JPH0441495B2 - - Google Patents
Info
- Publication number
- JPH0441495B2 JPH0441495B2 JP58132179A JP13217983A JPH0441495B2 JP H0441495 B2 JPH0441495 B2 JP H0441495B2 JP 58132179 A JP58132179 A JP 58132179A JP 13217983 A JP13217983 A JP 13217983A JP H0441495 B2 JPH0441495 B2 JP H0441495B2
- Authority
- JP
- Japan
- Prior art keywords
- needle
- chip
- semiconductor wafer
- contact
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13217983A JPS6024030A (ja) | 1983-07-19 | 1983-07-19 | 半導体ウエハ測定方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13217983A JPS6024030A (ja) | 1983-07-19 | 1983-07-19 | 半導体ウエハ測定方法 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2417697A Division JPH0828408B2 (ja) | 1990-12-15 | 1990-12-15 | 半導体ウエハ測定方法 |
JP41769690A Division JP2717884B2 (ja) | 1990-12-15 | 1990-12-15 | 半導体ウエハ測定方法 |
JP14953791A Division JPH0618229B2 (ja) | 1991-05-24 | 1991-05-24 | 半導体ウエハの検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6024030A JPS6024030A (ja) | 1985-02-06 |
JPH0441495B2 true JPH0441495B2 (es) | 1992-07-08 |
Family
ID=15075226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13217983A Granted JPS6024030A (ja) | 1983-07-19 | 1983-07-19 | 半導体ウエハ測定方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6024030A (es) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0713990B2 (ja) * | 1985-04-02 | 1995-02-15 | 東京エレクトロン株式会社 | プローブ針とパッドの位置合わせ方法 |
JPH0714757B2 (ja) * | 1986-09-29 | 1995-02-22 | 株式会社タツノ・メカトロニクス | 燃料油配送車 |
JPS63265441A (ja) * | 1987-04-23 | 1988-11-01 | Tokyo Electron Ltd | 測定装置 |
US5041845A (en) * | 1987-10-13 | 1991-08-20 | Canon Kabushiki Kaisha | Heat transfer recording apparatus with a common drive source for selective plural functions |
JPH01257074A (ja) * | 1988-04-07 | 1989-10-13 | Canon Inc | 熱転写記録装置 |
JPH0828408B2 (ja) * | 1990-12-15 | 1996-03-21 | 東京エレクトロン株式会社 | 半導体ウエハ測定方法 |
JP2726651B2 (ja) * | 1996-04-22 | 1998-03-11 | 東京エレクトロン株式会社 | 不良素子へのマーキング方法 |
WO2010073359A1 (ja) | 2008-12-26 | 2010-07-01 | 富士通セミコンダクター株式会社 | プローバ、試験装置、及び半導体チップの検査方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58121638A (ja) * | 1982-01-12 | 1983-07-20 | Nec Home Electronics Ltd | ウエ−ハプロ−バ用検針のチエツク方法 |
JPS58169922A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | オ−トプロ−バにおけるウエハ−のアライメント方法 |
-
1983
- 1983-07-19 JP JP13217983A patent/JPS6024030A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58121638A (ja) * | 1982-01-12 | 1983-07-20 | Nec Home Electronics Ltd | ウエ−ハプロ−バ用検針のチエツク方法 |
JPS58169922A (ja) * | 1982-03-31 | 1983-10-06 | Fujitsu Ltd | オ−トプロ−バにおけるウエハ−のアライメント方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6024030A (ja) | 1985-02-06 |
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