JPS5612786A - Photo coupling semiconductor device - Google Patents
Photo coupling semiconductor deviceInfo
- Publication number
- JPS5612786A JPS5612786A JP8741479A JP8741479A JPS5612786A JP S5612786 A JPS5612786 A JP S5612786A JP 8741479 A JP8741479 A JP 8741479A JP 8741479 A JP8741479 A JP 8741479A JP S5612786 A JPS5612786 A JP S5612786A
- Authority
- JP
- Japan
- Prior art keywords
- titanium oxide
- liquid paraffin
- thermosetting resin
- improve
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
PURPOSE:To improve light reflection factor and to improve dampproof and dielectric strength by collectively adding and distributing titanium oxide and liquid paraffin to a mold resin layer. CONSTITUTION:A light emitting element 1 and a light sensitive element 2 are provided on electrode lead wires 3a and 3b respectively and a transparent resin 4 is filled between the elements 1 and 2. Furthermore, the whole is molded by a thermosetting resin constituent 5. The thermosetting resin constituent 5 is composed of the following as essential component: -Epoxy compound containing at least one piece of epoxy radical in a molecule. -At least, one kind of either compound selected from the groups of phenol novolak resin and organic acid anhydride. -Hardening accelerator, inorganic filler, titanium oxide and liquid paraffin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8741479A JPS5612786A (en) | 1979-07-12 | 1979-07-12 | Photo coupling semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8741479A JPS5612786A (en) | 1979-07-12 | 1979-07-12 | Photo coupling semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5612786A true JPS5612786A (en) | 1981-02-07 |
JPS6331115B2 JPS6331115B2 (en) | 1988-06-22 |
Family
ID=13914210
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8741479A Granted JPS5612786A (en) | 1979-07-12 | 1979-07-12 | Photo coupling semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5612786A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008073682A1 (en) * | 2006-12-07 | 2008-06-19 | 3M Innovative Properties Company | Light reflecting resin composition, light emitting apparatus and optical display apparatus |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6133004B2 (en) * | 2009-03-31 | 2017-05-24 | 日立化成株式会社 | Thermosetting resin composition for light reflection, substrate for mounting optical semiconductor element, method for manufacturing the same, and optical semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5129939A (en) * | 1974-05-24 | 1976-03-13 | Texas Instruments Inc | |
JPS5480691A (en) * | 1977-12-12 | 1979-06-27 | Toshiba Corp | Photo coupling semiconductor device |
-
1979
- 1979-07-12 JP JP8741479A patent/JPS5612786A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5129939A (en) * | 1974-05-24 | 1976-03-13 | Texas Instruments Inc | |
JPS5480691A (en) * | 1977-12-12 | 1979-06-27 | Toshiba Corp | Photo coupling semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008073682A1 (en) * | 2006-12-07 | 2008-06-19 | 3M Innovative Properties Company | Light reflecting resin composition, light emitting apparatus and optical display apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS6331115B2 (en) | 1988-06-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4822536A (en) | Method of encapsulating an electronic component with a synthetic resin | |
GB2089126B (en) | Semiconductor device and process for producing the same | |
DE3381269D1 (en) | SEMICONDUCTOR ARRANGEMENT WITH A HOUSING SEALED BY A LOW WITH A LOW MELTING POINT. | |
JPS5612786A (en) | Photo coupling semiconductor device | |
DE3881313D1 (en) | RADIATION-RESISTANT RESIN COMPOSITION WITH A SEMI-ESTERIFIED EPOXY RESIN AS A COMPONENT. | |
JPS5721844A (en) | Resin composition for sealing electronic parts | |
JPS52135673A (en) | Resin composition for semiconductor sealing | |
JPS55157278A (en) | Photo coupling device | |
JPS5390400A (en) | Powdery epoxy resin composition | |
JPS5617025A (en) | Semiconductor device | |
JPS55108786A (en) | Luminous diode | |
JPS52135282A (en) | Semiconductor light emitting device | |
JPS55110082A (en) | Semiconductor light emitting device | |
JPS5536975A (en) | Resin sealed type semiconductor device | |
JPS555929A (en) | Semiconductor sealing epoxy resin composition | |
JPS5771154A (en) | Semiconductor device | |
JPS5717187A (en) | Manufacture of semiconductor device for detecting light | |
JPS60103650A (en) | Light emitting diode | |
JPS56148852A (en) | Semiconductor device | |
JPH0462188B2 (en) | ||
JPS52140543A (en) | Method for bonding ropes made of kevlar-reinforced plastics | |
JPS54150992A (en) | Photo-coupled semiconductor device | |
JPS58105589U (en) | Multicolor EL light emitting device | |
JPS5319400A (en) | Bituminous epoxy resin compositions | |
JPS57194559A (en) | Semicondcutor device |