JPH11150234A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce electric field over a field oxide film, to improve reliability, or to achieve a resistance element having a wider range of specification voltage. SOLUTION: Internal resistance elements 22 and 23 formed via a field oxide film 36 on the surface of a semiconductor substrate 31, the potential of a separation diffused layer 33 directly below the internal resistance elements 22 and 23 is brought near the potential of the internal resistance elements 22 and 23, thus achieving a high breakdown voltage of the resistance element which is formed on the surface of the semiconductor substrate 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device which can be used in a technical field in which a high-voltage circuit exceeding 100 V and a low-voltage circuit for signal processing of 10 V or less coexist.

[0002]

2. Description of the Related Art When a high voltage of about 200 V or more is divided by a resistance element and taken out as a reference voltage, the resistance element cannot be formed on a semiconductor substrate on which an integrated circuit is formed. Was done by the parts. Hereinafter, a conventional configuration will be described with reference to FIG. A broken line 61 is a semiconductor integrated circuit formed by a single semiconductor substrate. The semiconductor integrated circuit 61 has a 5V CMO
An S-inverter circuit, that is, an N-channel insulated gate field effect transistor (hereinafter referred to as NMOS) 12 and a P-channel between a high-potential power supply line 2 of V _DD = 5 V and a high-potential power supply line 4 of V _SS = 0 V As shown in FIG. 4, an insulated gate field effect transistor (hereinafter referred to as PMOS) 11
Each drain electrode, gate electrode, and source electrode are connected. Diodes 9 and 10 are connected to the input of the inverter.

On the other hand, V _HL =
Negative high voltage power supply line of -200 V 66 and V _HH = 0~400V
Between the high-voltage signal line 65 and the negative high-voltage power supply line 66, a first external resistance element 67 of 300 kΩ and a second external resistance element 68 of 200 kΩ are connected in series. The connection point 73 is input to the above-described inverter circuit (composed of the PMOS 11 and the NMOS 12) via the input terminal 74 of the semiconductor integrated circuit 61. Signal line 65
Although the voltage V _HH changes from 0V to 400V, V _HH =
At 0 to 300 V, the voltage at the input terminal 74 becomes 0 V, and the output 3 of the inverter becomes 5 V, that is, the logic state of “H”. Further, when V _HH = 313 to 400 V, the voltage of the input terminal 74 becomes 5 V, and the output 73 of the inverter becomes 0 V, that is, the logic state of “L”. As described above, the magnitude of the voltage of the signal line 65 is compared with the set value, and is output as a logic signal.

[0004]

However, in the above-described prior art configuration, the high-voltage circuit exceeding 100 V and the signal processing of 10 V or less are used in an environment in which a large voltage of 100 V or more is applied to the resistance element. In an environment that can be used in a technical field where low-voltage circuits are mixed, it is common practice to use resistive elements with low voltage specifications due to reliability due to the dielectric strength or electric field of the semiconductor substrate surface. A structure in which a resistive film is formed on an insulating film on the surface of a semiconductor substrate cannot be adopted.

Therefore, the resistive element is not formed on the semiconductor substrate on which the integrated circuit is formed, but is formed by individual resistive element parts, which causes a problem that the number of parts increases and the reliability decreases accordingly. .

SUMMARY OF THE INVENTION It is an object of the present invention to provide a high-voltage resistance element,
It is an object of the present invention to provide a semiconductor device which can be formed on a semiconductor substrate of a semiconductor integrated circuit whose structure such as an insulating film on the surface has a low voltage specification.

[0007]

According to the present invention, an insulating film is formed on a surface of a semiconductor substrate, a first resistive element is provided on a first region on the insulating film, and a second resistive element is provided on the insulating film. A second resistance element is formed in the region, and the first resistance element and the second resistance element form a series resistor connected in series by a wiring, and are formed in a region below the first resistance element. A first diffusion layer is formed on the surface of the semiconductor substrate in the first region, and a second diffusion layer is formed on the surface of the semiconductor substrate in the second region, which is a lower region of the second resistance element. A semiconductor device having a diffusion layer is obtained.

