JPH0936198A - Vacuum processing apparatus and semiconductor manufacturing line using the same - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a vacuum processing apparatus which can cope with an increase in diameter of a sample, suppress an increase in manufacturing cost, and do not deteriorate maintainability. [Structure] A cassette block 1 and a vacuum processing block 2 are provided. The cassette block is provided with a cassette table on which a plurality of cassettes 12 containing a sample are placed, and an atmospheric transfer means for transferring the sample. In the vacuum processing apparatus, wherein the vacuum processing block is provided with a processing chamber for vacuum-processing the sample and a vacuum transfer means for transferring the sample, the planar shapes of the cassette block and the vacuum processing block are respectively. The width of the cassette block is substantially rectangular, the width of the vacuum processing block is larger than that of the vacuum processing block, and the planar shape of the vacuum processing apparatus is L-shaped or T-shaped.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum processing apparatus,
Especially for a sample which is a semiconductor element substrate such as Si, etching, CVD (chemical vapor deposition), sputtering,
The present invention relates to a vacuum processing apparatus suitable for single-wafer processing such as ashing and rinser (water washing), and a semiconductor manufacturing line for manufacturing a semiconductor device using the vacuum processing apparatus.

[0002]

2. Description of the Related Art A vacuum processing apparatus for processing a sample is roughly divided into a cassette block and a vacuum processing block. The cassette block has a front extending in the longitudinal direction facing a bay passage of a semiconductor manufacturing line. There are a cassette for samples and a sample alignment, and an alignment robot and an atmospheric robot. The vacuum processing block is provided with a load-side load lock chamber, an unload-side load lock chamber, a vacuum processing chamber, a post-vacuum processing chamber, a vacuum pump, a vacuum robot, and the like.

In these vacuum processing apparatuses, the sample taken out from the cassette of the cassette block is transferred to the load lock chamber of the vacuum processing block by the atmospheric robot. The sample that has been transferred from the load lock chamber to the processing chamber by the vacuum robot and set on the electrode structure is subjected to processing such as plasma etching. Thereafter, it is transported to a post-processing chamber and processed as needed. The processed sample is transported to the cassette of the cassette block by the vacuum robot and the atmospheric robot.

Examples of a vacuum processing apparatus for plasma etching a sample include, for example, Japanese Patent Publication No. 61-8153, Japanese Patent Publication No. 63-133532, and Japanese Patent Publication No. 6-30.
369, JP-A-6-314729, JP-A-6-314730, and US Pat. No. 5,314,50.
There is one as described in the specification of No. 9.

[0005]

In the prior art vacuum processing apparatus described above, the processing chamber and the load lock chamber are arranged concentrically or rectangularly. For example, US Pat.
The apparatus described in the specification of No. 14,509 has a vacuum robot near the center of the vacuum processing block and three processing chambers arranged concentrically around the vacuum robot. A lock chamber and a load lock chamber on the unload side are provided. In these devices, there is a problem that the rotation angle of the transfer arm of the atmospheric robot or the vacuum robot is large and therefore the required floor area of the entire device is large.

On the other hand, with respect to the processing chamber in the vacuum processing block of the vacuum processing apparatus, the vacuum pump and other various piping equipment, it is necessary to perform maintenance such as inspection and repair regularly or irregularly. Therefore, in general, a door is provided around the vacuum processing block, and by opening this door, inspection and repair of the load lock chamber, the unload lock chamber, the processing chamber, the vacuum robot, and various piping devices can be performed. It has become.

In the conventional vacuum processing apparatus, the diameter d of the sample to be handled is 8 inches (about 200 mm) or less, but the external dimension Cw of the cassette is also about 250 mm, and the size of the floor area is still a big problem. It was. Further, considering handling a sample having a large diameter such as a diameter d of 12 inches (about 300 mm), the external dimensions Cw of the cassette are as follows.
As a result, the width of the cassette block for accommodating a plurality of cassettes also increases. If the width of the vacuum processing block is determined according to this width, the entire vacuum processing apparatus requires a large space. As an example, considering a cassette block that stores four cassettes, when the diameter d of the sample is changed from 8 inches to 12 inches, the width of the cassette must be increased by at least about 40 cm or more.

On the other hand, in order to perform a large amount of processing while performing various kinds of processing on a sample, in a general semiconductor manufacturing line, a plurality of vacuum processing apparatuses that perform the same processing are collected in the same bay, and transportation between the bays is automatically performed. Or do it manually. Since such a semiconductor manufacturing line requires a high degree of cleanliness, the entire semiconductor manufacturing line is installed in a large clean room. The increase in the size of the vacuum processing apparatus accompanying the increase in the diameter of the sample is accompanied by an increase in the area occupied by the clean room, which further increases the construction cost of the clean room, which originally has a high construction cost. If a vacuum processing apparatus having a large occupied area is installed in a clean room having the same area, the total number of vacuum processing apparatuses must be reduced, or the interval between the vacuum processing apparatuses must be reduced. A reduction in the number of vacuum processing devices installed in a clean room of the same area inevitably leads to a decrease in the productivity of the semiconductor manufacturing line and an increase in the semiconductor manufacturing cost. On the other hand, when the interval between the vacuum processing apparatuses is reduced, a maintenance space for inspection and repair is insufficient, and the maintainability of the vacuum processing apparatuses is significantly impaired.

An object of the present invention is to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample.

Another object of the present invention is to provide a vacuum processing apparatus which is excellent in maintainability while coping with an increase in the diameter of a sample.

Another object of the present invention is to provide a semiconductor manufacturing line which is capable of securing a necessary number of vacuum processing apparatuses to be installed, suppressing an increase in manufacturing cost, and maintaining maintainability while coping with an increase in sample diameter. To provide.

[0012]

In order to achieve the above object, the present invention comprises a cassette block and a vacuum processing block, and the cassette block has a cassette table on which a cassette containing a sample is placed. Provided, the vacuum processing block, a processing chamber for vacuum processing the sample,
In a vacuum processing apparatus in which a vacuum transfer means for transferring the sample is arranged, the planar shapes of the cassette block and the vacuum processing block are substantially rectangular, the width of the cassette block is W1, and the width of the vacuum processing block is Is W2 and the width of the cassette is Cw, W1-W2
It is characterized in that ≧ Cw. Another feature of the present invention is that the width dimension of the cassette block is made larger than that of the vacuum processing block, and the planar shape of the vacuum processing apparatus is formed in an L shape or a T shape.

Another feature of the present invention is a semiconductor manufacturing line in which a plurality of bay areas, each incorporating a plurality of vacuum processing devices each comprising a cassette block and a vacuum processing block, are arranged in the order of the semiconductor manufacturing process. The block is provided with a cassette table on which a cassette containing a sample is placed, and the vacuum processing block is provided with a processing chamber for vacuum-processing the sample and a vacuum transfer means for transferring the sample. At least one of the vacuum processing apparatuses is configured such that the cassette block can accommodate a plurality of samples having a diameter of 300 mm or more, the width of the cassette block is W1, the width of the vacuum processing block is W2, W1-W, where Cw is the width of the cassette
It is on a semiconductor manufacturing line where 2 ≧ Cw.

