JP3036315B2 - Manufacturing method of multilayer ceramic electronic component - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer ceramic electronic component using a laminate formed by laminating ceramic green sheets such as a multilayer capacitor.
In particular, the present invention relates to a method for manufacturing a multilayer ceramic electronic component including a step of obtaining a ceramic laminate by pressing a ceramic green sheet on a lower surface of a holding plate that is moved up and down.

[0002]

2. Description of the Related Art A ceramic green sheet laminating step in an example of a conventional method for manufacturing a multilayer capacitor will be described with reference to FIG.

[0003] A ceramic green sheet supply 2 is mounted on a compression stage 1. The ceramic green sheet supplier 2 has a structure in which ceramic green sheets 4 are laminated on a support film 3 made of polyethylene terephthalate, polypropylene, or the like. Reference numeral 5 denotes a conductive film for forming an internal electrode, which is formed on the support film 3 and is integrated with the ceramic green sheet 4 by molding the ceramic green sheet 4. A cutting line is formed in the ceramic green sheet 4 in advance in accordance with the size of the stacked sheets.

[0004] Above the crimping stage 1, a holding plate 6 which can be moved vertically by a driving source (not shown) is arranged. The lower surface 6a of the holding plate 6 is a flat surface, and a suction hole 7 is formed in the lower surface 6a. Suction hole 7
Is connected to a suction source such as a vacuum pump (not shown), and is formed on the lower surface 6a for sucking and holding a ceramic green sheet described later.

In manufacturing the ceramic laminate, the holding plate 6 is first lowered, and the lower surface 6 a of the holding plate 6 is pressed against the ceramic green sheet 4 on the pressing stage 1.
Thereafter, the holding plate 6 is raised, and the ceramic green sheet 4A punched along the cutting line is held on the lower surface of the lower surface 6a of the holding plate 6.

Next, a new ceramic green sheet 4 is supplied onto the pressure bonding stage 1. In this example, a new ceramic green sheet 4 is supplied below the holding stage 6 by shifting the position of the ceramic green sheet supply body 2 to the side.

Thereafter, the holding plate 6 is lowered, a new ceramic green sheet 4 is pressed against the lower surface of the ceramic green sheet 4A, and a series of steps of raising the holding plate 6 are repeated to hold the holding plate 6 as shown in the figure. A laminate 9 in which a plurality of ceramic green sheets 4A are laminated on the lower surface of the board 6 can be configured. In this case, the above-described metal film 5 for forming an internal electrode is disposed in the laminate 9 together with the ceramic green sheet 4.

A predetermined number of ceramic green sheets 4
After lamination, the laminate 9 is taken out from the lower surface 6a of the holding plate 6 to obtain a mother laminate. Thereafter, the mother laminate obtained as described above is cut in the thickness direction into individual multilayer capacitor units to obtain a laminate green chip. Next, the obtained laminated green chip is fired to obtain a sintered body. By forming predetermined external electrodes on both end surfaces of the obtained sintered body, a multilayer capacitor can be obtained.

[0009]

In the laminating method shown in FIG. 4, an unfired ceramic laminate is obtained by laminating ceramic green sheets below the lower surface 6a of the holding plate 6. However, since the first ceramic green sheet 4A is sucked and held by the suction from the suction hole 7, the portion of the mother laminate taken out from the holding plate 6 is in contact with the suction hole 7 on the upper surface of the mother laminate. There is a problem that marks are generated and the appearance of the laminate is impaired.

On the other hand, without providing the suction hole 7 as described above,
Ceramic green sheet 4 directly on lower surface 6a of holding plate 6
It is also conceivable to make the ceramic green sheet 4A adhere by the action of the binder contained in the ceramic green sheet 4. However, in order to sufficiently press the ceramic laminate, the holding plate 6 is
It is usually made of a material that easily transmits force, for example, metal. Therefore, it is difficult to sufficiently adhere the ceramic green sheet 4A.

Further, even if the ceramic green sheet 4
Even if A can be adhered, in such a case, when the mother laminate is formed and then removed from the lower surface 6a of the holding plate 6, a part of the ceramic green sheet remains on the lower surface 6a of the holding plate 6. However, there is a problem that the lower surface 6a is contaminated. Therefore, conventionally, the suction hole 7 is opened in the lower surface 6a having a certain degree of releasability as described above, and the ceramic green sheet 4A is sucked and held.

[0012] An object of the present invention is to provide a laminated ceramic having a process of laminating a ceramic laminated body in which the appearance of the obtained ceramic laminated body due to suction does not occur and which can be easily and easily removed from a holding plate. An object of the present invention is to provide a method for manufacturing an electronic component.

