JPH01150543A - Laminated plate for electric use - Google Patents
Laminated plate for electric useInfo
- Publication number
- JPH01150543A JPH01150543A JP31009787A JP31009787A JPH01150543A JP H01150543 A JPH01150543 A JP H01150543A JP 31009787 A JP31009787 A JP 31009787A JP 31009787 A JP31009787 A JP 31009787A JP H01150543 A JPH01150543 A JP H01150543A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- resin
- lower surfaces
- laminated plate
- resin varnish
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000011347 resin Substances 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000000945 filler Substances 0.000 claims abstract description 12
- 239000011521 glass Substances 0.000 claims abstract description 11
- 239000002966 varnish Substances 0.000 claims abstract description 11
- 239000004744 fabric Substances 0.000 claims abstract description 10
- 230000035699 permeability Effects 0.000 claims abstract description 10
- 239000011888 foil Substances 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 238000000465 moulding Methods 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000843 powder Substances 0.000 abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 abstract description 3
- 229910001369 Brass Inorganic materials 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010951 brass Substances 0.000 abstract description 2
- 239000004927 clay Substances 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- 239000003365 glass fiber Substances 0.000 abstract description 2
- 229910052742 iron Inorganic materials 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 229910052759 nickel Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 238000012856 packing Methods 0.000 abstract 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 abstract 2
- 229910000019 calcium carbonate Inorganic materials 0.000 abstract 1
- 229910052500 inorganic mineral Inorganic materials 0.000 abstract 1
- 239000011707 mineral Substances 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- -1 polybutylene Polymers 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- REARGOUCOBYKTJ-UHFFFAOYSA-N 1-fluorohexan-2-one Chemical compound CCCCC(=O)CF REARGOUCOBYKTJ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機器、通信機器等に
用いられる電気用積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc.
従来、電気用積層板の#熱性を向上させるには樹脂含浸
基材の樹脂自身を例えばフェノール樹脂からエポキシ樹
脂に転換したシ、更にはポリイミド樹脂に転換すること
で対応されてきたが、使用樹脂個有の性質を必要とする
場合は樹脂の変性や無機粉末充填剤を添加することが試
みられていた。Conventionally, the thermal properties of electrical laminates have been improved by converting the resin itself of the resin-impregnated base material from, for example, phenolic resin to epoxy resin, or even polyimide resin. When unique properties are required, attempts have been made to modify the resin or add inorganic powder fillers.
樹脂変性はそれなりの効果があるがやはり樹脂の性質そ
のものが変質するのは止むを得ないことであシ、無機粉
末充填剤の添加は@層板表面が虫食い状になる外観不良
が発生しやすい欠点があった〔発明の目的〕
本発明の目的とするところは積層板表面の外観不良がな
く且つ耐熱性に優れた電気用積層板を提供することKあ
る。Resin modification has some effect, but it is unavoidable that the properties of the resin itself change, and the addition of inorganic powder fillers tends to cause visual defects such as moth-eaten appearance on the surface of the laminate. Disadvantages [Object of the Invention] An object of the present invention is to provide an electrical laminate that has no defective appearance on the surface of the laminate and has excellent heat resistance.
本発明は充填剤含有樹脂ワニスを含浸してなる樹脂含浸
基材の上下面に、充填剤を含有しない樹脂ワニスを通気
度4以下のガラス布に含浸してなる樹脂含浸基材を配し
、更にその上面及び又は下面に金属箔を配設した積層体
を積層成形してなることを特徴とする電気用積層板のた
め、樹脂個有の性質を生かしたままで耐熱性を向上させ
ることができ、更に通気度4以下の高密度基材によって
積層板表面の外観不良をなくすることができたもので、
以下本発明の詳細な説明する。In the present invention, a resin-impregnated base material made by impregnating a glass cloth with an air permeability of 4 or less with a resin varnish that does not contain a filler is arranged on the upper and lower surfaces of a resin-impregnated base material made by impregnating a resin varnish containing a filler, Furthermore, since it is an electrical laminate that is formed by laminating and molding a laminate with metal foil arranged on the upper and/or lower surfaces, it is possible to improve heat resistance while taking advantage of the unique properties of the resin. Furthermore, the appearance defects on the surface of the laminate can be eliminated by using a high-density base material with an air permeability of 4 or less.
