JPH09129499A - Manufacture of laminated electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a laminated electronic part with which manufacturing cost can be reduced by reusing a carrier film by a method wherein a green sheet can be pulled out without scratching the carrier film. SOLUTION: A cut line of rectangular profile is formed by penetrating a punching blade 3 to the depth which does not come into contact with the surface of a carrier film F to a ceramic green sheet S, and the ceramic green sheet Sa inside the cut line is taken out by attractingly holding it by an attraction head 2. As a result, the flaw which was conventionally generated, is not generated on the surface of the carrier film F in a process in which a ceramic green sheet Sa is pulled out. To be more precise, if the remains of the sheet of the carrier film F is removed after the ceramic green sheet Sa has been pulled out, the carrier film F can be reused, and the repeated use of the carrier film F greatly contributes to the reduction in manufacturing cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a laminated electronic component manufactured by stacking ceramic green sheets having a predetermined size.

[0002]

2. Description of the Related Art A typical multilayer capacitor as a multilayer electronic component has been conventionally manufactured as follows.

First, the surface of a carrier film made of PET or the like is coated with a ceramic slurry in a uniform thickness by a coating method using a doctor blade, a reverse roll coater or the like, and this is dried to form a ceramic on the carrier film. Form a green sheet.

Next, a conductor paste is printed in a predetermined pattern on the surface of the ceramic green sheet by screen printing or the like, and the conductor paste is dried to form a conductor layer to be an internal electrode.

Next, the carrier film on which the ceramic green sheets are formed is conveyed onto a pedestal, and the cutting edge of the punching blade is cut into the ceramic green sheets to punch the ceramic green sheets to a predetermined size.

Next, the punched ceramic green sheets of a predetermined size are peeled off from the carrier film, extracted, and stacked. The above procedure is repeated until a predetermined number of ceramic green sheets having a predetermined size are stacked, and after stacking, this is pressed to obtain a laminate.

Next, the laminate is cut into a size corresponding to each component and fired, and a conductor paste is applied to both ends of the fired chip and baked to form an external electrode. A solder plating layer or the like is formed on the surface.

FIG. 4 shows an apparatus generally used in the above-mentioned sheet extracting process. In the figure, 101 is a base, 102 is a suction head, 103 is a punching blade, F is a carrier film, and S is a film. Is a ceramic green sheet.

The base 101 has a flat upper surface larger than the width of the carrier film F, and a large number of suction holes 101 are formed on the upper surface.
a. These suction holes 101a are connected to a negative pressure source (not shown), and apply a suction force as necessary to suck and hold the carrier film F.

The suction head 102 has a flat lower surface facing parallel to the upper surface of the base 101, and a large number of suction holes 1 are formed on the lower surface.
02a. These suction holes 102a are connected to a negative pressure source (not shown), and apply a suction force as necessary to suck the punched ceramic green sheet.
The suction head 102 is capable of vertical movement in a direction perpendicular to the upper surface of the base 101 and horizontal movement to the sheet stacking position.

The punching blade 103 is configured by arranging a flat blade having a sharp cutting edge on the four side surfaces of the suction head 102 without a gap, or a square tubular blade having the same cutting edge around the suction head 102. The blade edge projects downward from the lower surface of the suction head 102. The blade edge protrusion amount is set to be slightly larger than the thickness of the ceramic green sheet S after drying.

[0012]

In the above conventional method,
As shown in FIG.
As shown in (a), the punching blade 103 is made to dig into the ceramic green sheet S on the carrier film F to such a depth that the cutting edge slightly enters the surface of the carrier film F. As shown in the drawing, a scar Fa is formed on the surface of the carrier film F by the cutting edge. Such a carrier film F cannot be reused even if the sheet debris is removed, and since it is normally disposed of only once, the cost is heavy. This problem may occur not only in the case of the multilayer capacitor, but also in the case of performing similar sheet extraction in other multilayer electronic components such as a multilayer inductor and a thick film multilayer substrate.