Another feature of the present invention is semiconductor manufacturing provided with a plurality of vacuum processing devices each including a cassette block for storing a sample having a diameter of 300 mm or more and a vacuum processing block for vacuum processing the sample. An apparatus line configuration method, wherein at least one of the vacuum processing apparatuses comprises:
A width dimension of the cassette block is larger than a width dimension of the vacuum processing block, and a planar shape of the vacuum processing apparatus is L-shaped or T-shaped.
This is a line configuration method in which a maintenance space is secured between the V-shaped vacuum processing device and an adjacent vacuum processing device.

[0015]

According to the present invention, when the cassette block and the vacuum processing block are substantially rectangular in plan view, and the width of the cassette block is W1 and the width of the vacuum processing block is W2, W1> W2 The vacuum processing apparatus has a planar shape of L
When a large number of such vacuum processing devices are arranged, a sufficient space is provided between the adjacent vacuum processing blocks even if the space between the adjacent vacuum processing devices is narrowed. Reserved. For example, W1 is 1.5m, W2
Is set to 0.8 m and the distance between adjacent vacuum processing devices is 0.7
m maintenance space can be secured.

Therefore, despite the increase in the diameter of the sample, the number of vacuum processing apparatuses installed in a clean room of the same area is not reduced as compared with the conventional one, and thus the productivity of the semiconductor manufacturing line is lowered. There is also no.
Therefore, it is possible to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost while responding to an increase in the diameter of a sample and having excellent maintainability.

Further, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while coping with an increase in the diameter of a sample. It is possible to provide a semiconductor manufacturing line in which maintainability is not impaired.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a vacuum processing apparatus according to an embodiment of the present invention will be described below with reference to FIGS. Vacuum processing device 1
As shown in FIG. 1, 00 includes a cassette block 1 and a vacuum processing block 2 each having a rectangular parallelepiped shape. Each of the cassette block 1 and the vacuum processing block has a rectangular planar shape, and has an L-shaped planar shape as a whole. As will be described later, the cassette block 1 extends in the longitudinal direction facing the bay passage of the semiconductor manufacturing line, and on the front side, a cassette table 16 for transferring a cassette 12 containing a sample to and from the bay passage, An operation panel 14 is provided. A vacuum processing block 2 installed on the back surface of the cassette block 1 extends in a direction perpendicular to the cassette block 1 and incorporates various vacuum processing devices and a transfer device.

As shown in FIGS. 2 to 4, the cassette block 1 has an atmospheric robot 9 for transferring a sample and a cassette 12 for holding a sample. The sample cassette 12 includes product sample cassettes 12A, 12B and 12C and a dummy sample cassette 12D. If necessary, a sample orientation alignment may be provided adjacent to the cassette 12. All of the sample cassettes 12 store a product sample or a product and a dummy sample. Samples for checking foreign substances and cleaning are stored at the top and bottom of the cassette.

The vacuum processing block 2 is provided with a load side load lock chamber 4, an unload side load lock chamber 5, a vacuum processing chamber 6, a rear vacuum processing chamber 7, a vacuum pump 8 and a vacuum robot 10. . Reference numeral 13 is a discharging means for etching, and 14 is a discharging means for post-processing (ashing).

The atmospheric robot 9 is provided so as to be able to travel on a rail 92 installed in the cassette block 1 in parallel with the cassette table 16, and the cassette 12 and the load side load lock chamber 4 of the vacuum processing block 2 and The sample 3 is transported between the unload-side load lock chambers 5. The vacuum robot 10 transfers the sample 3 from the load side load lock chamber 4 to the vacuum processing chamber 6, and also transfers the sample 3 between the vacuum processing chamber 6, the unload side load lock chamber 5, and the post-vacuum processing chamber 7. The present invention has a diameter d of 12 inches (about 300 m
It is assumed that samples with a large diameter of m) or more will be handled. For 12-inch samples, the external dimensions C of the cassette
w is about 350 mm to 360 mm.

The vacuum processing chamber 6 is a chamber for processing the samples 3 one by one, for example, plasma etching processing, and is provided in the upper left portion of the vacuum processing block 2. The load-side load lock chamber 4 and the unload-side load lock chamber 5 are on the opposite side of the vacuum processing chamber 6 with the vacuum robot 10 interposed therebetween.
That is, they are provided on the lower side of the vacuum processing block 2, respectively. In the post-vacuum processing chamber 7, the processed sample 3
This is a chamber for post-processing one by one, and is provided in an intermediate portion of the vacuum processing block 2 corresponding to the unload-side load lock chamber 5.

The atmospheric robot 9 has a telescopic arm 91, and the locus of the telescopic arm that expands and contracts while moving on the rail 92 is such that the loader cassette 12, the load side load lock chamber 4, and the unload side load lock. The locus includes the chamber 5. Vacuum robot 1
Numeral 0 has a telescopic arm 101, and is provided in the vacuum processing block 2 so that the pivotal locus of the telescopic arm is a locus including the load-side load lock chamber 4 and the vacuum processing chamber 6. Therefore, the telescopic arm 101 of the vacuum robot
Is provided such that the swirling locus is a locus including the vacuum processing chamber 6, the unload-side load lock chamber 5, and the post-vacuum processing chamber 7. The position of the atmospheric robot 9 may be the right side portion on the cassette block 1.

A wafer search mechanism is provided around each cassette 12, and when the cassette 12 is set, the wafer search mechanism recognizes the sample in each cassette. Further, in the load lock chambers 4 and 5, the vacuum processing chamber 6 and the post-vacuum processing chamber 7, sample lifting mechanisms 14A and 14B are provided.
Are provided, and the sample 3 can be delivered to the telescopic arms 91 and 101 of each robot. Further, the vacuum processing chamber 6 is provided with an electrode of the discharging means 13 for etching and a sample mounting table 14C. A sample lifting mechanism 14B is provided inside the etching discharger 13. Reference numeral 15 is a ring-shaped gate valve.

Next, a sample processing operation in the vacuum processing apparatus 100 will be briefly described by taking a plasma etching process as an example. First, the atmospheric robot 9 of the cassette block 1 is moved on the rail 92 to approach, for example, the load side cassette 12A, and the telescopic arm 91 is extended toward the cassette 12A side to load a fork (not shown). The sample 3 is inserted into the side cassette under the sample 3, and the sample 3 is transferred onto the fork. Then, the arm 91 of the atmospheric robot 9 is moved to the load side load lock chamber 4 with the lid of the load side load lock chamber 4 opened, and the sample 3 is transported. At this time, the atmospheric robot 9 is moved on the rail 92 as necessary so that the stroke of the telescopic arm 91 reaches the load lock chamber 4 on the load side.

Thereafter, the sample lifting mechanism 14A is operated to support the sample 3 on the supporting member of the load side load lock chamber 4. Further, after the load-side load lock chamber 4 is evacuated, the supporting member is lowered, the sample pushing-up mechanism 14A is operated again, and the sample 3 is delivered to the arm 101 of the vacuum robot 10. The vacuum is conveyed to the vacuum processing chamber 6. The sample 3 is conveyed to the unload side cassette position of the cassette block 1 by the reverse operation.

When the post-treatment is required, the arm 101 of the vacuum robot 10 conveys it via the post-vacuum treatment chamber 7. In the post-vacuum processing chamber 7, plasma post-processing such as ashing is performed on the etched sample 3.

