JPH0325994A - Hybrid integrated circuit - Google Patents
Hybrid integrated circuitInfo
- Publication number
- JPH0325994A JPH0325994A JP1161448A JP16144889A JPH0325994A JP H0325994 A JPH0325994 A JP H0325994A JP 1161448 A JP1161448 A JP 1161448A JP 16144889 A JP16144889 A JP 16144889A JP H0325994 A JPH0325994 A JP H0325994A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- electrode
- measurement
- cutout
- coupler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005259 measurement Methods 0.000 abstract description 19
- 239000010408 film Substances 0.000 abstract description 11
- 239000010409 thin film Substances 0.000 abstract description 11
- 238000003698 laser cutting Methods 0.000 abstract description 4
- 238000009966 trimming Methods 0.000 description 2
Landscapes
- Non-Adjustable Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は混成集積回路に関し、特に薄膜2厚膜抵抗体を
有する混成集積回路に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to hybrid integrated circuits, and more particularly to hybrid integrated circuits having two thin-film and thick-film resistors.
従来、この種の薄膜,厚膜抵抗体は、第8図に示すよう
に抵抗体2端面全体より電極体1を構成し、その広い電
極体幅のまま測定用電極体1となっていた。Conventionally, in this type of thin film and thick film resistors, as shown in FIG. 8, the electrode body 1 was constructed from the entire end face of the resistor 2, and the wide electrode body width was used as the electrode body 1 for measurement.
そのため、抵抗体2の抵抗値測定に於いて、電流が測定
端子間の最短方向に伝わり、測定端子位置によって抵抗
値に誤差を生じる構成となっていた。Therefore, when measuring the resistance value of the resistor 2, the current is transmitted in the shortest direction between the measurement terminals, resulting in an error in the resistance value depending on the position of the measurement terminals.
上述した抵抗体パターンの両端面全体の電極体幅のまま
測定用電極となっている薄膜,厚膜抵抗体の形状では、
測定位置により、測定端子間に流れる電流の伝わりかた
に誤差を生じ、抵抗測定値に測定誤差を生じてしまう欠
点がある。In the shape of a thin film or thick film resistor, which is used as a measuring electrode with the width of the electrode body across both end faces of the resistor pattern described above,
There is a drawback that depending on the measurement position, an error occurs in the way the current flows between the measurement terminals, resulting in a measurement error in the resistance measurement value.
又、レーザートリミング時の測定位置により、レーザー
カット方向による抵抗値の測定誤差を生じるという欠点
もある。Furthermore, there is also a drawback that a resistance value measurement error occurs depending on the laser cutting direction depending on the measurement position during laser trimming.
本発明の目的は、電極体の測定位置やレーザーカット方
向による抵抗値の測定誤差の生じない薄膜,厚膜抵抗体
を有する混成集積回路を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a hybrid integrated circuit having thin film and thick film resistors that does not cause measurement errors in resistance values due to measurement positions of electrode bodies or laser cutting directions.
本発明は、抵抗体と、該抵抗体の相対ずる2つの側面に
接続された電極体とを有する混成集積回路に於いて、2
つの前記電極体のそれぞれの領域内に前記抵抗体との接
続面と平行に切欠きを設け該切欠きのそれぞれの一部に
細い連結部が形或されている。The present invention provides a hybrid integrated circuit having a resistor and an electrode body connected to two opposite sides of the resistor.
A notch is provided in each region of the two electrode bodies in parallel to a connection surface with the resistor, and a thin connecting portion is formed in a portion of each of the notches.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第1図〜第4図は本発明の第1の実施例の薄膜,厚膜抵
抗体パターンを示す平面図である。1 to 4 are plan views showing thin film and thick film resistor patterns according to a first embodiment of the present invention.
第1の実施例は、第1図〜第4図に示すように、電極体
1の領域内に、抵抗体2との接続面と平行に切欠きを設
け、その切欠き部に電極体1にて細い連結部4を形戒し
た例である.