The present invention has been made in view of the above problems. An object of the present invention is to make it possible to remove a sheet without damaging the carrier film, thereby making it possible to reuse the carrier film and to reduce the manufacturing cost. It is an object of the present invention to provide a method for manufacturing a multilayer electronic component that can contribute to reduction of power consumption.

[0014]

In order to achieve the above object, the present invention relates to a laminated electronic device in which a ceramic green sheet having a predetermined size is extracted from a ceramic green sheet formed on the surface of a carrier film and stacked. In the method of manufacturing a component, a carrier film having a ceramic green sheet formed on the surface is conveyed onto a pedestal, and a punching blade bites into the ceramic green sheet to a depth at which the cutting edge does not contact the surface of the carrier film. It has a step of forming a contour cut line, sucking and holding the ceramic green sheet inside the cut line with a suction head, and taking out the carrier film on the surface of which the ceramic green sheet is formed. Conveying and punching a punching blade with a round edge against the ceramic green sheet Previously by biting depth for pressing the carrier film surface to form a score line of a predetermined contour,
Its main feature is that it has a step of sucking and holding the ceramic green sheet inside the score line with a suction head and pulling it out.

In the method of manufacturing a laminated electronic component according to the present invention, a punching blade is made to penetrate into the ceramic green sheet to a depth such that the cutting edge does not contact the surface of the carrier film to form a cut line having a predetermined contour, or , A ceramic green sheet having a rounded cutting edge is formed into a cutting line having a predetermined contour by cutting the cutting edge to a depth at which the cutting edge is pressed against the surface of the carrier film. No scratches are formed on the surface of the carrier film in the extracting step unlike the conventional case. That is, the carrier film can be reused by removing the sheet debris on the carrier film after extracting the ceramic green sheet having a predetermined size.

[0016]

Embodiments of the present invention will be described below with reference to the drawings. The present invention can be applied to various laminated electronic components such as a laminated capacitor, a laminated inductor, and a thick film multilayer substrate. Here, an example in which the present invention is applied to a laminated capacitor as in the conventional example will be described. Further, the manufacturing method of the multilayer capacitor is the same as the conventional one except the step of extracting the ceramic green sheet having a predetermined size, and therefore, only the improving step will be mainly described here to avoid duplication of description.

FIG. 1 shows a procedure for extracting a ceramic green sheet having a predetermined size. In the figure, 1 is a base, 2 is a suction head, 3 is a punching blade, F is a carrier film, and S is ceramic. It is a green sheet.

The base 1 has a flat upper surface larger than the width of the carrier film F, and has a large number of suction holes 1a on the upper surface. These suction holes 1a are connected to a negative pressure source (not shown), and apply a suction force as needed to suck and hold the carrier film F.

The suction head 2 has a flat lower surface facing in parallel with the upper surface of the base 1, and has a large number of suction holes 2a on the lower surface. These suction holes 2a are connected to a negative pressure source (not shown), and apply a suction force larger than the sheet adhering force to the carrier film as necessary to suck and hold the punched ceramic green sheet Sa. The suction head 2 is capable of vertical movement in a direction perpendicular to the upper surface of the base 1 and horizontal movement to the sheet stacking position.

The punching blade 3 is constructed by arranging a flat blade having a sharp cutting edge on the four side surfaces of the suction head 2 without a gap, or a square cylindrical blade having the same cutting edge around the suction head 2. And the blade edge projects downward from the lower surface of the suction head 2. This blade edge protrusion amount is set to be slightly smaller than the thickness of the dried ceramic green sheet S.

At the time of removing the sheet, first, the carrier film F having the ceramic green sheet S formed on the surface is conveyed onto the base 1 and stopped at a predetermined position. Then, a suction force is applied to the suction holes 1a of the base 1 to suck and hold the lower surface of the carrier film F on the base 1.