In FIG. 3, the locus of the arm 101 of the vacuum robot 10 is, for example, the load side load lock chamber 4,
Considering a state where the sample 3 is in the vacuum processing chamber 6 and the post-vacuum processing chamber 7 and there is no wafer in the unload lock chamber 5, the situation is as follows. That is, the arm 1 of the vacuum robot 10
In 01, first, one sample 3 of the post-vacuum processing chamber 7 is moved to the unload lock chamber 5, and the sample 3 of the vacuum processing chamber 6 is moved to the post-vacuum processing chamber 7. Next, load-side load lock chamber 4
The sample 3 is transferred to the vacuum processing chamber 6. Further, the sample 3 in the vacuum processing chamber 6 is transferred to the post-vacuum processing chamber 7. Arm 101
Repeats the same locus thereafter.

Further, since the vacuum robot 10 is arranged near the side end of the vacuum processing block 2, the operator can inspect and repair the vacuum robot 10 without taking an unreasonable posture, and the maintenance becomes easy.

FIG. 5 is a plan view showing an example of a bay area 200 of a semiconductor manufacturing line incorporating the vacuum processing apparatus 100 of the present invention. In the figure, a large number of L-shaped vacuum processing devices 100 are arranged with a maintenance space 203 of a gap G1 therebetween, and a partition 120 provides a high clean room 201A and a low clean room 201B.
Is partitioned. An automatic transfer device (hereinafter referred to as AGV) 202 for supplying and transferring the sample 3 is provided along the front surface of the cassette block 1 arranged in the high clean room 201A. On the other hand, a large number of vacuum processing blocks 2 are arranged in the low clean room 201B, and their intervals are maintenance spaces described later.

FIG. 6 is a diagram showing a part of the flow of the sample 3 in the semiconductor manufacturing line according to the embodiment of the present invention.
At the entrance of each bay area 200, an inspection device 206,
A bay stocker 208 is provided. The back of each bay area 200 communicates with a maintenance passage 210, and an air shower 212 is provided at the entrance of the maintenance passage 210. Bay Stocker 2 from the outside
The sample 3 supplied to 08 is sequentially passed to the in-bay AGV 202 of the predetermined bay area 200 by the line AGV 204 according to the processing step, as indicated by the arrow. further,
The AGV 202 in the bay is transferred to the cassette block 1 of the vacuum processing apparatus 100. In the vacuum processing apparatus 100, the sample 3 is transported between the cassette block 1 and the vacuum processing block 2 by the atmospheric robot 9 and the vacuum robot 10.
The sample 3 processed in the vacuum processing block 2 is AG in the bay.
It is transferred to the V202, further transferred to the line AGV204, and transported to the next bay area 200.

In the semiconductor manufacturing line having the in-bay AGV 202, the in-bay AGV 202 supplies a new sample (unprocessed wafer) to the cassette block 1 of each vacuum processing apparatus 100 from the bay stocker 208 provided for each bay 200. Alternatively, the cassette containing the processed sample is collected from the cassette block 1.

The AGV 202 in the bay corresponds to each vacuum processing apparatus 1.
In response to the request signal issued from 00, a cassette storing a new sample (unprocessed wafer) is received from the bay stocker 208 provided in each bay 200, and the request signal is issued from the cassette block 1 of the vacuum processing apparatus 100. Drive to the specified cassette position and stop.

Next, the cassette handling robot incorporated in the AGV 202 in the bay is rotated (θ
Axis, vertical movement (Z axis), gripping movement (φ axis), three-axis control function, turning movement (θ axis), vertical movement (Z axis)
An axis, a gripping operation (φ axis), and a four-axis control function of forward and backward movement (Y axis) are used.

If the cassette 12 which has already been processed is located at the designated position of the cassette block 1 according to the content of the request issued from each vacuum processing apparatus 100, the cassette handling robot first moves this cassette 12 to the cassette block 1. To the empty cassette storage area on the AGV 202 in the bay, and then, the new cassette 12 conveyed from the bay stocker 208 is supplied to the empty collection place.

When this operation is completed, the recovered cassette 12 is conveyed to the bay stocker 208, and the operation is stopped and stands by until the next request signal is issued from the vacuum processing apparatus 100 in the bay 200.

If request signals are issued from a plurality of vacuum processing devices 100, 100 ... In the bay 200 in a short time, the order of receiving the signals corresponds to the deviation of the receiving time and the position of the transmitter. AGV202 in the bay considering the relationship
It depends on how the system is constructed whether to correspond to the order from the standby position with the highest transfer efficiency.

The information of the cassette to be delivered includes a number unique to each cassette used in the management of the entire manufacturing line and various information. For example, an optical communication system or the like is provided between the vacuum processing apparatus 100 and the AGV 202 in the bay. It has been considered that the management of the cassette is carried out.

The process flow in the bay area 200 will be further described by focusing on the samples in each cassette.

The atmosphere block 1 includes cassettes 11 and 12.
However, 3 to 4 are juxtaposed on the same horizontal plane. Each cassette contains a sample, in this case a diameter of 300 mm (12 ")
Each of the semiconductor element substrates (wafers) is stored in a predetermined number.

Among the three to four cassettes, the two to three cassettes 12 contain the samples (preprocessed wafers) to be subjected to the predetermined vacuum processing in the vacuum processing section.
A dummy wafer is stored in the remaining one cassette 11.

The dummy wafer is used for checking the number of foreign matters in the vacuum processing unit 2, and for cleaning the vacuum processing chamber constituting the vacuum processing region.

Here, the cassette 12 in which the unprocessed sample is stored will be referred to as 12A, 12B, and 12C. In this state, for example, the sample storage state of the cassette 12A is checked by the wafer checking means (not shown). In this case, the cassette 12A has a function of storing samples one by one in the height direction.

As the wafer checking means, a sensor for detecting the presence or absence of the sample by contact or non-contact is provided. Then, it has a means for moving the sensor corresponding to the storage position of the sample. In addition, the sample is the cassette 12
There is also provided a means for outputting a signal indicating which stage of A is stored.

As the wafer checking means, the cassette 12
The cassette 12 having a means for moving the sensor so as to sequentially correspond to the sample storage stage of A or the plurality of sensors is the cassette 12
The ones provided corresponding to the sample storage stages of A are used. In this case, the means for moving the sensor so as to sequentially correspond to the sample storage stage of the cassette 12A is unnecessary. Further, the sensor of the wafer checking means may be fixed and the cassette 12A may be moved instead.

By the wafer checking means, the cassette 12
It is checked at which position in the height direction of A the sample before treatment is stored. For example, the wafer check means
In the case of having a means for moving the sensor so as to sequentially correspond to the sample storage stage of the cassette 12A, the sensor is provided, for example, from the lower position to the upper position of the cassette 12A.
Or while moving downward from the upper position, the cassette 12A
The sample storage stage and the presence or absence of the unprocessed sample in the storage stage are detected.

The check result is output from the wafer check means, and, for example, a host computer (not shown) for controlling the semiconductor manufacturing line that manages the entire vacuum processing apparatus.
Is input and stored. Alternatively, the data may be input to a host computer for controlling the apparatus by a personal computer in a console box on the cassette stand or via the personal computer.

Thereafter, in this case, the atmospheric transfer robot 9
Will start working. By the operation of the atmospheric transfer robot, one unprocessed sample in the cassette 12A is taken out of the cassette 12A.