電極体1のパターン内のaよりfまでは、抵抗値測定時
の測定端子位置を示すものであり、a〜d,, a 〜
e , a−f 、同じように、b〜d,b〜e ,
b 〜f , c 〜d , c 〜e , c 〜f
間での測定抵抗値は、測定電流の流れが電極体1のパタ
ーンの細い連結部4より入力,出力となり、同条件での
測定となり、均一になる。In the first embodiment, as shown in FIGS. 1 to 4, a notch is provided in the region of the electrode body 1 parallel to the connection surface with the resistor 2, and the electrode body This is an example of a thin connecting part 4. A to f in the pattern of the electrode body 1 indicate the measurement terminal positions when measuring the resistance value, a to d,, a to f.
e, a-f, similarly, b-d, b-e,
b ~ f, c ~ d, c ~ e, c ~ f
The measured resistance value between the two electrodes is uniform because the flow of the measurement current is input and output from the thin connection part 4 of the electrode body 1 pattern, and the measurement is performed under the same conditions.
第5図〜第7図は本発明の第2の実施例の薄膜,厚膜抵
抗体パターンを示す平面図である。5 to 7 are plan views showing thin film and thick film resistor patterns according to a second embodiment of the present invention.
第2の実施例は、第5図〜第7図に示すように、電極体
の領域内に抵抗体2と平行に切欠きを設け、抵抗体2に
て細い連結部14を形成した例である。In the second embodiment, as shown in FIGS. 5 to 7, a notch is provided in the region of the electrode body in parallel with the resistor 2, and a thin connecting portion 14 is formed in the resistor 2. be.
効果としては、電極体内のa〜d,a〜e,a〜f、同
じように、b〜d , L+〜e , b〜f ,
c〜d,c〜e,c〜f間の測定抵抗値が第1の実施例
と同様、均一に測定出来るという利点がある。The effects include a to d, a to e, a to f in the electrode body, as well as b to d, L+ to e, b to f,
There is an advantage that the measured resistance values between c and d, c and e, and c and f can be measured uniformly as in the first embodiment.
以上説明したように本発明,、薄膜,厚膜抵抗体パター
ンに於いて、測定しようとする抵抗体の電極体に測定電
流の流れを一定方向にするための細い連結部を形戒する
ことにより、電極体内の測定位置及びレーザートリミン
グのカツ1〜方向カット状態に影響されることなく、均
一の抵抗値測定が容易に出来るという効果がある。As explained above, in the present invention, in thin film and thick film resistor patterns, by forming a thin connecting part on the electrode body of the resistor to be measured to make the flow of measurement current in a fixed direction. This has the effect that uniform resistance value measurement can be easily performed without being affected by the measurement position within the electrode body or the cut state of the cut direction of laser trimming.
/)/Z げ a/)/Z Ge a
第1図〜第4図は本発明の第1の実施例の薄膜2厚膜抵
抗体パターンを示す平面図、第5図〜第7図は本発明の
第2の実施例の薄膜,厚膜抵抗体パターンを示す平面図
、第8図は従来の薄膜,厚膜抵抗体パターンの一例を示
す平面図である.
1・・・電極体、2・・・抵抗体、3・・・レーザーカ
ット位置、11.14−・・細い連結部、a,b,c,
d,e,f・・・抵抗測定用端子位置。1 to 4 are plan views showing thin film and thick film resistor patterns according to the first embodiment of the present invention, and FIGS. 5 to 7 are plan views showing thin film and thick film resistor patterns according to the second embodiment of the present invention. FIG. 8 is a plan view showing an example of a conventional thin film and thick film resistor pattern. 1... Electrode body, 2... Resistor, 3... Laser cutting position, 11.14-... Thin connecting part, a, b, c,
d, e, f...terminal positions for resistance measurement.