Next, as shown in FIG. 1 (a), the suction head 2 is moved down by a predetermined stroke to bring the lower surface of the suction head 2 into close contact with the upper surface of the ceramic green sheet S, and the cutting edge of the punching blade 3 to the carrier film F. Let it bite into the upper ceramic green sheet S. As described above, since the protruding amount of the punching blade 3 is set to be slightly smaller than the thickness of the ceramic green sheet S, the cutting edge of the punching blade 3 does not reach the surface of the carrier film F, A gap t1 of about several μm is formed between the cutting edge and the surface of the carrier film. That is, when the punching blade 3 bites into the ceramic green sheet S, a cut line having a depth smaller than the sheet thickness is formed in the sheet S with a rectangular contour.

Next, as shown in FIG. 1B, a suction force is applied to the suction holes 2a of the suction head 2 to suck and hold the ceramic green sheet Sa inside the score line, and the suction head 2 is raised. After returning, the sheet Sa is separated from the carrier film F and removed. Sheet Sa inside the score line
Adheres to the sheet main body S through the gap t1. However, since the thickness of the portion is extremely thin, it can be easily torn off during the ascending and returning process of the suction head 2. At this time, the sheet main body S There is no concern that the extracted sheet Sa will be deformed.

As described above, in the above-described method, the punching blade 3 is cut into the ceramic green sheet S to a depth such that the cutting edge does not contact the surface of the carrier film F to form a cut line having a rectangular contour. Since the ceramic green sheet Sa on the inside of the score line is sucked and held by the suction head 2 and taken out, the surface of the carrier film F has a conventional scratch in the step of extracting the ceramic green sheet Sa having a predetermined size. Does not happen. In other words, if the sheet debris on the carrier film F is removed after the ceramic green sheet Sa having a predetermined size is removed, the carrier film F can be reused, and the carrier film F can be used repeatedly. It can greatly contribute to cost reduction.

FIG. 2 shows another procedure for extracting the ceramic green sheet having a predetermined size.
Is a base, 12 is a suction head, 13 is a punching blade, F is a carrier film, and S is a ceramic green sheet.

The base 11 has a flat upper surface larger than the width of the carrier film F, and has a large number of suction holes 11a on the upper surface. These suction holes 11a are connected to a negative pressure source (not shown), and apply a suction force as necessary to suck and hold the carrier film F.

The suction head 12 has a flat lower surface facing the upper surface of the base 1 in parallel, and has a large number of suction holes 12a on the lower surface. These suction holes 12a are connected to a negative pressure source (not shown), and apply a suction force larger than the sheet adhering force to the carrier film as necessary to suck and hold the punched ceramic green sheet Sa. The suction head 12 is capable of vertical movement in a direction perpendicular to the upper surface of the base 11 and horizontal movement to the sheet stacking position.

The punching blade 13 is configured by arranging flat blades having a round blade edge on the four side surfaces of the suction head 12 with no gaps or quadrangular cylindrical blades having the same blade edge around the suction head 12. The cutting edge projects downward from the lower surface of the suction head 12. The blade edge protrusion amount is set to be slightly larger than the thickness of the ceramic green sheet S after drying.

At the time of removing the sheet, first, the carrier film F having the ceramic green sheet S formed on the surface is conveyed onto the base 11 and stopped at a predetermined position. Then, a suction force is applied to the suction holes 11 a of the base 11 to suck and hold the lower surface of the carrier film F on the base 11.

Next, as shown in FIG. 2A, the suction head 12 is lowered by a predetermined stroke to bring the lower surface thereof into close contact with the upper surface of the ceramic green sheet S, and the cutting edge of the punching blade 13 to the carrier film F. Let it bite into the upper ceramic green sheet S. As described above, since the protruding amount of the punching blade 3 is set to be slightly larger than the thickness of the ceramic green sheet S, the rounded cutting edge of the punching blade 13 has a slight depth on the surface of the carrier film F. Only t2 enters and the same part is pressed and deformed downward. That is, when the punching blade 13 bites into the ceramic green sheet S, a cut line having a depth equal to the sheet thickness is formed in the sheet S with a rectangular contour.