For example, the atmospheric transfer robot 9 is provided with a scooping part for scooping and holding the surface (rear surface) of the sample opposite to the surface to be processed. As the rake portion, one that adsorbs and holds the back surface of the sample, one that has a groove or recess for holding the sample, one that mechanically grasps the peripheral portion of the sample, and the like are used. Further, as a means for adsorbing and holding the back surface of the sample, one having a vacuum adsorption or electrostatic adsorption function is used.

For example, in the case of scooping and holding a sample having a diameter of 300 mm (12 ") by using the one that sucks and holds the back surface of the sample, the arrangement and size of the sucking portion are set so that the bending of the sample can be minimized. It is important to select, for example, the diameter of the sample by taking the inner width of the cassette into consideration.
, The distance between the adsorbing portions is d with the center of the sample as the center.
Set it to / 3 to d / 2.

Depending on the amount and manner of bending of the sample, the sample may be displaced during the delivery of the sample between the rake portion and other means, and the orientation may be shifted.

Further, when the one that adsorbs and holds the back surface of the sample is used, during movement (including movement start and stop)
In addition, it is necessary to have an adsorption force that does not cause the sample to desorb due to the inertial force acting on the sample. If this is not satisfied, there arises inconveniences such as the sample falling off from the rake portion during movement, and the orientation of the sample deviating.

The rake portion is inserted into the cassette 12A at a position corresponding to the back surface of the unprocessed sample that needs to be taken out. With the scoop part inserted, cassette 12A
Is lowered by a predetermined amount, or the rake portion is raised by a predetermined amount. When the cassette 12A is lowered or the rake portion is raised, the untreated sample is passed to the rake portion while being scooped by the rake portion. In this state, the scoop portion is pulled out of the cassette 12A. As a result, one unprocessed sample in the cassette 12A is taken out of the cassette 12A.

As described above, which unprocessed sample in the cassette 12A is to be taken out by the atmospheric transfer robot 9 is instructed and controlled by the host computer, for example.

The number of stages in the cassette 12A from which the unprocessed sample is taken out is sequentially stored in the host computer every time the sample is taken out.

The atmospheric transfer robot 9 having one unprocessed sample in the scoop part is moved to a position where the sample can be carried into the load lock chamber 4 and stopped.

The inside of the load lock chamber 4 is shut off from the vacuum atmosphere of the vacuum processing section 2 and is in an atmospheric state. The unprocessed sample held in the rake portion of the atmospheric transfer robot 9 is loaded into the load / lock chamber 4 in this state, and is passed from the rake portion into the load / lock chamber 4.

The atmosphere transfer robot 9 which has passed the unprocessed sample into the load lock chamber 4 is retracted to a predetermined position in preparation for the next operation.

The above-mentioned operation is instructed and controlled by the host computer, for example.

The number of stages in the cassette 12A from which the unprocessed sample transferred to the load lock chamber 4 is taken out is sequentially stored in the host computer.

The inside of the load lock chamber 4 that has received the sample before processing is shielded from the atmosphere and evacuated.
After that, the disconnection with the vacuum processing unit is released, and the unprocessed sample is communicated so that it can be transported.

The sample is transferred from the load / lock chamber 4 to the vacuum processing area of the vacuum processing section 2 by the vacuum robot 10, and is subjected to a predetermined vacuum processing in the vacuum processing area. The sample for which the vacuum processing has been completed (processed sample) is unloaded from the vacuum processing area by the vacuum robot 101.
It is conveyed to the lock chamber 5 and carried into the chamber.

The vacuum transfer robot is provided with a scooping part like the atmospheric transfer robot 9. The scooping part is the same as that used in the atmospheric transfer robot, except that it has a vacuum suction function.

After the processed sample is loaded, the interior of the unload lock chamber 5 is shut off from the vacuum processing section 2 and the internal pressure is adjusted to atmospheric pressure.

The unload lock chamber 5 whose internal pressure has become atmospheric pressure is opened to the atmosphere. In this state, the rake portion of the atmospheric transfer robot 9 is inserted into the unload lock chamber 5, and the processed sample is passed to the rake portion.

The rake portion that has received the processed sample is carried out to the outside of the unload lock 5 room. After that, the inside of the unload lock chamber 5 is evacuated by being shielded from the atmosphere in preparation for carrying in the next processed sample.

On the other hand, the atmospheric transfer robot 9 having the processed sample in the scoop portion is moved to a position where the processed sample can be returned into the cassette 12A and stopped.

Thereafter, the scoop portion having the processed sample is inserted into the cassette 12A in this state. Here, the insertion position is controlled by the host computer so that the processed sample is returned to the position where it was originally stored.

After the insertion of the rake portion having the processed sample is completed, the cassette 12A is raised or the rake portion is lowered.

As a result, the processed sample is
It is returned to the originally stored position, and is stored again in the cassette 12A.

Such an operation is similarly performed on the remaining unprocessed samples in the cassette 12A and the unprocessed samples in the cassettes 12B and 12C.

That is, the unprocessed samples taken out one by one from each cassette are numbered, for example. For example, the host computer stores which sample of the unprocessed sample taken out from which stage of which cassette.

Based on the stored information, the movement of the sample taken out from the cassette, vacuum-processed, and returned to the cassette after the vacuum processing is completed is controlled and controlled.

That is, the sample moves in the following order before being taken out of the cassette and returned to the original cassette.

Checking the storage position in the cassette Taking out the sample from the cassette by the atmospheric transfer robot Loading into the load lock chamber by the atmospheric transfer robot Transfer from the load lock chamber to the vacuum processing area by the vacuum robot In the vacuum processing area Vacuum processing Transfer from vacuum processing area by vacuum robot to unload / lock chamber Carry out from unload / lock chamber by atmospheric transfer robot Store in original position in cassette by atmospheric transfer robot As above → Each time it moves, the data of the host computer is sequentially updated to determine what number of samples are in each station. The updating process is performed for each sample. This manages each sample, that is, the number of the sample at which station.

For example, the sequential update state processing of the data of the host computer may be sequentially displayed on the CRT screen for controlling the vacuum processing system. In this case, CRT
Each station on the screen is displayed so that the operator can see at a glance what the sample is currently.

In the case where the orientation of the unprocessed sample is adjusted, the step is performed between the above steps.

Such management / control of the movement of the sample is carried out even when the vacuum processing section 2 has a plurality of vacuum processing regions.

For example, assume that the vacuum processing section 2 has two vacuum processing regions. In this case, the sample is subjected to series processing or parallel processing according to the processing information. Here, the series processing means that the sample is vacuum-processed in one vacuum processing region, and the vacuum-processed sample is subsequently vacuum-processed in the remaining vacuum processing region.
The parallel processing means that a sample is vacuum-processed in one vacuum processing area and another sample is vacuum-processed in the remaining vacuum processing area.

For example, in the case of series processing, the sample numbered by the host computer is processed in that order and then returned to its original position in the cassette.

Further, in the case of parallel processing, since the host computer manages and controls which vacuum processing area and how the numbered sample is processed, in this case as well, each processed sample is stored in the cassette. Returned to its original position.

In the case of parallel processing, from what stage of the cassette is taken out, and depending on what number of samples,
Which vacuum processing area to use may be managed and controlled by a host computer.

Furthermore, the series processing and the parallel processing are
Even in the case where they are mixed, since the number of samples processed in which vacuum processing area is managed and controlled by the host computer,
Each processed sample is returned to its original position in the cassette.