The present invention will be explained in detail below.
本発明に用いるガラス布は通気度4以下のがフス織布、
がフス不織布、がフスベーバー等であシ、更にがフス繊
維と他の合成繊維等との混撚、混紡、混繊、混抄をも包
含するものである。基材に含浸する樹脂ワニスとしては
フェノール樹脂、クレゾール樹脂、エポキシ樹脂、不飽
和ポリエステル樹脂、メラミン樹脂、ポリイミド、ポリ
ブタジェン、ポリアミド、ポリアミドイミド、ポリスル
フォン、ポリフエニレンサルファイド、ポリフエニレン
オキサイド、ポリブチレンテレフタレート、ポリエーテ
ルエーテルケトン、弗化樹脂等の単独、変性物、混合物
等が用いられ必要に応じて粘度調整に水、メチルアルコ
ール、アセトン、フクロヘキサノン、スチレンモノマー
等の溶媒を添加したもので、基材としては、ガラス、ア
スベスト等の無機繊維やポリエステル、ポリアミド、カ
ーボン、ポリビニルアルコール、ポリアクリル、アラミ
ド等の有機合成d!雑や木綿等の天然繊維からなる織布
、不織布、マット或は紙又はこれらの組合せ基材等であ
る。充填剤としては炭1カルシウム、水酸化アルミニウ
ム、シリカ、クレー、ケイ酸マグネシウム、ガラス粉、
ガラス繊維片等の無機質充填剤全般である。金属箔とし
ては銅、鉄、アルミニウム、真鍮、ニッケル、ステンレ
ス鋼等の単独、複合、表面処理品等で、必要に応じて片
面に接着剤層を設は接着性を更に向上させることができ
る。The glass cloth used in the present invention is a fusu woven cloth with an air permeability of 4 or less.
This includes Fuss nonwoven fabrics, Fuss webbers, etc., and also includes blending, twisting, blending, blending, and mixing of Fuss fibers and other synthetic fibers. Resin varnishes impregnated into the base material include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, and polybutylene. Terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, solvents such as water, methyl alcohol, acetone, fluorohexanone, styrene monomer, etc. are added to adjust the viscosity. Base materials include inorganic fibers such as glass and asbestos, and organic synthetic materials such as polyester, polyamide, carbon, polyvinyl alcohol, polyacrylic, and aramid. These include woven fabrics, non-woven fabrics, mats, paper, or combinations of these materials made of natural fibers such as cotton and cotton. Fillers include calcium charcoal, aluminum hydroxide, silica, clay, magnesium silicate, glass powder,
Inorganic fillers such as glass fiber pieces in general. The metal foil may be made of copper, iron, aluminum, brass, nickel, stainless steel, etc. alone, composite, or surface-treated, and if necessary, an adhesive layer may be provided on one side to further improve adhesiveness.
積層成形としては多段成形法、マルチロール法、接触圧
法、無圧成形法、ダブルベルト法等の積層成形法全般を
用いることができ、特に限定するものではない。As the lamination molding, general lamination molding methods such as a multi-stage molding method, a multi-roll method, a contact pressure method, a pressureless molding method, and a double belt method can be used, and are not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
充填剤として200メツシユの水酸化アルミニウム15
重t%c以下単に%と記す)を含有する不飽和ポリエス
テル樹脂ワニスに、厚さ0.2 ffの長尺ガフスベー
バーを樹脂量が50%になるように含浸した樹脂含浸基
材5枚の上下面に、充填剤を含有しない不飽和ポリエス
テル樹脂ワニスに厚さ0.2n1通気度3の長尺がフス
布を樹脂量がw%になるように含浸した樹脂含浸基材を
夫々1枚づつ配し、更にその上下面に接着剤層付厚さ0
.035 Wrllの長尺銅箔を夫々配設した長尺帯状
積層体を無圧で145°Cでり分間積層成形後、所要寸
法に切断して電気用積層板を得た。Example filler: 200 mesh aluminum hydroxide 15
Five sheets of resin-impregnated base material were prepared by impregnating an unsaturated polyester resin varnish with a 0.2 ff thick long gaffs barber so that the resin amount was 50%. On the bottom surface, one resin-impregnated base material made by impregnating a long length of fuss cloth with a thickness of 0.2N1 and air permeability 3 in an unsaturated polyester resin varnish that does not contain a filler so that the resin amount is w% is arranged. Furthermore, there is an adhesive layer on the top and bottom surfaces with a thickness of 0.