Next, as shown in FIG. 2B, a suction force is applied to the suction holes 12a of the suction head 12 to suck and hold the ceramic green sheet Sa inside the score line, and the suction head 12 is raised. After returning, the sheet Sa is separated from the carrier film F and removed. The sheet Sa on the inside of the score line may be attached to the sheet main body S via a portion that cannot be completely cut by the cutting blade 13, but since the thickness of the portion is extremely thin, the suction head 12
You can easily tear this off in the process of rising
At this time, there is no concern that the sheet body S and the pulled-out sheet Sa will be deformed.

As described above, in the above method, the punching blade 13 having the round punching blade with respect to the ceramic green sheet S is used.
Is cut into a depth where the blade edge is pressed against the surface of the carrier film F to form a rectangular cut line, and the ceramic green sheet Sa inside the cut line is sucked and held by the suction head 2 and taken out. Therefore, in the process of extracting the ceramic green sheet Sa having a predetermined size, the surface of the carrier film F is not scratched as in the conventional case. That is, the ceramic green sheet S having a predetermined size
If the sheet debris on the carrier film F is removed after removing a, the carrier film F can be reused, and the carrier film F can be repeatedly used, which can greatly contribute to reduction in manufacturing cost.

By the way, the sheet extracting method shown in FIG. 1 and the sheet extracting method shown in FIG. 2 do not completely cut the sheet as in the conventional case, so that the peripheral edge of the sheet Sa is removed. There is a possibility that burrs will remain on. If this is disliked, as shown in FIG. 3, the first suction head 31 and the punching blade 32, and the second suction head 41 and the punching blade 42 that are smaller than this are prepared, and the sheet is pulled out. It is advisable to carry out in two steps.

The first suction head 31 and the punching blade 32 are
The structure is the same as that used in each of the sheet extracting method shown in FIG. 1 and the sheet extracting method shown in FIG. 2, and a ceramic green sheet Sa of a predetermined size is sucked onto the first suction head 31. Is held.

On the other hand, the second suction head 41 has a flat upper surface facing in parallel with the lower surface of the first suction head 31, and has a large number of suction holes 41a on the upper surface. These suction holes 41a are connected to a negative pressure source (not shown), and apply a suction force larger than that on the side of the first suction head as required to suck and hold the punched ceramic green sheet Sb. The second suction head 41 corresponds to the first suction head 3
Vertical movement in a direction perpendicular to the lower surface of 1 and 180 degree inversion,
Horizontal movement to the sheet stacking position is possible. Further, the second punching blade 42 is configured by arranging flat blades having a sharp blade edge on the four side surfaces of the suction head 42 without a gap, or quadrangular cylindrical blades having the same blade edge around the suction head 41. The blade edge is projected upward from the upper surface of the suction head 41. The blade edge protrusion amount is set to be the same as the thickness of the dried ceramic green sheet S.

When removing the sheet, first, FIG.
As shown in (a), using the first suction head 31 and the punching blade 32, the sheet extracting method shown in FIG. 1 or the sheet extracting method shown in FIG. Sa is the first suction head 31
To be held by suction.

Next, as shown in FIG. 3B, the second suction head 41 is raised by a predetermined stroke to bring the upper surface thereof into close contact with the lower surface of the ceramic green sheet Sa, and the second punching blade 42. The cutting edge of is cut into the ceramic green sheet Sa. As described above, since the amount of protrusion of the cutting edge of the second punching blade 42 is set to be the same as the thickness of the ceramic green sheet Sa, the cutting edge of the punching blade 42 contacts the lower surface of the head. That is, when the second punching blade 42 bites into the ceramic green sheet Sa, a cut line having the same depth as the sheet thickness is formed in a rectangular contour on the sheet Sa, and the sheet Sa is completely cut.