As a plurality of vacuum processing areas, for example,
The same or different plasma generation method
Examples include a combination of an etching region, a combination of a plasma etching region and a post-processing region such as ashing, and a combination of an etching region and a film formation region.

Further, the same applies to the dummy sample in the cassette of the dummy sample, except that the dummy sample is not subjected to the vacuum treatment which is performed, for example, to the sample before treatment. Will be implemented.

On the other hand, the cassette, the scooping part of the atmospheric transfer robot, the orientation adjustment station, the load
The lock chamber station, the scoop portion of the vacuum transfer robot, the vacuum processing area station, and the unload lock chamber station are provided with sample presence / absence detection means.

As the sample detecting means, a contact or non-contact type sensor is appropriately selected and used.

The above cassette, scooping portion, and each station serve as check points in the process of moving the sample.

In such a configuration, for example, the presence of a sample in the rake portion of the vacuum transfer robot 10 is detected,
If the sample is not detected at the station in the vacuum processing area, it means that the vacuum transfer robot 10 or the sample transfer machine between the scooping part of the vacuum transfer robot and the station in the vacuum processing area has failed for some reason. Then, the restoration is carried out accurately and in a short time. Therefore, it is possible to suppress a decrease in throughput of the entire device.

Further, for example, each transfer robot 9
With the configuration that the sample detection means is not provided in the scoop part of
For example, if the presence of a sample is detected in the load / lock room station and no sample is detected in the vacuum processing area station, the sample between the load / lock room station and the scoop part of the vacuum transfer robot is detected. The delivery mechanism, the vacuum transfer robot, or the sample transfer mechanism between the scoop part of the vacuum transfer robot and the station in the vacuum processing area failed for some reason, and recovery can be performed accurately and in a short time. It is carried out in. Therefore, it is possible to suppress a decrease in throughput of the entire device.

Such an embodiment has the following usefulness.

(1) It is checked which stage in the cassette the untreated sample is stored in, and the checked untreated sample is numbered to sequentially manage and control its movement. The processed sample can be reliably returned to its original position in the cassette.

(2) Even if the unprocessed sample is subjected to series processing, parallel processing, and mixed processing depending on the processing information, at what stage in the cassette the unprocessed sample is stored. Is checked and the checked samples are numbered and their movements are sequentially managed and controlled, so that the processed samples in various processing modes can be reliably returned to their original positions in the respective cassettes. it can.

(3) It is checked in which stage in the cassette the untreated sample is stored, the checked untreated sample is numbered, and its movement is sequentially managed and controlled. The processing state of each sample processed by the vacuum processing unit can be precisely and precisely checked and managed.

For example, when some defect occurs in the processing of the sample, the processing state of each sample, that is, the processing condition is also managed, so that the defective sample has a different number of stages in which cassette. Since the processing state can be grasped depending on whether it is stored in the eye, the cause of the defect can be grasped in a short time, and the time required for the countermeasure can be shortened accordingly.

In the above embodiment, the diameter of the sample is 30
Although described as 0 mm (12 ″), however, the above utility cannot be achieved by being limited to the diameter of the sample.

Next, maintenance will be described. When performing maintenance of the vacuum processing apparatus 100 of the present invention,
Since the cassette block 1 faces the line of the AGV 202 in the bay, the maintenance of the cassette block 1 is
Most of that can be done from the front.

On the other hand, in order to perform maintenance on the vacuum processing block 2, it is necessary for the operator to enter the area through the maintenance passage 203 or the maintenance passage 210 from the back of each bay area 200 to the area where the vacuum processing block 2 is present. is there.

FIG. 7 shows the relationship between the sizes of the vacuum processing block 2 and the cassette block 1. The long side (width) of the cassette block 1 is W1 and the short side thereof is B1. When the side (width) is W2 and the long side (depth) is B2, W1> B1 and W2 <B2, and when the diameter of the sample 3 is d, it is desirable that W1−W2≈d. It is good to be in

When the gap between the adjacent cassette blocks of the vacuum processing apparatus 100 is G1 and the gap between the adjacent vacuum processing blocks is G2 (see FIG. 5), G1 <G2. And (W1 + G1) -W2 =
MS provides a maintenance space between the adjacent vacuum processing apparatus 100. MS is the size required for the operator to perform maintenance work. In this case, it is preferable that the relationship of (W1 + G1) -W2≈d be satisfied. The maintenance space 203 serves as an entrance / exit for the operator, but depending on the layout of the bay area 200, this space may not be provided. Even in that case, the installation margin G1 between the adjacent vacuum processing apparatuses 100 is at least required, but it is substantially close to zero. In this case, W1-W2 = MS becomes the maintenance space.

The side surface of the vacuum processing block 2 of the vacuum processing apparatus 100 of the present invention has an openable door structure as shown in FIG. That is, double doors 214 and 216 are provided on the side and the back of the vacuum processing block 2, respectively.

In order to perform maintenance, (1) there is a space in which the operator can check the equipment, piping, etc. from the front and rear, and (2) there is a space in which various piping equipment, such as the main chamber of the processing chamber, can be taken out sideways. thing,
(3) It is necessary to have a space to open the door. Therefore, the maintenance space MS is 90 to 12
It is good to set it to about 0 cm.

According to the vacuum processing apparatus 100 of the present invention, it is easy for an operator to approach the side and the back of the vacuum processing block 2. Further, by opening the door 214, the load lock chamber 4, the unload lock chamber 5, the post-treatment chamber 7, the vacuum robot 10, and various piping equipment can be inspected and repaired. Furthermore, by opening the door 216, the processing chamber 6, the vacuum pump, and various piping equipment can be inspected and repaired.

Since there is a maintenance space MS between the respective vacuum processing blocks 2, the operator operates the side door 21.
There is no hindrance in opening and closing 4 and performing maintenance work. In addition, a sufficient space for opening and closing the door 216 and performing maintenance work is secured between the back surfaces of the respective vacuum processing blocks 2.

As described above, the vacuum processing apparatus 100 of the present invention has an L-shaped planar shape. On the other hand, the conventional vacuum processing apparatus 800, as shown in FIG.
Generally, the vacuum processing block and the cassette block are combined into a rectangular shape as a whole. The rectangular shape is selected from the shapes of various elements arranged in the vacuum processing apparatus and the mutual operation relationship. In the conventional apparatus, when the gap between adjacent cassette blocks is G1 and the gap between adjacent vacuum processing blocks is G2,
Generally, G1 ≧ G2.

In the conventional vacuum processing apparatus 800, since the sample 3 to be handled has a diameter d of 8 inches or less, the above configuration may be used, but in an apparatus for handling a large-diameter sample having a diameter d of 12 inches. The outer size of the cassette 12 becomes large, and the width W1 of the cassette block for housing the plurality of cassettes 12 becomes large. Since the width of the vacuum processing block (W2≈W1) is determined in accordance with this W1, the vacuum processing apparatus 800 as a whole requires a large space. Further, when the widths W1 and W2 of the cassette block and the vacuum processing block are increased, the doors 214 and 216 are unavoidably increased in size, and a large maintenance space MS is required to secure a space for opening and closing the doors 214 and 216. You will need it. As an example, if a conventional device handles a 12-inch sample, W1 = W2 = 150 cm, G1 = G2
= 90 cm, and MS = 90 cm becomes a maintenance space between the adjacent vacuum processing apparatus 100. This undesirably increases the effective occupied area of the vacuum processing apparatus 800 in each bay area.

