JPH0830233B2 - High strength and high conductivity copper alloy - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is excellent in strength, processability, electrical conductivity (thermal conductivity), corrosion resistance, heat resistance, etc., and is suitable for manufacturing precision parts for electronic devices. The present invention relates to a suitable high strength and high conductivity copper alloy.

[Conventional technology]

For electronic devices, especially for semiconductor (IC, transistor) leads, connectors, switches, contact springs, etc., Cu alloys excellent in strength, workability, corrosion resistance and conductivity are required. Such alloys have excellent strength such as Cu-Be alloys and
Cu-Ti alloys are known, but these alloys are expensive, and Cu-Ni-Sn spinodal alloys have a conductivity of 10% IA.
It is as low as CS or less, has poor workability, and the same applies to Cu-Ni-Al alloys. For this reason, Cu-Sn based alloys, that is, phosphor bronze, especially phosphor bronze for springs containing 6 to 8 wt% Sn (hereinafter wt% is abbreviated as%) are often used.

[Problems to be solved by the invention]

The above-mentioned phosphor bronze for spring has a strength of about 60 to 80 kg / mm ² , but it not only contains a large amount of relatively expensive Sn, but also has an electrical conductivity.
It is as low as 10 to 15% IACS, and is a practically large defect in terms of deterioration of solder joint strength over time and susceptibility to corrosion cracking.
Therefore, Cu-Fe alloys such as C194 alloy and C195 alloy are
Although it is used in some parts, its use is limited because its strength is about 45 to 65 kg / mm ² and its workability is poor.

In recent years, electronic devices have tended to be miniaturized and highly integrated, and there is a strong demand for improvement in strength and conductivity as a Cu alloy used for them. It is also cheap to use in large quantities,
In order to respond to the trend of surface mounting of semiconductors, solder joint strength and adhesion reliability of Sn and Sn-Pb alloy plating are required.
In order to meet such demands and replace conventional alloys, higher performance, lower cost performance alloys are required. That is, (1) an alloy having a higher balance between strength and conductivity, such as strength of 70 to 100 kg / mm ² and conductivity of 10 to 15% IACS.

(2) The cost is low, for example, the alloy components are inexpensive and the manufacturing process is simplified.

(3) Excellent workability, corrosion resistance, and stress corrosion cracking resistance.

(4) Solder joint strength and adhesion of Sn, Sn-Pb alloy plating are stable for a long time.

(5) In electronic device applications, plating of Au, Ag, Ni, etc. is often used in addition to Sn and Sn alloys, and these plating properties are also excellent.

[Means for solving problems]

The present invention is a result of various studies in view of this, particularly strength, workability, conductivity (thermal conductivity), corrosion resistance, excellent heat resistance, miniaturized precision components for electronic devices, such as semiconductor lead frames, connectors, We have developed a high-strength and high-conductivity copper alloy suitable for sockets.

That is, the present invention copper alloy is more than 4.0% and 10% or less of Ni,
0.6-5.0% Si, Zn0.05-5.0%, Mn0.01-5.0%, Mg0.
005 ~ 0.8%, Ca0.005 ~ 0.8%, Cd0.05 ~ 1.0%, Ag0.001 ~
Within the range of 0.5%, a total of 0.01 to 1 or 2 or more
5.0% included, Cr0.01-0.4%, V0.005-0.4%, Ti0.005
~ 0.4%, Y0.005-0.2%, Zr0.005-0.2%, Co0.01-0.4
%, Fe-P compound (Fe _X P _Y ) 0.01 to 0.4%, Cr-P compound (Cr _X P _Y ) 0.01 to 0.4%, Co-P compound (Co _X P _Y ) 0.01 to 0.
Within the range of 4%, one kind or two or more kinds in total is 0.005 to 0.
It is characterized by containing 5% and the balance Cu and unavoidable impurities.

The alloy of the present invention is produced by hot working and cold working an ingot melt-cast by adding the above composition. For example 700-100
Hot rolling or hot extrusion is performed by heating to 0 ° C., processing is completed at 600 ° C. or higher, water cooling is immediately performed, and preferably 400 ° C. or lower at a rate of 10 ° C./sec or more. The surface is cleaned by milling, shaving, or pickling, and then subjected to processing such as cold rolling and drawing, and then is made by combining aging heat treatment and cold working or solution treatment, aging heat treatment and cold working. . Further, it is possible to obtain higher properties by combining with a temper annealing of 200 to 600 ° C., a tension leveler, a tension annealing after the final cold working. It is also possible to directly cold work the ingot of the alloy of the present invention and then heat-treat it.

