Next, at least two pieces of probes 19a, 19b are contacted with the surface of the wafer 14 at given intervals under a constant pressure. Then, a current is carried between lead wires 20a, 20b from an external supply to measure resistance between portion of the wafer 14 with which the probes 19a, 19b are contacted. After the first measurment for resistance is over, the probes 19a, 19b are moved upward by operating a slide shaft 23 to slide to a given spot, they are again contacted with the wafer 14 to a measurement of resistance values as described above.
COPYRIGHT: (C)1980,JPO&Japio
JP14459878A 1978-11-22 1978-11-22 Measuring method for resistance distribution of compound semiconductor single crystal Pending JPS5571034A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14459878A JPS5571034A (en) 1978-11-22 1978-11-22 Measuring method for resistance distribution of compound semiconductor single crystal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14459878A JPS5571034A (en) 1978-11-22 1978-11-22 Measuring method for resistance distribution of compound semiconductor single crystal

Publications (1)

Publication Number Publication Date
JPS5571034A true JPS5571034A (en) 1980-05-28

Family

ID=15365765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14459878A Pending JPS5571034A (en) 1978-11-22 1978-11-22 Measuring method for resistance distribution of compound semiconductor single crystal

Country Status (1)

Country Link
JP (1) JPS5571034A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141865U (en) * 1982-03-19 1983-09-24 富士通株式会社 Resistance measuring device for conductive paint film
CN102156222A (en) * 2011-04-01 2011-08-17 宁波大学 Stress resistance effect measuring method for material in high strain rate state
CN104251935A (en) * 2013-06-26 2014-12-31 中芯国际集成电路制造(上海)有限公司 Apparatus and method for measuring resistivity of wafers
CN111103525A (en) * 2019-12-26 2020-05-05 奥士康科技股份有限公司 Method for quickly finding point of abnormal resistance value of carbon wire

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141865U (en) * 1982-03-19 1983-09-24 富士通株式会社 Resistance measuring device for conductive paint film
CN102156222A (en) * 2011-04-01 2011-08-17 宁波大学 Stress resistance effect measuring method for material in high strain rate state
CN104251935A (en) * 2013-06-26 2014-12-31 中芯国际集成电路制造(上海)有限公司 Apparatus and method for measuring resistivity of wafers
CN111103525A (en) * 2019-12-26 2020-05-05 奥士康科技股份有限公司 Method for quickly finding point of abnormal resistance value of carbon wire

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