Claims (1)
た電極体とを有する混成集積回路に於いて、2つの前記
電極体のそれぞれの領域内に前記抵抗体との接続面と平
行に切欠きを設け該切欠きのそれぞれの一部に細い連結
部を形成したことを特徴とする混成集積回路。In a hybrid integrated circuit having a resistor and an electrode body connected to two opposing sides of the resistor, in each region of the two electrode bodies, there is a wire parallel to the connection surface with the resistor. 1. A hybrid integrated circuit characterized in that a notch is provided and a thin connecting portion is formed in a part of each of the notches.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1161448A JPH0325994A (en) | 1989-06-23 | 1989-06-23 | Hybrid integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1161448A JPH0325994A (en) | 1989-06-23 | 1989-06-23 | Hybrid integrated circuit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0325994A true JPH0325994A (en) | 1991-02-04 |
Family
ID=15735301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1161448A Pending JPH0325994A (en) | 1989-06-23 | 1989-06-23 | Hybrid integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0325994A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0829885A1 (en) * | 1996-09-03 | 1998-03-18 | Delco Electronics Corporation | Thick film resistor |
EP1011109A1 (en) * | 1997-04-16 | 2000-06-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method for manufacturing the same |
JP2006073879A (en) * | 2004-09-03 | 2006-03-16 | Matsushita Electric Ind Co Ltd | Mounting substrate for resistor for detection |
JP2007329421A (en) * | 2006-06-09 | 2007-12-20 | Koa Corp | Metallic plate resistor |
JP2013504213A (en) * | 2009-09-04 | 2013-02-04 | ヴィシェイ デイル エレクトロニクス,インコーポレイテッド | Resistor with resistance temperature coefficient (TCR) compensation function / action |
US11555831B2 (en) | 2020-08-20 | 2023-01-17 | Vishay Dale Electronics, Llc | Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making |
EP4141895A4 (en) * | 2020-04-20 | 2024-07-03 | KOA Corporation | BYPASS RESISTOR |
-
1989
- 1989-06-23 JP JP1161448A patent/JPH0325994A/en active Pending
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0829885A1 (en) * | 1996-09-03 | 1998-03-18 | Delco Electronics Corporation | Thick film resistor |
EP1011109A1 (en) * | 1997-04-16 | 2000-06-21 | Matsushita Electric Industrial Co., Ltd. | Resistor and method for manufacturing the same |
EP1011109A4 (en) * | 1997-04-16 | 2000-06-21 | Matsushita Electric Ind Co Ltd | RESISTANCE AND MANUFACTURING METHOD THEREOF |
US6348392B1 (en) | 1997-04-16 | 2002-02-19 | Matsushita Electric Industrial Co., Ltd. | Resistor and method of manufacturing the same |
JP2006073879A (en) * | 2004-09-03 | 2006-03-16 | Matsushita Electric Ind Co Ltd | Mounting substrate for resistor for detection |
JP4529597B2 (en) * | 2004-09-03 | 2010-08-25 | パナソニック株式会社 | Detection resistor mounting board |
JP2007329421A (en) * | 2006-06-09 | 2007-12-20 | Koa Corp | Metallic plate resistor |
US9400294B2 (en) | 2009-09-04 | 2016-07-26 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
JP2014090205A (en) * | 2009-09-04 | 2014-05-15 | Vishay Dale Electronics Inc | Resistor with temperature coefficient (tcr) compensation function/action |
US8878643B2 (en) | 2009-09-04 | 2014-11-04 | Vishay Dale Electronics, Inc. | Resistor with temperature coefficient of resistance (TCR) compensation |
JP2013504213A (en) * | 2009-09-04 | 2013-02-04 | ヴィシェイ デイル エレクトロニクス,インコーポレイテッド | Resistor with resistance temperature coefficient (TCR) compensation function / action |
US9779860B2 (en) | 2009-09-04 | 2017-10-03 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
US10217550B2 (en) | 2009-09-04 | 2019-02-26 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
US10796826B2 (en) | 2009-09-04 | 2020-10-06 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
US11562838B2 (en) | 2009-09-04 | 2023-01-24 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
US12009127B2 (en) | 2009-09-04 | 2024-06-11 | Vishay Dale Electronics, Llc | Resistor with temperature coefficient of resistance (TCR) compensation |
EP4141895A4 (en) * | 2020-04-20 | 2024-07-03 | KOA Corporation | BYPASS RESISTOR |
US12249445B2 (en) | 2020-04-20 | 2025-03-11 | Koa Corporation | Shunt resistor |
US11555831B2 (en) | 2020-08-20 | 2023-01-17 | Vishay Dale Electronics, Llc | Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making |
US12196783B2 (en) | 2020-08-20 | 2025-01-14 | Vishay Dale Electronics, Llc | Resistors, current sense resistors, battery shunts, shunt resistors, and methods of making |
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