[Action]

The alloy of the present invention is produced by the above manufacturing method and has a strength of 60 to 120 kg / mm ² , an elongation of 3 to 20% and an electrical conductivity of 10 depending on the alloy composition.
Characteristic of ~ 40% IACS. Such an alloy of the present invention effectively disperses and deposits a compound of Ni and Si, that is, Ni _X Si _Y , in a copper matrix, and makes it possible to improve strength and conductivity and heat resistance. Furthermore, since Ni and Si are chemically compounded in a stoichiometric ratio, it is desirable that the ratio (weight) of both be within the range of about 2 to 6: 1. Within this range, high strength and excellent conductivity can be obtained at the same time. This is because Then over 4.0% 10
The following Ni and 0.6-5.0% of Si are limited to the reason that sufficient strength cannot be obtained if either the Ni content or the Si content is less than the lower limit, and the solderability deteriorates if the upper limit is exceeded. This is because workability, particularly hot workability, is deteriorated and manufacturability is impaired.

The group consisting of Zn, Mn, Mg, Ca, Cd, and Ag (hereinafter referred to as the A element group) suppresses deterioration of reliability after soldering, exhibits deoxidizing and desulfurizing effects, and castability and hot working of alloys. Suppress occurrence of defects. Then Zn0.05-5.0%, Mn0.01-5.0%, Mg0.00
5 to 0.8%, Ca0.005 to 0.8%, Cd0.05 to 1.0%, Ag0.001 to 0.5
Within the range of 1 to 2 or more total 0.01 ~ 5.0
The reason why the content is limited to% is that when the content is less than the lower limit, a sufficient effect cannot be obtained, and when the content exceeds the upper limit, not only the conductivity decreases but also the soundness of the ingot is impaired.

Next, the group consisting of Cr, V, Ti, Y, Co, Fe _X P _Y , Cr _X P _Y , and Co _X P _Y (hereinafter B element group) suppresses the growth of crystal grains during solution treatment, It has a good ductility as a structure and greatly contributes to good bendability. Further, the effect of improving hot workability is also exhibited, which greatly contributes to the improvement of manufacturability. Then
Cr0.01 to 0.4%, V0.005 to 0.4%, Ti0.005 to 0.4%, Y0.005
~ 0.2%, Fe _X P _Y 0.01 ~ 0.4%, Cr _X P _Y 0.01 ~ 0.4%, Co _X P _Y
Within the range of 0.01 to 0.4%, total one or more kinds
Any of the above limits of 0.005 to 0.5% lowers the castability and deteriorates the workability when the amount is out of the above range.

The copper alloy of the present invention has the above composition, but further has an O ₂ content.
When the content is 50 ppm or less, it is effective for fine and uniform precipitation of the Ni-Si compound and improvement of solderability and plating property. However, if the upper limit is exceeded, not only will the above effect not be seen, but on the contrary, it will decrease. Also by a 10ppm or less of S content, as with O ₂ Ni-Si
It is effective for fine and uniform precipitation of the compound and improvement of hot workability. However, if it exceeds the upper limit, the hot workability is greatly reduced and the manufacturability is deteriorated. P that does not form a compound
It is desirable that the amount be 0.03 wt% or less. Further, the precipitate in the copper alloy of the present invention is preferably 10 μm or less in order to suppress deterioration of plating property, bending workability, strength and the like.

〔Example〕

A copper alloy with the composition shown in Table 1 was melted and cast to a thickness of 50 m.
An ingot of m, 120 mm in width and 200 mm in length was obtained. Chamfer this, 8
After homogenizing at 50 ℃ for 3 hours, hot rolling at 830 ℃,
This was water-cooled to form a plate having a thickness of 10 mm.

