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TWD112952S1 - Semiconductor manufacturing machine - Google Patents

Semiconductor manufacturing machine

Info

Publication number
TWD112952S1
TWD112952S1 TW094305058F TW94305058F TWD112952S1 TW D112952 S1 TWD112952 S1 TW D112952S1 TW 094305058 F TW094305058 F TW 094305058F TW 94305058 F TW94305058 F TW 94305058F TW D112952 S1 TWD112952 S1 TW D112952S1
Authority
TW
Taiwan
Prior art keywords
chamber
transfer arm
base bed
loading
manufacturing machine
Prior art date
Application number
TW094305058F
Other languages
Chinese (zh)
Inventor
木原秀樹
空岡稔
大平原勇造
永安伸男
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TWD112952S1 publication Critical patent/TWD112952S1/en

Links

Abstract

【物品用途】;本創作的物品是半導體製造機,是針對從前面插入的半導體晶圓,在真空室內進行蝕刻處理等,製造半導體元件的半導體製造機。;【創作特點】;如立體圖及俯視圖所示,該製造機具有一略呈矩形狀的基床部,在該基床部的上方以對稱的方式依序配置著蝕刻室、昇降裝置、研磨室、真空交換室、晶圓匣載置台,以及各一搬送臂、監視器部、裝載室等;其中,該蝕刻室為一矩形體,且呈Y字形被安裝在基床部上,同時在蝕刻室的兩側,分別安裝長柱形的昇降裝置,而在該基床部的略中央處,配置一多角形的搬送臂,而該搬送臂的上方形成三個圓形部,且在搬送臂的垂直邊,分別配置略呈矩形狀的研磨室,而該研磨室的頂部上設有圓形網狀部,另外在搬送臂的另兩個斜邊上,分別配置長圓形的真空交換室,除此之外,在基床部的前方配置一直立的大矩形裝載室,在裝載室的左側配置一台監視器部,且在裝載室的前方直立兩座晶圓匣載置台。[Purpose of the article]; The article of this creation is a semiconductor manufacturing machine, which is a semiconductor manufacturing machine that performs etching processing in a vacuum chamber for semiconductor wafers inserted from the front to manufacture semiconductor components. ; [Features of the creation]; As shown in the three-dimensional diagram and the top view, the manufacturing machine has a slightly rectangular base bed, and above the base bed, an etching chamber, a lifting device, a grinding chamber, a vacuum exchange chamber, a wafer cassette loading table, a transfer arm, a monitor unit, a loading chamber, etc. are arranged in a symmetrical manner in sequence; the etching chamber is a rectangular body and is installed in a Y shape on the base bed, and at the same time, long columnar lifting devices are installed on both sides of the etching chamber, and in the slightly middle of the base bed, a A polygonal transfer arm is arranged in the center, and three circular parts are formed above the transfer arm. On the vertical sides of the transfer arm, slightly rectangular grinding chambers are arranged respectively, and a circular mesh part is provided on the top of the grinding chamber. In addition, oblong vacuum exchange chambers are arranged on the other two oblique sides of the transfer arm respectively. In addition, a vertical large rectangular loading chamber is arranged in front of the base bed part, a monitor part is arranged on the left side of the loading chamber, and two wafer box loading tables are upright in front of the loading chamber.

TW094305058F 2005-07-15 2005-08-23 Semiconductor manufacturing machine TWD112952S1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005020680 2005-07-15

Publications (1)

Publication Number Publication Date
TWD112952S1 true TWD112952S1 (en) 2006-09-11

Family

ID=38227471

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094305058F TWD112952S1 (en) 2005-07-15 2005-08-23 Semiconductor manufacturing machine

Country Status (2)

Country Link
US (1) USD546354S1 (en)
TW (1) TWD112952S1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD990538S1 (en) * 2021-02-05 2023-06-27 Syskey Technology Co., Ltd. Miniaturized semiconductor manufacturing device
USD989830S1 (en) * 2021-05-14 2023-06-20 Hitachi High-Tech Corporation Semiconductor substrate transfer apparatus
USD989831S1 (en) * 2021-05-14 2023-06-20 Hitachi High-Tech Corporation Apparatus for evaluating semiconductor substrate
USD989144S1 (en) * 2021-05-14 2023-06-13 Hitachi High-Tech Corporation Apparatus for evaluating semiconductor substrate

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD365584S (en) * 1993-12-15 1995-12-26 Tokyo Electron Kabushiki Kaisha Semiconductor manufacturing device
US6447232B1 (en) * 1994-04-28 2002-09-10 Semitool, Inc. Semiconductor wafer processing apparatus having improved wafer input/output handling system
JPH0936198A (en) * 1995-07-19 1997-02-07 Hitachi Ltd Vacuum processing apparatus and semiconductor manufacturing line using the same
US6942738B1 (en) * 1996-07-15 2005-09-13 Semitool, Inc. Automated semiconductor processing system
US6723174B2 (en) * 1996-03-26 2004-04-20 Semitool, Inc. Automated semiconductor processing system
US6050891A (en) * 1998-02-06 2000-04-18 Applied Materials, Inc. Vacuum processing system with turbo-axial fan in clean-air supply system of front end environment
KR100348938B1 (en) * 1999-12-06 2002-08-14 한국디엔에스 주식회사 Semiconductor manufacturing apparatus for photolithography process
JP2002305232A (en) * 2001-01-22 2002-10-18 Cosam Inc Semiconductor manufacturing equipment

Also Published As

Publication number Publication date
USD546354S1 (en) 2007-07-10

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