Further, according to the present invention, the electric potential of the first diffusion layer located immediately below the first resistance element is made closer to the electric potential of the first resistance element, so that the surface of the semiconductor substrate is formed. A semiconductor device characterized by increasing the withstand voltage of the formed resistive element is obtained.

Further, according to the present invention, the first and second diffusion layers are first and second epitaxial growth layers which are present independently of each other, and wherein the first epitaxial growth layer comprises: The semiconductor device is supplied with electric power by being connected by wiring so that the potential of the first resistance element has the same potential as one of the two terminals of the first resistance element. Is obtained.

According to the present invention, an insulating film is formed on the surface of a semiconductor substrate, a first resistor element is provided in a first region on the insulating film, and a first resistor is provided on a second region on the insulating film. 2 resistance elements are formed, the first resistance element and the second resistance element form a series resistor connected in series by wiring, and a diffusion layer is formed in a lower region of the first resistance element. Instead, a semiconductor device is obtained in which a diffusion layer is formed in a region below the second resistance element and on the surface of the semiconductor substrate in the second region.

Further, according to the present invention, the potential of the first diffusion layer located immediately below the first resistance element is brought close to the potential of the first resistance element, so that A semiconductor device characterized by increasing the withstand voltage of the formed resistive element is obtained.

Further, according to the present invention, the diffusion layer is a high breakdown voltage specification N well, and the high breakdown voltage specification N well is:
The semiconductor device is supplied with electric power by being connected by wiring so that the potential of the first resistance element has the same potential as one of the two terminals of the first resistance element. Is obtained.

[0013]

An electric field is generated in the insulating film by dividing the potential difference between the resistance element and the semiconductor substrate by the thickness of the insulating film. Therefore,
The larger the potential difference between the resistance element and the semiconductor substrate,
Further, the electric field in the insulating film becomes larger as the insulating film is thinner.
Even if a high voltage is applied to the resistance element, the potential of the diffusion layer of the semiconductor substrate immediately below the resistance element can be set optimally so that the rise of the electric field in the insulating film falls within a safe value with some margin. In addition, it is possible to prevent a high electric field in the insulating layer from exceeding a safe level.

By paying attention to this point, the present invention makes it possible to suppress the electric field in the insulating film to a low level by applying a voltage in the same polarity direction to the diffusion layer of the semiconductor substrate immediately below the high-potential resistance element. And

[0015]

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG. FIG. 1 is a circuit configuration diagram of a semiconductor device according to the present invention. The broken line 21 is a semiconductor integrated circuit formed by a single semiconductor substrate. The semiconductor integrated circuit 21 is a 5V-system CM similar to the above-described prior art (see FIG. 4).
An OS inverter circuit, that is, an NMO between the high-potential-side power supply line 2 of V _DD = 5 V and the high-potential-side power supply line 4 of V _SS = 0 V
As shown in FIG. 1, S12 and PMOS 11 are connected to their respective drain electrodes, gate electrodes, and source electrodes. Also, diodes 9 and 1 are provided at the input of the inverter.
0 is connected. Up to this point, this is the same as the prior art shown in FIG. 4, but in the present embodiment, the first external resistance element 67 and the second external resistance The difference is that the element 68 is formed on the same semiconductor substrate and forms one semiconductor integrated circuit 21.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIG. FIG. 2 is a sectional view showing one embodiment of a semiconductor substrate applied to the semiconductor device according to the present invention.
On a P-type semiconductor substrate 31 having a resistivity of 30 Ωcm, a resistivity of 10
An N-type epitaxial layer 33 of Ωcm is grown to a thickness of 35 μm, and the N-type epitaxial layer 33 is separated into islands by the P-type separation layer 32. PM that constitutes CMOS inverter
OS11 is a first isolation diffusion layer region (isolation region of N-type epitaxial layer) 4 for a low-voltage element whose potential is fixed to 5V.
1 is formed. NMO constituting CMOS inverter
S12 is formed in the first isolation diffusion layer region 41 in which the potential is fixed to 5V, which is the same as that of the PMOS 11, and is formed in the P-well diffusion layer 40 in which the potential is fixed to 0V. Reference numeral 34 denotes an N-type high-concentration diffusion layer which forms an ohmic junction with the N-type diffusion layer and functions as a source diffusion layer and a drain diffusion layer of the NMOS 12. Reference numeral 35 denotes a P-type high concentration diffusion layer, which forms an ohmic junction with the P-type diffusion layer,
11 functions as a source diffusion layer and a drain diffusion layer.