[0013]

According to the first aspect of the present invention, a step of directly or indirectly placing a ceramic green sheet on a pressure bonding stage and a step of attaching a flat holding surface having a suction hole to a lower surface. Yes, and distribution above the crimping stage
Are location, and preparing a retaining disc which is movable, said holding plate in close proximity to the crimping stage is crimping the ceramic green sheets on pressure bonding stage to the holding surface plate and the plurality of upper and lower Piece of ceramic green
A step of sequentially laminating the sheets on the holding surface , wherein the holding substrate or the film is suction-fixed on the holding surface of the holding plate.
To advance, crimp the ceramic <br/> click the green sheet to said holding substrate or on a film, then the ceramic green
A method for manufacturing a laminated ceramic electronic component , comprising sequentially laminating ceramic green sheets on a sheet by pressure bonding .

Further, in the invention according to claim 2, the holding substrate or the film whose area is smaller than the area of the holding surface of the holding board is used. According to the third aspect of the present invention, the holding substrate or the film that is harder to stretch in the plane direction than the thickness direction is used.

Further, in the invention described in claim 4, the holding substrate or film having a surface subjected to a release treatment is used.

[0016]

According to the first aspect of the present invention, the holding substrate or the film is suction-fixed to the holding surface of the holding plate, and the ceramic green sheet is pressed on the holding substrate or the film. Further, a plurality of ceramic green sheets are laminated. Therefore, since the holding substrate or film is interposed between the holding surface of the holding board and the ceramic green sheet, the upper surface of the obtained ceramic laminate does not deform due to suction.

Further, when the ceramic laminate is removed from the holding plate after the lamination, the ceramic laminate and the holding substrate or film can be easily removed from the holding plate by releasing suction on the holding surface. Therefore, the holding substrate or film may be peeled off from the upper surface of the ceramic laminate after being removed from the holding board. Therefore, the ceramic laminate can be easily removed from the holding substrate or the film.

Therefore, in manufacturing the multilayer ceramic electronic component, it is possible to smoothly and easily remove the ceramic laminate from the holding plate without causing the deformation due to the suction.

Further, when the holding substrate or the film having a smaller area than the holding surface is used as the holding substrate or the film, the ceramic laminate and the holding substrate or the film can be separated from the holding surface. It can be easily removed.

Further, as described in claim 3, if the holding substrate or film is less stretchable in the plane direction than the thickness direction, the holding substrate or film is harder to stretch in the plane direction. In this case, the misalignment between the ceramic green sheets can be effectively prevented. As a result, in the case of a multilayer capacitor, for example, the margin area around the internal electrode can be reduced, and the obtained capacitance can be increased.

Further, as set forth in claim 4, the surface of the holding substrate or the film is subjected to a mold release treatment, so that after the ceramic laminate is obtained, the holding substrate or the film and the ceramic laminate are separated from each other. Can be easily separated.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be clarified by describing embodiments with reference to the drawings. Although the following embodiments are applied to a method for manufacturing a multilayer capacitor, the present invention can be applied to a general method for manufacturing a multilayer ceramic electronic component such as a multilayer inductor, a ceramic multilayer substrate, or a multilayer piezoelectric component. it can.

First, as shown in FIG.
1, a ceramic green sheet supply body 12 is arranged. The ceramic green sheet supplier 12 has a structure in which ceramic green sheets 14 are laminated on a support film 13 made of a synthetic resin film such as a polyethylene terephthalate film. Reference numeral 15 denotes a conductive film for forming an internal electrode, which is formed on the support film 13 and is integrated with the ceramic green sheet 14. Therefore, when the ceramic green sheet 14 is separated, the conductive film 15 is separated from the support film 13 together with the ceramic green sheet 14. The ceramic green sheets 14 are formed in advance with cutting lines corresponding to the size to be laminated.

Next, the holding plate 16 is arranged above the pressure bonding stage 11. The holding board 16 is connected to a drive source (not shown), and is configured to be movable in the vertical direction. The holding plate 16 is provided to apply a force to the ceramic green sheets when the ceramic green sheets described below are pressed. Therefore, it is made of a rigid material such as metal. The holding surface 16a of the holding plate 16 is a flat surface, and a suction hole 17 is formed in the holding surface 16a. The suction hole 17 is connected to a suction source such as a vacuum pump (not shown).

The process up to this point is the same as the conventional ceramic green sheet laminating method shown in FIG. The feature of this embodiment is that, when laminating the ceramic green sheets, the holding substrate 19 is first suctioned and fixed to the lower surface of the holding plate 16. As the holding substrate 19, for example, a substrate made of a synthetic resin such as polyethylene terephthalate can be used, or a holding film made of a synthetic resin film is used instead of the holding substrate 19 having a certain shape-retaining property. Is also good.