An example of the mutual relation of various elements in the vacuum processing apparatus according to the present invention will be described with reference to FIG. As shown in the figure, it is shifted to either the left or right of the line LL connecting the intermediate position between the load lock chamber 4 and the unload lock chamber 5 and the center of the processing chamber 6, that is, to the side end side of the vacuum processing unit. Thus, the swing center O1 of the arm of the vacuum robot 10 is arranged. Further, the post-treatment chamber 7 is arranged on the opposite side of the line segment LL. Therefore, the swing range of the arm of the vacuum robot 10 is narrow, and the vacuum robot 1 is located near the side end of the vacuum processing unit.
With such a configuration in which 0s are arranged,
The overall planar shape of the vacuum processing apparatus 100 can be L-shaped. According to such a configuration, the vacuum robot 1
The turning range of the 0 arm is about half of one round of the circumference. By setting the swing range of the arm of the vacuum robot 10 for transferring a wafer within a substantially half circle, the load lock chamber 4, the unload lock chamber 5, the processing chamber 6 and the post-processing chamber can be moved in a circular motion within a half of one round. It is possible to transport one sample 3 to each sample 7. As described above, since the swing range of the arm of the vacuum robot 10 is set within a substantially half circle, the width W2 of the vacuum processing block 2 can be narrowed.

As described above, the vacuum processing apparatus 100 according to the present invention.
Is designed so that the width W1 of the cassette block 1 corresponds to the increase in the diameter of the sample, and the shape and mutual relation of various elements arranged in the vacuum processing apparatus are devised so that the width W2 of the vacuum processing block 2 can be minimized. By reducing the size, the maintenance space is secured, and the effective occupation area of the vacuum processing apparatus 100 in each bay area increases.

Since there is a sufficient maintenance space MS between the vacuum processing blocks 2, there is no obstacle for the operator to open and close the side door 214 to perform the maintenance work. In addition, a sufficient space for opening and closing the door 216 and performing maintenance work is secured between the back surfaces of the respective vacuum processing blocks 2.

In the vacuum processing apparatus 100 of the present invention, the positional relationship between the vacuum processing block 2 and the cassette block 1 is
It can be changed along the longitudinal direction of the cassette block.
For example, as shown in FIGS. 11 and 12, the center line in the longitudinal direction of the vacuum processing block 2 may intersect at the center of the cassette block 1 in the longitudinal direction, in other words, the overall planar shape may be T-shaped. Even if it is T-shaped, the above-mentioned maintenance space M is provided between adjacent vacuum processing blocks 2.
Since S is secured, there is no hindrance for the operator to open and close the side door 214 to perform maintenance work.

The planar shapes of the cassette block 1 and the vacuum processing block 2 of the present invention are substantially (W1 + G1).
As long as the relationship of -W2 = MS is ensured, it does not necessarily have to be a strict rectangle, and it is sufficient if each is substantially a rectangle, in other words, a substantially rectangle. Further, the constituent elements and the positional relationship included in the cassette block 1 and the vacuum processing block 2 may be different from those in the above-described embodiments. For example, in the embodiment shown in FIG. 13, the atmospheric robot 9 of the cassette block 1 is located between the load lock chamber 4 and the unload lock chamber 5 of the vacuum processing block. In this case, the planar shape of the cassette block 1 is strictly a convex shape, and the planar shape of the vacuum processing block 2 is a strictly concave shape, and the vacuum processing apparatus 100 as a whole has a combination of two substantially rectangular shapes. It is a shape. In this example,
The atmospheric robot 9 of the cassette block 1 is located between the load lock chamber 4 and the unload lock chamber 5, and the cassette 1
By arranging 2 movably on the rail 94, even if the atmospheric robot 9 does not move on the rail, the locus of the telescopic arm 91 can move the cassette 12, the load-side load lock chamber 4, and the unload-side load lock. It can be configured to have a locus including the chamber 5. Also in this embodiment, the maintenance space M is provided between the adjacent vacuum processing blocks 2.
S is secured.

FIG. 14 shows another embodiment of the vacuum processing apparatus 100 of the present invention.
In addition to the atmospheric robot 9 and the sample cassette 12, there is a cassette stand 130 and a console box 132 for sample evaluation and inspection.

FIG. 15 shows another embodiment of the vacuum processing apparatus 100 of the present invention.
This is a T-shaped vacuum processing apparatus provided with an atmospheric robot 9 and a sample orientation alignment 11.

FIG. 16 is a plan view of another embodiment of the bay area 200 of the present invention. A pair of L-shaped vacuum processing apparatuses 100A and 100B are arranged to face each other to form a set, and a console is provided between the sets. There is a box 132. In this example,
Although there is no gap G1 described above, the console box 132
Assuming that the width of W3 is W3, the maintenance space is (W1 + W3) -W2 = MS. Since there is no gap G1, in order to perform maintenance on the vacuum processing block 2, the operator needs to enter the area 201B where the vacuum processing block 2 is located from the back of each bay area 200 via the maintenance passage 210. If it is necessary to shorten the access time, a gap G1 may be provided between the console box 132 and the adjacent cassette block 1. At this time, (W1 + W3 + G1) -W2 = MS becomes the maintenance space.

Next, FIG. 17 is a plan view of a bay area incorporating a vacuum processing apparatus according to another embodiment of the present invention. In the vacuum processing apparatus 100 of this example, the cassette bases 16A of the plurality of cassette blocks 1 have a continuous and integrated structure, and the plurality of atmospheric robots 9 run on a common rail 95 above them. The AGV in the bay intervenes between the bay stocker and the atmospheric robot 9, and exchanges the sample with each vacuum processing block 2. In this case, cassette block 1
Is functionally corresponding to each vacuum processing block 2, and it can be considered that a large number of substantially rectangular shapes corresponding to each vacuum processing block 2 are connected.

FIG. 18 is a plan view of a configuration example of the manufacturing line of the present invention. As apparent from FIG. 18, the vacuum processing apparatus 100 of the present invention has an L-shaped or T-shaped planar shape, and even if the intervals between the vacuum processing apparatuses 100 are narrow, a sufficient maintenance space is provided between the vacuum processing blocks 2. MS is secured.

On the other hand, in the conventional rectangular vacuum processing apparatus 800 shown for comparison, in order to secure a sufficient maintenance space MS between the vacuum processing blocks, the intervals between the vacuum processing apparatuses 800 must be increased. I don't get. As a result, like the example, in the line of the same length,
Seven vacuum processing apparatuses 100 of the present invention can be arranged, whereas only five vacuum processing apparatuses 800 of the conventional rectangular shape can be arranged. Considering the entire semiconductor manufacturing line, the difference in the number of the two devices is a large number, which is a great difference in securing the number of the devices installed in the clean room of a predetermined space and saving the footprint. Further, when the sample is transferred from the bay area in which the AGV is present to the bay area in the next step, when the vacuum processing apparatus of the present invention is adopted, the vacuum processing apparatus 7 is provided on one side line of one bay area.
It is possible to process as many as the number of units, while the conventional device can
It can only process the amount of cars. The difference in the number of the two units greatly affects the improvement of the throughput of the semiconductor manufacturing line.