On the surface of the semiconductor substrate, a thickness of 0.1 mm is selectively applied.
A field oxide film 36 of 5 μm is formed, and a polysilicon layer (a boron phosphorus glass layer or the like) 37 is selectively formed on the surface thereof. The gate electrode 39 of the CMOS inverter, the first internal resistance element 22, and the like are formed. Two internal resistance elements 23 are also formed. The first internal resistance element 22 is supplied with power by connecting the wiring so that the potential of the first internal resistance element 22 becomes the same as the lower potential terminal of the two terminals of the second internal resistance element 23. It is configured to be located above a second isolation diffusion layer region (isolation region of an N-type epitaxial layer) 42 for the internal resistance element 22.

The potential of the second internal resistance element 23 is 5V.
Is formed above the first isolation / diffusion layer region 41. Note that the P-type semiconductor substrate 31 and the P-type insulating layer 32 are fixed at 0V.

Next, a second embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. FIG. 3 is a sectional view showing another embodiment of the semiconductor substrate applied to the semiconductor device according to the present invention. An N-well 52 is formed in one region of the surface of a P-type semiconductor substrate 31 having a resistivity of 30 Ωcm, and a PMOS 53 constituting a CMOS inverter is formed on the surface of the N-well 52. In an area other than the N-well 52 formation area on the surface of the P-type semiconductor substrate 31, an NMOS 54 forming a CMOS inverter is formed. An N well 51 with a high withstand voltage specification is formed in another region on the surface of the P-type semiconductor substrate 31. Reference numeral 34 denotes an N-type high-concentration diffusion layer which forms an ohmic junction with the N-type diffusion layer and functions as a source diffusion layer and a drain diffusion layer of the NMOS 12. Reference numeral 35 denotes a P-type high-concentration diffusion layer which forms an ohmic junction with the P-type diffusion layer and functions as a source diffusion layer and a drain diffusion layer of the PMOS 11.

A field oxide film 36 having a thickness of 0.5 μm is selectively formed on the surface of semiconductor substrate 31. A polysilicon layer (a boron phosphorus glass layer or the like) 37 is selectively formed on the surface of the field oxide film 36, and a first internal resistance element 22 and a second internal resistance element 23 are formed. 36 covers the gate electrode 39 of the CMOS inverter. Note that the first internal resistance element 22 is connected to the wiring so that the potential becomes the same as one of the two terminals of the first internal resistance element 22, and is supplied with the high withstand voltage specification N well 51. The second internal resistance element 23 is configured to be located above a region where no diffusion layer is formed on the P-type semiconductor substrate 31 having a potential of 0 V.

[0021]

In general, when a resistance element is realized by a resistive film such as polysilicon formed on a field oxide film,
The maximum allowable practical electric field of the field oxide film is several MV /
cm. In other words, when the general field oxide film thickness is 0.5 μm, the potential difference between the resistance element and the underlying semiconductor substrate cannot exceed about 200 V. Therefore, conventionally, a resistance element having a specification exceeding this voltage range cannot be formed on a semiconductor substrate, and an individual resistance element is provided outside.

