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JPS5536975A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS5536975A
JPS5536975A JP11015278A JP11015278A JPS5536975A JP S5536975 A JPS5536975 A JP S5536975A JP 11015278 A JP11015278 A JP 11015278A JP 11015278 A JP11015278 A JP 11015278A JP S5536975 A JPS5536975 A JP S5536975A
Authority
JP
Japan
Prior art keywords
resin
lead
sealed
exposed outwardly
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11015278A
Other languages
Japanese (ja)
Other versions
JPS5939900B2 (en
Inventor
Shigeru Tanaka
Tsukasa Sawaki
Norio Koutou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP11015278A priority Critical patent/JPS5939900B2/en
Publication of JPS5536975A publication Critical patent/JPS5536975A/en
Publication of JPS5939900B2 publication Critical patent/JPS5939900B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve adhesive connection between sealing resin and lead by provid ing curable phenol resin layer on resin sealing surface of a lead for taking out, of which one end is positioned adjacent to resin semiconductor element and other end is exposed outwardly. CONSTITUTION:The end of a lead 1 for taking out is faced to the near by both ends of a semiconductor element 2 to be sealed and the element 2 and the lead 1 are connected by fine metal wire 3. Then, the part exposed outwardly from the lead 1 is folded and molded as enveloping the part to be resin sealed, the element 2 and the wire 3 with the resin 4. At this time, a curable phenol resin layer 7 is disposed on the part which is buried in the resin 4 of the lead 1 and the part 6 which is to be left without sealing and positioned near to the outside. Then after, the part exposed outwardly is sealed with the resins 4 which consists of the novolak type phenolic resins and molding compounds including epoxy resins as hardener. Thus, penetration of the water is completly protected and dampproof is improved.
JP11015278A 1978-09-06 1978-09-06 Resin-encapsulated semiconductor device Expired JPS5939900B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11015278A JPS5939900B2 (en) 1978-09-06 1978-09-06 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11015278A JPS5939900B2 (en) 1978-09-06 1978-09-06 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS5536975A true JPS5536975A (en) 1980-03-14
JPS5939900B2 JPS5939900B2 (en) 1984-09-27

Family

ID=14528362

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11015278A Expired JPS5939900B2 (en) 1978-09-06 1978-09-06 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS5939900B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103975A (en) * 1973-02-02 1974-10-02
JPH01261853A (en) * 1988-04-13 1989-10-18 Tomoegawa Paper Co Ltd Semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49103975A (en) * 1973-02-02 1974-10-02
JPH01261853A (en) * 1988-04-13 1989-10-18 Tomoegawa Paper Co Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5939900B2 (en) 1984-09-27

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