Depending on the content of the vacuum processing, it may be necessary to use the rectangular vacuum processing apparatus 800 in part. Even in such a case, the L-shaped or T-shaped structure according to the present invention is provided adjacent to the rectangular vacuum processing apparatus 800.
By disposing the V-shaped vacuum processing apparatus 100, an appropriate maintenance space MS can be secured between the respective vacuum processing blocks.

FIG. 19 is another example of an overall configuration diagram of a semiconductor manufacturing line partially adopting the vacuum processing apparatus of the present invention. This apparatus includes a line AGV 204, and a sample is transferred between each bay area 200A to 200N and the line AGV 204 by an operator-assisted line automation method. It has the same effect as the example of FIG.

FIG. 20 is another example of the overall configuration of a semiconductor manufacturing line in which the vacuum processing apparatus of the present invention is partially adopted. This equipment is Bay AGV202 and Line AGV20.
4 in each bay area and each bay area 20
The transfer of the sample between 0A to 200N and the line AGV204 is a fully automated method that is performed without an operator. Also in this case, the L-shaped or T-shaped vacuum processing apparatuses 100 of the present invention, or the L-shaped or T-shaped vacuum processing apparatus 100 and the rectangular vacuum processing apparatus 800.
By arranging and adjacently, it is possible to secure an appropriate maintenance space MS between the respective vacuum processing blocks.

In the above embodiment, the cassette and the atmospheric transfer robot are arranged in the atmospheric atmosphere, and the atmospheric transfer robot operates in the atmospheric atmosphere. However, instead of this, for example, FIG. As shown in FIG. 22 and FIG. 22, the cassette 12 may be arranged in a vacuum atmosphere and the transfer robot 10 may operate only in the vacuum atmosphere. The example of FIG. 21 shows the case where there are two cassettes 12, and FIG. 22 shows the case where there are three cassettes 12. In either case, the vacuum processing apparatus as a whole has a T shape.

21 and 22, the sample in the cassette 12 is taken out, the sample taken out is transferred to the vacuum processing region, the sample is transferred from the vacuum processing region, and the position of the sample in the cassette is set. The storage in each is carried out by the vacuum transfer robot 10 in a vacuum atmosphere. In this case, as a vacuum processing system, as a general rule, the funnel lock chamber, the unload
It is not necessary to provide a lock room, so that the number of elements for the sequential data update of the host computer is reduced by this amount.

In this case, the sample is stored in the cassette by the wafer checking means in a vacuum atmosphere. Further, in the case of having a means for adjusting the orientation of the sample before processing, this orientation adjustment is carried out in a vacuum atmosphere.

Further, between the cassette and the vacuum processing area,
In the case where the intermediate cassette is provided in the vacuum atmosphere, a robot that conveys the sample between the cassette and the intermediate cassette and a robot that conveys the sample between the vacuum processing region are respectively provided.

In the vacuum processing system corresponding to this, since the intermediate cassette is installed, the number of elements for the sequential data update of the upper computer increases by this amount.

Furthermore, in the above embodiments, it was described that the sample storage state in the cassette, the sample transport state, and the vacuum processing state are all in the horizontal posture with the sample surface of the sample facing upward. There is no particular problem with the posture of other postures.

[0127]

According to the present invention, it is possible to provide a vacuum processing apparatus capable of suppressing an increase in manufacturing cost while responding to an increase in the diameter of a sample and having excellent maintainability. In addition, by incorporating the vacuum processing apparatus of the present invention into a semiconductor manufacturing line, it is possible to secure a necessary number of installed vacuum processing apparatuses while suppressing an increase in manufacturing cost while supporting a large diameter sample, and maintainability is also improved. It is possible to provide a semiconductor manufacturing line that does not deteriorate.

[Brief description of drawings]

FIG. 1 is an external perspective view of a vacuum processing apparatus according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a main part of the apparatus of FIG.

FIG. 3 is a diagram showing a planar configuration of the vacuum processing apparatus taken along line II-II in FIG.

4 is a cross-sectional view taken along the line IV-IV of the apparatus shown in FIG.

FIG. 4 is a diagram showing a sample transport path of the embodiment of FIG.

FIG. 5 is a plan view showing an example of a bay area of a semiconductor manufacturing line incorporating the vacuum processing apparatus of the present invention.

FIG. 6 is a diagram showing a part of the flow of the sample 3 in the semiconductor manufacturing line according to the example of the present invention.

FIG. 7 is a diagram showing a size relationship between the vacuum processing block 2 and the cassette block 1.

FIG. 8 is an explanatory diagram of maintenance of the vacuum processing block of the vacuum processing apparatus of the present invention.

FIG. 9 is a plan view showing a configuration example of a conventional vacuum processing apparatus.

FIG. 10 is a diagram showing an example of the mutual relation of various elements in the vacuum processing apparatus in the present invention.

FIG. 11 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

12 is a perspective view of the vacuum processing apparatus of FIG.

FIG. 13 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 14 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 15 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 16 is a plan view of another embodiment of the bay area of the present invention.

FIG. 17 is a plan view of another embodiment of the bay area of the present invention.

FIG. 18 is a plan view of a configuration example of the production line of the present invention.

FIG. 19 is a plan view of a configuration example of a production line of the present invention.

FIG. 20 is a plan view of a configuration example of the production line of the present invention.

FIG. 21 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 22 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

[Explanation of symbols]

1 ... Cassette block, 2 ... Vacuum processing block, 3 ... Buffer chamber, 4 ... Load side load lock chamber, 5 ... Unload side load lock chamber, 6 ... Vacuum processing chamber, 7 ... Post vacuum processing chamber, 9 ... Atmospheric robot 10 ... vacuum robot, 100 ...
Vacuum processing device

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[Procedure amendment]

[Submission date] December 4, 1995

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of drawings]

FIG. 1 is an external perspective view of a vacuum processing apparatus according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view of a main part of the apparatus of FIG.

FIG. 3 is a diagram showing a planar configuration of the vacuum processing apparatus taken along line II-II in FIG.

4 is a cross-sectional view taken along the line IV-IV of the apparatus shown in FIG.

FIG. 5 is a plan view showing an example of a bay area of a semiconductor manufacturing line incorporating the vacuum processing apparatus of the present invention.

FIG. 6 is a diagram showing a part of the flow of the sample 3 in the semiconductor manufacturing line according to the example of the present invention.

FIG. 7 is a diagram showing a size relationship between the vacuum processing block 2 and the cassette block 1.

FIG. 8 is an explanatory diagram of maintenance of the vacuum processing block of the vacuum processing apparatus of the present invention.

FIG. 9 is a plan view showing a configuration example of a conventional vacuum processing apparatus.

FIG. 10 is a diagram showing an example of the mutual relation of various elements in the vacuum processing apparatus in the present invention.

FIG. 11 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

12 is a perspective view of the vacuum processing apparatus of FIG.

FIG. 13 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 14 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 15 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 16 is a plan view of another embodiment of the bay area of the present invention.

FIG. 17 is a plan view of another embodiment of the bay area of the present invention.

FIG. 18 is a plan view of a configuration example of the production line of the present invention.

FIG. 19 is a plan view of a configuration example of a production line of the present invention.

FIG. 20 is a plan view of a configuration example of the production line of the present invention.

FIG. 21 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

FIG. 22 is a diagram showing a planar configuration of a vacuum processing apparatus according to another embodiment of the present invention.

