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JPS55120183A - Color solid image pickup element board and method of fabricating the same - Google Patents

Color solid image pickup element board and method of fabricating the same

Info

Publication number
JPS55120183A
JPS55120183A JP2792379A JP2792379A JPS55120183A JP S55120183 A JPS55120183 A JP S55120183A JP 2792379 A JP2792379 A JP 2792379A JP 2792379 A JP2792379 A JP 2792379A JP S55120183 A JPS55120183 A JP S55120183A
Authority
JP
Japan
Prior art keywords
film
image pickup
pickup element
reduce
solid image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2792379A
Other languages
Japanese (ja)
Inventor
Akira Okazaki
Norihiko Tsukui
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP2792379A priority Critical patent/JPS55120183A/en
Publication of JPS55120183A publication Critical patent/JPS55120183A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/30—Coatings
    • H10F77/306—Coatings for devices having potential barriers
    • H10F77/331—Coatings for devices having potential barriers for filtering or shielding light, e.g. multicolour filters for photodetectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/107—Integrated devices having multiple elements covered by H10F30/00 in a repetitive configuration, e.g. radiation detectors comprising photodiode arrays

Landscapes

  • Solid State Image Pick-Up Elements (AREA)

Abstract

PURPOSE:To reduce the size and weight of a color solid image pickup element and reduce the cost of the element by forming a color separation filter directly through an intermediate transparent film on a passivation film having rugged surface formed on the surface including the light receiving portion of the element. CONSTITUTION:The first and the second polycrystalline silicon electrodes 23, 24 for transferring charge are formed through an SiO2 insulating film 22 on a p-type silicon substrate 21, and a passivation film 25 made of phosphosilicate glass, borosilicate glass, aluminosilicate glass, silicon nitride film or the like is coated on the entire surface thereof. Since further expanded rugged surface is produced due to the existence of the electrodes 22, 23 at this time, an intermediate film 27 made of transparent organic material is coated to smoothen the surface thereon. After the surface is thus smoothened, a color separating filter 26 is formed on the entire surface. Thus, it can simplify not only the image pickup element but the peripheral circuit thereof so as to reduce the size and weight of the element remarkably.
JP2792379A 1979-03-09 1979-03-09 Color solid image pickup element board and method of fabricating the same Pending JPS55120183A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2792379A JPS55120183A (en) 1979-03-09 1979-03-09 Color solid image pickup element board and method of fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2792379A JPS55120183A (en) 1979-03-09 1979-03-09 Color solid image pickup element board and method of fabricating the same

Publications (1)

Publication Number Publication Date
JPS55120183A true JPS55120183A (en) 1980-09-16

Family

ID=12234397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2792379A Pending JPS55120183A (en) 1979-03-09 1979-03-09 Color solid image pickup element board and method of fabricating the same

Country Status (1)

Country Link
JP (1) JPS55120183A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5687382A (en) * 1979-12-18 1981-07-15 Sony Corp Color image pickup element
JPS5812354A (en) * 1981-07-15 1983-01-24 Toshiba Corp Manufacturing method for color solid-state imaging device
JPS5834961A (en) * 1981-08-27 1983-03-01 Dainippon Printing Co Ltd Manufacture of color solid image pick up element plate
JPS5843571A (en) * 1981-09-08 1983-03-14 Toshiba Corp Color solid-state imaging device
FR2533371A1 (en) * 1982-09-21 1984-03-23 Thomson Csf INTEGRATED CIRCUIT GRID STRUCTURE COMPRISING GRID-INSULATION-SEMICONDUCTOR-TYPE ELEMENTS AND METHOD FOR PRODUCING AN INTEGRATED CIRCUIT USING SUCH A STRUCTURE
JPS60106167A (en) * 1983-11-14 1985-06-11 Mitsubishi Electric Corp Manufacturing method of color image sensor
JPS6132469A (en) * 1984-07-24 1986-02-15 Toppan Printing Co Ltd Color solid-state image pickup element
EP0263497A2 (en) * 1986-10-07 1988-04-13 Canon Kabushiki Kaisha Image reading device
JPH022675A (en) * 1988-06-15 1990-01-08 Nec Corp Solid-state image sensing element

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0132677B2 (en) * 1979-12-18 1989-07-10 Sony Corp
JPS5687382A (en) * 1979-12-18 1981-07-15 Sony Corp Color image pickup element
JPS5812354A (en) * 1981-07-15 1983-01-24 Toshiba Corp Manufacturing method for color solid-state imaging device
JPS5834961A (en) * 1981-08-27 1983-03-01 Dainippon Printing Co Ltd Manufacture of color solid image pick up element plate
JPS5843571A (en) * 1981-09-08 1983-03-14 Toshiba Corp Color solid-state imaging device
FR2533371A1 (en) * 1982-09-21 1984-03-23 Thomson Csf INTEGRATED CIRCUIT GRID STRUCTURE COMPRISING GRID-INSULATION-SEMICONDUCTOR-TYPE ELEMENTS AND METHOD FOR PRODUCING AN INTEGRATED CIRCUIT USING SUCH A STRUCTURE
JPS60106167A (en) * 1983-11-14 1985-06-11 Mitsubishi Electric Corp Manufacturing method of color image sensor
JPS6318341B2 (en) * 1983-11-14 1988-04-18 Mitsubishi Electric Corp
JPS6132469A (en) * 1984-07-24 1986-02-15 Toppan Printing Co Ltd Color solid-state image pickup element
JPH0224028B2 (en) * 1984-07-24 1990-05-28 Toppan Printing Co Ltd
EP0263497A2 (en) * 1986-10-07 1988-04-13 Canon Kabushiki Kaisha Image reading device
US4924282A (en) * 1986-10-07 1990-05-08 Canon Kabushiki Kaisha Image reading device with moisture resistant layer
JPH022675A (en) * 1988-06-15 1990-01-08 Nec Corp Solid-state image sensing element

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