The holding substrate 19 is fixed to the holding surface 16a of the holding board 16 by suction from the suction holes 17. FIG. 1 shows a state in which a plurality of ceramic green sheets 14A are stacked, but the ceramic green sheets 14A are not pressed on the lower surface of the holding plate 19 in an initial state. That is, first, the holding substrate 19 is
a, the holding plate 16 held by the holding substrate 1 is lowered, and the holding substrate 1 is placed on the ceramic green sheet 14 on the pressing stage 11.
9 is crimped.

Next, the holding plate 16 is raised, and the ceramic green sheet 14A punched along the above-mentioned cutting line is held on the lower surface of the holding substrate 19 by the above-mentioned press bonding. Thereafter, the position of the ceramic green sheet supply body 12 on the pressing stage 11 is shifted,
A new ceramic green sheet supply part is located below the. Then, the holding plate 16 is lowered again, a new ceramic green sheet 14 is pressed on the lower surface of the ceramic green sheet 14A, and the holding plate 16 is raised again, so that the next ceramic green sheet 14A is placed on the lower surface of the ceramic green sheet 14A. Are laminated.

The ceramic green sheet supply body 12
Disposing the new ceramic green sheet supply body below the pressure bonding stage 16 by shifting the position of
By repeating the steps of lowering 6 and raising the holding plate 16, the ceramic laminate 20 can be formed below the holding substrate 19.

Thereafter, the suction by the suction holes 17 is stopped, and the ceramic laminate 20 is removed from the holding board 16 together with the holding substrate 19. Thereafter, the holding substrate 19 is removed from the upper surface of the ceramic laminate 20 to obtain the ceramic laminate 20.

In the obtained ceramic laminate 20, FIG.
As shown in the partially cutaway sectional view of FIG. 1A, a conductive film 15 for forming an internal electrode is laminated inside with a ceramic green sheet layer interposed therebetween.

Thereafter, the ceramic laminate 20 is cut in the thickness direction to obtain a laminate 21 for each individual multilayer capacitor shown in FIG. 2B. In the laminated body 21, the internal electrodes 22 to 27 formed by cutting the conductive film 15 described above are arranged with a ceramic layer therebetween. The obtained laminate 21 is fired to obtain a sintered body 29 shown in FIG. Both end faces 2 of this sintered body 29
By forming external electrodes 30 and 31 on 9a and 29b according to a known method such as baking and applying a conductive paste, a multilayer capacitor 32 shown in FIG. 3 is obtained.

In the above embodiment, since the holding substrate 19 is interposed between the holding plate 16 and the ceramic green sheet 14A in forming the mother ceramic laminate 20, the obtained mother ceramic laminate 20 is formed. Is not deformed by suction on the upper surface. Moreover, the suction holes 17
By stopping the suction from the mother laminate 20
Can be easily removed from the holding board 16 together with the holding substrate 19. However, the holding substrate 19 is
6 while holding it on the lower surface of the laminate 2 from the holding substrate 19.
0 may be removed.

Since the holding substrate 19 is finally separated from the upper surface of the laminated body 20 as described above,
Preferably, if the surface of the holding substrate 19 is subjected to a release treatment with a fluorine resin, silicon, or the like, the laminate 20 can be removed from the holding substrate 19 more smoothly.

As described above, the holding substrate 19 may be a holding film made of a synthetic resin film. However, if a holding substrate or a film that is harder to stretch in the plane direction than the thickness direction is used. As will be apparent from the experimental examples described later, the misalignment of the ceramic green sheets can be effectively prevented.

The size of the main surface of the holding substrate 19 or the film is preferably slightly smaller than the holding surface 16a of the holding plate 16, whereby the holding substrate 19 or the holding plate of the holding film itself is formed. The work of removing from the holding plate 16 and attaching the holding plate 16 to the holding surface 16a of the holding plate 16 can be performed efficiently and easily.

In the above embodiment, the new ceramic green sheet is the ceramic green sheet supplier 1.
Although the supply was performed by shifting the position of No. 2, the ceramic green sheets cut to a size to be laminated in advance may be positioned and arranged on the pressure bonding stage 11 at a predetermined position.

Next, an experimental example for explaining a more preferable example of the method of the present invention will be described. Experimental Example 1 In the apparatus shown in FIG. 1, the size of the holding substrate 19 was changed, and the ceramic green sheets 14 were stacked. The dimensions of the holding substrate 19 used are shown in Table 1 below.
Note that the size of the holding substrate in Table 1 is
In the case where the size of the holding surface 16a is a rectangle of 60 mm × 80 mm, the outer peripheral edge of the holding surface 16a is changed by the size shown in Table 1 on both the long side and the short side. .

The appearance of the laminate obtained by changing the dimensions of the holding substrate 19 as described above is visually observed.
evaluated. The results are shown in Table 1 below.