According to the present invention, for example, a diffusion layer region having a potential of 200 V is provided in a part of a semiconductor substrate having a potential of 0 V. Therefore, a potential of -200 V is applied above the potential of 0 V on the semiconductor substrate as in the conventional case. A resistance element of 200 V is realized.

Further, a resistance element having a potential of 0 V to 400 V can be realized on the diffusion layer region of a potential of 200 V on the semiconductor substrate. As a whole, only a resistance element in the range of -200 V to 200 V is conventionally provided on the semiconductor substrate. In contrast to the fact that it could not be realized, the range can be widened to -200 V to 400 V.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a semiconductor device according to the present invention.

FIG. 2 is a sectional view of a semiconductor substrate according to a junction separation method to which the present invention is applied.

FIG. 3 is a sectional view of a semiconductor substrate according to a self-separation method to which the present invention is applied.

FIG. 4 is a diagram showing a configuration of a conventional semiconductor device.

[Explanation of symbols]

2 High-potential-side power supply line 3 Output of arbitrary inverter 4 High-potential-side power supply line 9, 10 Diode 11 PMOS 12 NMOS 21 Semiconductor integrated circuit 22 First internal resistance element 23 Second internal resistance element 24 First internal resistance element 25 high voltage signal input terminal 26 negative high voltage power supply input terminal 31 P-type semiconductor substrate 32 P-type separation layer 33 N-type epitaxial layer 34 N-type high concentration diffusion layer 35 P-type high concentration diffusion Layer 36 Field oxide film 37 Boron phosphorus glass layer film 38 Aluminum wiring layer 39 Gate electrode 40 P-well diffusion layer 41 First isolation diffusion layer area 42 Second isolation diffusion layer area 51 High breakdown voltage specification N well 52 N well 53 PMOS 54 NMOS

Claims (6)

[Claims] An insulating film is formed on a surface of a semiconductor substrate,
A first resistance element is formed in a first region on the insulating film, and a second resistance element is formed in a second region on the insulating film, wherein the first resistance element and the second resistance element are formed. Constitutes a series resistor connected in series by a wiring, a first diffusion layer is formed on a surface of the semiconductor substrate in a lower region of the first resistance element and in the first region, and A second diffusion layer is formed on a surface of the semiconductor substrate in a lower region of the resistance element of the above (2). 2. The method according to claim 1, wherein a potential of the first diffusion layer located immediately below the first resistance element is brought close to a potential of the first resistance element, thereby forming a resistance element formed on a surface of the semiconductor substrate. 2. The method according to claim 1, wherein the withstand voltage is increased.
13. The semiconductor device according to claim 1. 3. The first and second diffusion layers are a first and a second epitaxial growth layer that are present independently of each other, and wherein the first epitaxial growth layer is a first resistance element. 3. The semiconductor according to claim 1, wherein the power is supplied by wiring connection such that the potential of the first resistance element is the same as that of one of the two terminals of the first resistance element. apparatus. 4. An insulating film is formed on a surface of a semiconductor substrate, and a first resistive element is formed in a first region on the insulating film, and a second resistive element is formed in a second region on the insulating film. And the first
And the second resistance element constitute a series resistor connected in series by a wiring, and no diffusion layer is formed in a lower region of the first resistance element. A semiconductor device, wherein a diffusion layer is formed on a surface of the semiconductor substrate in the second region. 5. The resistance element formed on the surface of the semiconductor substrate by making the potential of the first diffusion layer located immediately below the first resistance element close to the potential of the first resistance element. 5. A high withstand voltage is intended.
13. The semiconductor device according to claim 1. 6. The N-well of the high breakdown voltage specification, wherein the potential of the first resistance element is one of two terminals of the first resistance element. 6. The semiconductor device according to claim 4, wherein power is supplied by wiring connection so as to have the same potential as that of the semiconductor device.