[Explanation of Codes] 1 ... Cassette block, 2 ... Vacuum processing block, 3 ... Buffer chamber, 4 ... Load side load lock chamber, 5 ... Unload side load lock chamber, 6 ... Vacuum processing chamber, 7 ... Post-vacuum processing chamber , 9 ... Atmosphere robot, 10 ... Vacuum robot, 100 ...
Vacuum processing device

Claims (15)

[Claims] 1. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a cassette containing a sample is placed, and the vacuum processing block vacuum-processes the sample. In a vacuum processing apparatus in which a processing chamber and a vacuum transfer means for transferring the sample are arranged, planar shapes of the cassette block and the vacuum processing block are substantially rectangular, and the width of the cassette block is W1, and the vacuum is A vacuum processing apparatus, wherein W1-W2≥Cw, where W2 is the width of the processing block and Cw is the width of the cassette. 2. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a cassette containing a sample is placed, and the vacuum processing block vacuum-processes the sample. In a vacuum processing apparatus in which a processing chamber and a vacuum transfer means for transferring the sample are arranged, a width dimension of the vacuum processing block is made smaller than a width dimension of the cassette block, and a planar shape of the vacuum processing apparatus is L. A vacuum processing apparatus characterized by being formed in a letter shape or a T shape. 3. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a plurality of cassettes containing samples are placed, and an atmospheric transfer means for transferring the samples. The vacuum processing block includes a processing chamber for vacuum-processing the sample, a load-side load lock chamber and an unload-side load lock chamber, and between the processing chamber and the both load lock chambers. A vacuum processing device configured to transfer the sample between the cassette and the load lock chambers by a vacuum transfer means for transferring the sample, and the cassette block. Each of the vacuum processing blocks has a substantially rectangular planar shape, the width of the cassette block is W1, the width of the vacuum processing block is W2, and the width of the cassette is Cw. When the vacuum processing apparatus being characterized in that the W1-W2 ≧ Cw. 4. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a plurality of cassettes containing samples are placed, and an atmospheric transfer means for transferring the samples. The vacuum processing block includes a processing chamber for vacuum-processing the sample, a load-side load lock chamber and an unload-side load lock chamber, and between the processing chamber and the both load lock chambers. A vacuum processing device configured to transfer the sample between the cassette and the load lock chambers by a vacuum transfer means for transferring the sample, and the cassette block. Each of the vacuum processing blocks has a substantially rectangular planar shape, and the width dimension of the vacuum processing block is smaller than that of the cassette block. A vacuum processing apparatus, wherein the planar shape of the table is L-shaped or T-shaped. 5. A cassette block and a vacuum processing block,
The cassette block is provided with a cassette table on which the cassette containing the sample is placed, and the vacuum processing block is configured to vacuum the sample. A processing chamber for processing, a load side load lock chamber and an unload side load lock chamber, and a vacuum transfer means for transferring the sample between the process chamber and the both load lock chambers are arranged. In the vacuum processing apparatus configured to transfer the sample between the cassette and the load lock chambers by the atmospheric transfer means, the planar shapes of the cassette block and the vacuum processing block are substantially rectangular. If the width of the cassette block is W1, the width of the vacuum processing block is W2, and the width of the cassette is Cw, then W1−W2 ≧ Cw. That vacuum processing apparatus. 6. The vacuum block has a width of W1, a gap between adjacent cassette blocks is G1, and the vacuum block has a width of W1. W2,
2. When the gap between adjacent vacuum processing blocks is G2, W1> W2 and G1 <G2, and W1-W2 = MS is used as the maintenance space.
The vacuum processing apparatus according to claim 5. 7. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a cassette containing a sample is placed and an atmospheric transfer means for transferring the sample, The vacuum processing block includes a processing chamber for vacuum-processing the sample, a load side load lock chamber and an unload side load lock chamber, and the sample between the processing chamber and the both load lock chambers. A vacuum transfer device for transferring the sample between the cassette and the load lock chambers by the atmospheric transfer device. The planar shapes of the processing blocks are substantially rectangular, the width of the cassette block is W1, and the gap between adjacent cassette blocks is G1.
When the width of the vacuum processing block is W2, the gap between adjacent vacuum processing blocks is G2, and the width of the cassette is Cw, W1−W2 ≧ Cw, G1 <G2. Vacuum processing equipment. 8. The vacuum processing apparatus according to claim 7, wherein W1 ≧ 2d and W1−W2 ≧ d, where d is the maximum diameter of the sample to be processed. 9. The vacuum processing apparatus according to claim 1, wherein the cassette block is configured to accommodate a sample having a diameter of 300 mm or more. 10. A cassette block and a vacuum processing block, wherein the cassette block is provided with a cassette table on which a cassette containing a sample is placed, and the vacuum processing block is used for etching the sample. In a vacuum processing apparatus in which an etching processing apparatus and a vacuum transfer means for transferring the sample are arranged, the planar shapes of the cassette block and the vacuum processing block are substantially rectangular, and the width of the cassette block is W1, A vacuum processing apparatus, wherein W1-W2≥Cw, where W2 is the width of the vacuum processing block and Cw is the width of the cassette. 11. A semiconductor manufacturing line in which a plurality of bay areas each incorporating a plurality of vacuum processing devices each comprising a cassette block and a vacuum processing block are arranged in the order of the semiconductor manufacturing process, and a sample is placed in the cassette block. A vacuum stage is provided with a cassette table on which a stored cassette is placed, and a processing chamber for vacuum-processing the sample and a vacuum transfer means for transferring the sample are arranged in the vacuum processing block. At least one of which is configured such that the cassette block can accommodate a sample having a diameter of 300 mm or more, where W1 is the width of the cassette block, W2 is the width of the vacuum processing block, and Cw is the width of the cassette. , W1−W2 ≧ Cw, a semiconductor manufacturing line. 12. Each of the bay areas has a stocker, and the transport of the sample along a manufacturing line and the transport of each of the bay areas to a stocker are performed by a line AGV. The transport of bay AGV
12. The semiconductor manufacturing line according to claim 11, wherein 13. A method for constructing a line of a semiconductor manufacturing apparatus, comprising a plurality of vacuum processing devices each comprising a cassette block capable of accommodating a sample having a diameter of 300 mm or more and a vacuum processing block for performing a vacuum process on the sample. At least one of the vacuum processing apparatus has a width dimension of the cassette block larger than a width dimension of the vacuum processing block, and a planar shape of the vacuum processing apparatus is L-shaped or T-shaped. A method for constructing a semiconductor manufacturing line, characterized in that a maintenance space is secured between an L-shaped or T-shaped vacuum processing apparatus and an adjacent vacuum processing apparatus. 14. A semiconductor manufacturing line in which a plurality of bay areas in which a plurality of the vacuum processing apparatuses are incorporated are arranged in the order of semiconductor manufacturing steps, the line including an AGV and a bay AGV, and each bay area. Has a stocker,
The transfer of the sample along the manufacturing line and the transfer to the stocker of each bay area are performed by the line AGV, and the transfer of the stocker of each bay area and the inside of the bay area are performed by the bay AGV. The semiconductor manufacturing line configuration method according to claim 13. 15. The method for constructing a semiconductor manufacturing line according to claim 13, wherein the vacuum processing apparatus includes an etching processing apparatus for etching the sample.