[0039]

[Table 1]

As is clear from Table 1, the holding substrate 19
It can be seen that the appearance of the obtained laminate is changed by making the size of the holding plate 16 different from the holding surface 16a of the holding board 16.
That is, it can be seen that a laminate having a good appearance can be obtained by using the holding substrate 19 which is slightly smaller than the holding surface 16a of the holding board 16. Further, the holding substrate 1
It was found that when the dimension of No. 9 was considerably smaller than the holding surface 16a of the holding board 16, the periphery of the stacked body was deformed as shown in Table 1, and the stacking deviation was increased.

When the outer dimensions of the holding substrate 19 are made equal to the holding surface 16a of the holding board 16, air bubbles are trapped during lamination, and as shown in Table 1, "bubbles" occur. Had occurred.

Therefore, preferably, the holding substrate 19
Is desirably slightly smaller than the holding surface 16 a of the holding board 16. EXPERIMENTAL EXAMPLE 2 Using a retaining plate 16 having the same dimensions as the retaining plate 16 used in Experimental Example 1, a holding substrate 19 having a side length 0.3 mm smaller than the holding surface 16a was formed using a different material, and an experiment was performed. A multilayer capacitor was manufactured in the same manner as in Example 1. In addition, as shown in Table 2 below, a plurality of types of materials A to D having different elastic moduli in the plane direction and in the thickness direction were used as the material constituting the holding substrate.

The evaluation was performed by observing the lamination accuracy of the internal electrodes in the obtained multilayer capacitor by cutting the obtained multilayer capacitor in the thickness direction. As the multilayer capacitor, a multilayer capacitor in which a metal film formed by a thin film forming method was used as an internal electrode and the number of layers of the internal electrode was 100 was manufactured.

The results are shown in Table 2 below.

[0045]

[Table 2]

As is evident from Table 2, when fabricating a mother laminate for a multilayer capacitor, the lamination accuracy can be improved by making the elastic modulus in the plane direction larger than the elastic modulus in the thickness direction. . This is the holding substrate 19
Is considered to be difficult to be stretched in the plane direction, so that the stress generated when laminating the ceramic green sheets by pressure bonding is reduced by the deformation of the holding substrate 19.

Experimental Example 3 A multilayer capacitor was manufactured in the same manner as in Experimental Example 2. However, the following two types were used instead of the holding substrate 19.

Retaining film E: a polyethylene terephthalate film having a thickness of 300 μm and having a surface release-treated with silicon. Retaining film F ...
A polyethylene terephthalate film having a thickness of 300 μm that has not been subjected to a release treatment.

After preparing a ceramic laminate using the holding films E and F, the laminate was taken out from the holding plate together with the holding film, and then the separation between the holding film and the ceramic laminate was evaluated. did. As a result, in the case of the holding film E (PET film subjected to release treatment), the laminate could be easily separated from the holding film even when used repeatedly 10 times. In the case of using the holding film F not subjected to the above, it was not possible to easily separate the laminate by using the film only several times.

[Brief description of the drawings]

FIG. 1 is a partially cutaway sectional view showing a step of laminating ceramic green sheets in a method according to an embodiment.

FIGS. 2A and 2B are cross-sectional views showing the ceramic laminate obtained in the example and the ceramic laminate cut into individual multilayer capacitors.

FIG. 3 is a sectional view showing a multilayer capacitor obtained in an example.

FIG. 4 is a partially cutaway sectional view showing a step of obtaining a laminate by laminating ceramic green sheets in a conventional method.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 ... Crimping stage 12 ... Ceramic green sheet supplier 13 ... Support film 14 ... Ceramic green sheet 15 ... Metal film 16 ... Holding plate 16a ... Holding surface 17 ... Suction hole 19 ... Holding substrate 20 ... Ceramic laminate

Claims (4)

(57) [Claims] And 1. A process for placing a ceramic green sheet directly or indirectly on the bonding stage, have a flat holding surface suction hole is opened on the lower surface, the
Located above the crimping stage and moves up and down
A step of preparing a holding plate that is enabled; and bringing the holding plate close to a pressing stage and pressing the ceramic green sheet on the pressing stage onto the holding plate.
And place multiple ceramic green sheets on the holding surface
The method of manufacturing a multilayer ceramic electronic component and a sequentially laminating step, on the holding plate of the holding surface, the holding substrate or film leave suction fixed, the holding substrate or on a film
The ceramic green sheet is pressed into the
Ceramic green sheet
A method for producing a multilayer ceramic electronic component, comprising performing pressure bonding and lamination. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the holding substrate or film has a smaller area than a holding surface of the holding board. 3. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the holding substrate or the film that is harder to stretch in a plane direction than a thickness direction is used. 4. The holding substrate or film whose surface is subjected to a release treatment is used.
3. The method for producing a multilayer ceramic electronic component according to item 1.