.. A long strip-shaped laminate on which long copper foils of No. 035 Wrll were arranged was laminated for minutes at 145° C. without pressure, and then cut into required dimensions to obtain an electrical laminate.
比較例
実施例の厚さ0.2N通気度3の長尺ガラス布を、厚さ
0.2 fl、通気度10のガラス布に変えた以外は実
施例と同様に処理して!気用積層板を得た。Comparative Example Processed in the same manner as in Example except that the long glass cloth with a thickness of 0.2N and an air permeability of 3 was replaced with a glass cloth with a thickness of 0.2 fl and an air permeability of 10! A laminate was obtained.
実施例及び比較例の電気用積層板の性能は第1表で明白
なように本発明のものの性能はよく、本発明の優れてい
ることを確認した。As is clear from Table 1, the performance of the electrical laminates of Examples and Comparative Examples was good, confirming the superiority of the present invention.
第1表 注 老オープン耐熱性Table 1 Note Old open heat resistance
Claims (1)
材の上下面に、充填剤を含有しない樹脂ワニスを通気度
4以下のガラス布に含浸してなる樹脂含浸基材を配し、
更にその上面及び又は下面に金属箔を配設した積層体を
積層成形してなることを特徴とする電気用積層板。(1) A resin-impregnated base material made by impregnating a glass cloth with an air permeability of 4 or less with a resin varnish that does not contain a filler is arranged on the upper and lower surfaces of a resin-impregnated base material made by impregnating a resin varnish containing a filler,
An electrical laminate, characterized in that it is formed by laminating and molding a laminate having metal foil disposed on its upper and/or lower surfaces.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31009787A JPH01150543A (en) | 1987-12-07 | 1987-12-07 | Laminated plate for electric use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31009787A JPH01150543A (en) | 1987-12-07 | 1987-12-07 | Laminated plate for electric use |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01150543A true JPH01150543A (en) | 1989-06-13 |
Family
ID=18001147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31009787A Pending JPH01150543A (en) | 1987-12-07 | 1987-12-07 | Laminated plate for electric use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01150543A (en) |
-
1987
- 1987-12-07 JP JP31009787A patent/JPH01150543A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3897588A (en) | Process for the production of laminates utilizing pre-treating followed by impregnation | |
EP0050448A1 (en) | Fire-resistant laminates | |
JPH01150543A (en) | Laminated plate for electric use | |
JPH064310B2 (en) | Electric laminate | |
JPS6018339A (en) | Thermo-setting resin laminated board having excellent dimensional stability | |
JPH01150542A (en) | Laminated plate for electric use | |
JPH09254331A (en) | Laminated sheet | |
JPH0592517A (en) | Laminate | |
JPH0339245A (en) | Laminated sheet for electric apparatus | |
JPH05278162A (en) | Laminated sheet and production thereof | |
JPH0315536A (en) | Preparation of printed wiring board | |
JPH06170970A (en) | Production of laminated sheet | |
JPH05278161A (en) | Laminated sheet and production thereof | |
JPH05185560A (en) | Production of laminated sheet | |
JPH05315718A (en) | Electrical laminated plate | |
JPH01202441A (en) | Laminate for electrical apparatus | |
JPH05315717A (en) | Electrical laminated plate | |
JPH06170971A (en) | Production of laminated sheet | |
JPH04215492A (en) | Manufacture of laminated board for printed circuit | |
JPH01123741A (en) | Laminated plate for electrical use | |
JPH06909A (en) | Composite laminate | |
JPS6063145A (en) | Laminated board for electricity | |
JPH05162218A (en) | Manufacture of laminated sheet | |
JPH0592515A (en) | Production of laminated sheet | |
JPS61118430A (en) | Production of metal-clad laminated sheet |