Cold rolling and intermediate annealing (at 620 ℃ 1
Repeated time), solution heat treatment with a plate thickness of 0.4 mm (5 at 870 ℃)
0.25mm thickness at 40% final processing rate
After finishing the plate and subjecting it to temper annealing at 360 ° C for 30 minutes,
The test pieces were cut out and examined for tensile strength, conductivity, bendability, plating adhesion, solder joint strength and stress corrosion cracking resistance. The results are shown in Table 2.

Tensile strength is based on JIS Z2241 and conductivity is JIS-H0505.
It was measured based on. Bending formability (R / t) was tested based on the JIS-Z2248 block method, and the minimum bending radius (R) that causes cracks on the surface of the test piece divided by the thickness (t) of the test piece. Indicated by. Plating adhesion is about 30 x 30 mm test piece, Ag plating is performed after surface cleaning, this is heated in the atmosphere and the swelling of the plating surface after that is observed,
What does not appear to swell when heated at 550 ° C for 5 minutes
Marks and swelling are shown by x marks. Regarding the solder joint strength, a lead wire of oxygen-free copper with a diameter of 9 mm is joined to a 20 × 25 mm test piece with 60/40 eutectic solder, and a tensile test is performed after a heating acceleration test at 150 ° C for 500 hours. Is indicated by a circle, 80% or more before the accelerated test is indicated by a circle, 50-80% is indicated by a triangle, and less than that is indicated by a cross. JIS for stress corrosion cracking
-Based on C8306, 30kg / in an atmosphere of 3vol% ammonia
A constant load test in which a tensile load of mm ² was applied was performed, and the time until cracking occurred was measured.

As is clear from Tables 1 and 2, the alloy N of the present invention
It can be seen that all of o.1 to 9 are superior to the conventional alloy (8% phosphor bronze) No.15 in strength, conductivity, solder joint strength, and stress corrosion cracking resistance.

On the other hand, Comparative Alloy No. 10, which has a low Ni and Si content and does not contain the AB element group, has insufficient strength.
Comparative alloy No. 11 with a high content of Si and Si and comparative alloy No. 12 with a high content of both AB element groups did not produce a sound ingot, and cracked during hot rolling, resulting in the test material I couldn't get it.

Further, in Comparative Alloy No. 13 having a large O ₂ content, the bending formability and the plating adhesion were largely inferior, and the solder bondability was also deteriorated. In Comparative Alloy No. 14 having a high S content, severe cracking occurred during hot rolling, and the test material could not be obtained.

〔The invention's effect〕

As described above, according to the present invention, strength, conductivity (heat conductivity), molding processability and corrosion resistance are excellent, solderability and plating reliability are greatly improved, and for example, as an electronic / electric device, for example, semiconductor leads. It is useful as a spring material for frames, connectors, switches, etc., terminals, heat exchangers, various conductors, and has remarkable industrial effects such as miniaturization and high integration of electronic and electrical equipment. .

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Toru Tanigawa Toru Tanigawa 500 Kiyotaki Town, Nikko City, Tochigi Prefecture Furukawa Electric Co., Ltd. Nikko Denki Copper Works (56) References Japanese Patent Publication Sho 60-45698 (JP, B2)

Claims (2)

[Claims] 1. A nickel content of more than 4.0 wt.% And less than 10 wt.
5.0wt% Si, Zn0.05-5.0wt%, Mn0.01-5.0wt%, Mg
0.005-0.8wt%, Ca0.005-0.8wt%, Cd0.05-1.0wt%, Ag
Within the range of 0.001 to 0.5 wt%, it contains 0.01 to 5.0 wt% of one or more kinds in total, and further Cr 0.01 to 0.4 wt%, V0.005 to
0.4wt%, Ti0.005〜0.4wt%, Y0.005〜0.2wt%, Zr0.005〜
0.2wt%, Co 0.01-0.4wt%, Fe-P compound (Fe _X P _Y ) 0.01
~ 0.4wt%, Cr-P compound (Cr _X P _Y ) 0.01 ~ 0.4wt%, Co-
A high-strength and high-conductivity copper alloy containing 0.005 to 0.5 wt% of any one or more of P compounds (Co _X P _Y ) in the range of 0.01 to 0.4 wt% and a balance of Cu and inevitable impurities. 2. A copper alloy according to claim 1, wherein the O ₂ content is 50 ppm or less and the S content is 10 ppm or less.