Next, the suction hole 41 of the second suction head 41
A suction force is applied to a to attract and hold the ceramic green sheet Sb on the inside of the score line, and the attraction head 41 is lowered and returned to separate and pull out the sheet Sb from the first attraction head 31.

In this way, even if burrs remain on the periphery of the sheet Sa in the first sheet removal, the burr-free sheet Sb can be obtained by the second sheet removal by the second suction head 41 and the punching blade 42. 2 is possible if the area of the first sampling sheet is set to be large.
A sheet having a desired size can be obtained by the sheet withdrawal for the next time.

[0040]

As described above in detail, according to the inventions of claims 1 and 2, in the process of extracting the ceramic green sheet of a predetermined size, the surface of the carrier film is not scratched as in the conventional case. It is possible to reuse the carrier film by removing the sheet debris on the carrier film after pulling out the ceramic green sheet of a predetermined size, making it possible to reuse the carrier film and greatly contributing to the reduction of manufacturing cost. it can.

According to the third aspect of the present invention, even if the burr remains on the peripheral edge of the sheet by the first sheet removal, the second
A burr-free sheet can be obtained by the second sheet withdrawing using the suction head and the punching blade, and if the area of the first withdrawing sheet is set to a large area, the sheet with the desired size can be obtained by the second sheet withdrawing. Obtainable. Other effects are similar to those of the first and second aspects of the invention.

[Brief description of the drawings]

FIG. 1 is a diagram showing a procedure for extracting a sheet according to the present invention.

FIG. 2 is a diagram showing another procedure of sheet withdrawal according to the present invention.

FIG. 3 is a diagram showing still another procedure of sheet withdrawal according to the present invention.

FIG. 4 is a cross-sectional view of a conventional device used for sheet removal.

FIG. 5 is an explanatory diagram of a conventional problem.

[Explanation of symbols]

1, 11 ... Platform, 1a, 11a ... Suction holes, 2, 12, 3
1, 41 ... Suction heads 2a, 12a, 31a, 41a
... suction holes, 3, 13, 32, 42 ... punching blades, F ... carrier film, S ... ceramic green sheet, Sa, S
b ... The removed ceramic green sheet.

Claims (3)

[Claims] 1. A method of manufacturing a laminated electronic component, wherein a ceramic green sheet having a predetermined size is extracted from a ceramic green sheet formed on the surface of a carrier film and the stacked ceramic green sheets are stacked, and a ceramic green sheet is formed on the surface. The carrier film is conveyed onto the base plate, the punching blade is cut into the ceramic green sheet to a depth where the cutting edge does not contact the surface of the carrier film to form a cut line with a predetermined contour, and the ceramic inside the cut line is formed. A method of manufacturing a multilayer electronic component, comprising a step of sucking and holding a green sheet with a suction head and extracting the green sheet. 2. A method of manufacturing a laminated electronic component, wherein a ceramic green sheet having a predetermined size is extracted from a ceramic green sheet formed on the surface of a carrier film and the stacked ceramic green sheets are stacked, and the ceramic green sheet is formed on the surface. The carrier film is conveyed onto the base plate, and a punching blade having a rounded blade edge is cut into the ceramic green sheet to a depth at which the blade edge is pressed against the surface of the carrier film to form a cut line having a predetermined contour, and the cut is made. A method of manufacturing a multilayer electronic component, comprising a step of sucking and holding a ceramic green sheet on the inner side of a line with a suction head and pulling it out. 3. A cutting line having a predetermined contour is formed by causing the second punching blade to bite into the ceramic green sheet sucked and held by the suction head to a depth at which the cutting edge contacts the head suction surface. 3. The method for manufacturing a laminated electronic component according to claim 1, further comprising a step of sucking and holding the ceramic green sheet on the inside of the score line with a second suction head to extract the ceramic green sheet.