JPH01150542A - Laminated plate for electric use - Google Patents
Laminated plate for electric useInfo
- Publication number
- JPH01150542A JPH01150542A JP31009687A JP31009687A JPH01150542A JP H01150542 A JPH01150542 A JP H01150542A JP 31009687 A JP31009687 A JP 31009687A JP 31009687 A JP31009687 A JP 31009687A JP H01150542 A JPH01150542 A JP H01150542A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- base material
- impregnated
- laminated plate
- lower surfaces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000003365 glass fiber Substances 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 13
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 6
- 239000011888 foil Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims abstract description 5
- 239000002966 varnish Substances 0.000 claims abstract description 4
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- -1 polybutatsuene Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920006337 unsaturated polyester resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
〔技術分野〕
本発明は電気機器、電子機器、計算機器、通信機器等に
用いられる′電気用積層板に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc.
従来、電気用積層板の耐熱性を向上させるには樹脂含浸
基材の樹脂自身を例えばフェノール樹脂からエポキシ樹
脂に転換したり、更にはポリイミド樹脂に転換すること
で対応されてきたが、使用樹脂個有の性質を必要とする
場合は樹脂の変性や無機粉末充填剤を添加することが試
みられていた。Conventionally, the heat resistance of electrical laminates has been improved by converting the resin itself of the resin-impregnated base material from, for example, phenolic resin to epoxy resin, or even polyimide resin. When unique properties are required, attempts have been made to modify the resin or add inorganic powder fillers.
樹脂変性はそれなりの効果があるがやはり樹脂の性質そ
のものが変質するのは止むを得ないことであシ、無機粉
末充填剤の添加は積層板表面が虫食い状になる外観不良
が発生しやすい欠点があった。Resin modification has certain effects, but it is unavoidable that the properties of the resin itself change, and the disadvantage of adding inorganic powder fillers is that the laminate surface tends to have a moth-eaten appearance. was there.
本発明の目的とするところは@層板表面の外観不良がな
く且つ耐熱性に優れたyI!気用積用積層板供すること
にあるつ
〔発明の開示〕
本発明は充填剤として水酸化アルミニウムとガラス俄維
とを含有する樹脂ワニスを含浸してなる樹脂含浸基材の
上下面に、充填剤を含有しない樹脂含浸基材を酩し、更
にその上面及び又は下面に金属箔を配設した積層体を積
NJ成形してなることを特徴とする電気用積層板のため
、樹脂個有の性質を生かしたままで耐熱性を向上させる
ことができ、更にガラス繊維によって積層板表面の外観
不良をなくすることができたもので、以下本発明の詳細
な説明する。The purpose of the present invention is to provide yI with no appearance defects on the surface of the laminate and excellent heat resistance! [Disclosure of the Invention] The present invention provides a resin-impregnated base material that is impregnated with a resin varnish containing aluminum hydroxide and glass fibers as fillers, and the upper and lower surfaces of the resin-impregnated base material are filled. This electrical laminate is characterized by being formed by NJ molding of a laminate made of a resin-impregnated base material that does not contain any additives, and metal foil is placed on the upper and/or lower surfaces of the laminate. The heat resistance can be improved while making the most of the properties, and furthermore, the appearance defects on the surface of the laminate can be eliminated by the use of glass fibers.The present invention will be described in detail below.
本発明に用いる無機粉末充填剤は水酸化アルミニウムに
限定され、その粒度は限定するものではないが好ましく
はiooメツシュ以下のものであることがより分散性が
よく望ましいことである。添加量は好ましくは樹脂フェ
ノの1−30重量%(以下単に%と記す)であることが
望ましい。即ち1%未満では耐熱性が向上し難く、30
%をこえると基材への含浸性が低下するためである。ガ
ラス繊維については好ましくは無アルカリガラス繊維で
、繊維径が5〜15ミクロン、長さが5〜50ミクロン
であることが望ましい。即ち5ミクロン未満では積層板
表面の外観を改良することができず、繊維径が15ミク
ロン、長さが■ミクロンをこえると基材への含浸性が低
下するためでちる。添加量については好ましくは樹脂フ
ェノの1〜3)%であることが望ましい。即ち1%未満
では積層板表面の外観を改良することができず、I%を
こえると基材への含浸性が低下するためである。基材に
含浸する樹脂フェノとしてはフェノ−II/樹脂、クレ
ゾー/L/9j脂、エポキシ樹脂、不飽和ポリエステル
樹脂、メラミン樹脂、ポリイミド、ポリブタツエン、ポ
リアミド、ポリアミドイミド、ボリスルブオン、ポリフ
ェニレンサルファイド、ポリフェニレンオキサイド、ポ
リブチレンテレフタレート、ポリエーテpエーテμケト
ン、弗化樹脂等の単独、変性物、混合物等が用いられ必
要に応じて粘度調整に水、メチルアルコール、アセトン
、シクロヘキサノン、スチレン、モノマー等の1flt
lKを添加したもので、基材としては、ガラス、アスベ
スト等の無機繊維やポリエステル、ポリアミド、カーボ
ン、ポリビニルアルコール、ポリアクリル、アラミド等
の有機合成繊維や木綿等の天然繊維からなる織布、不織
布、マプト或は紙又はこれらの組合せ基材等である。金
属箔としては銅、鉄、アルミニウム、真鍮、ニッケル、
ステンレス鋼等のljl、複合、表面処理品等で、必要
に応じて片面に接着剤層を設は接着性を更に向上させる
ことができる。The inorganic powder filler used in the present invention is limited to aluminum hydroxide, and its particle size is not limited, but it is preferable that the particle size is less than IOO mesh for better dispersibility. The amount added is preferably 1 to 30% by weight (hereinafter simply referred to as %) of the resin phenol. That is, if it is less than 1%, it is difficult to improve the heat resistance;
This is because if it exceeds %, the impregnating property to the base material will decrease. The glass fibers are preferably alkali-free glass fibers with a fiber diameter of 5 to 15 microns and a length of 5 to 50 microns. That is, if the fiber diameter is less than 5 microns, the appearance of the surface of the laminate cannot be improved, and if the fiber diameter exceeds 15 microns and the length exceeds 1 micron, the impregnation into the base material will deteriorate. The amount added is preferably 1 to 3% of the resin phenol. That is, if it is less than 1%, the appearance of the laminate surface cannot be improved, and if it exceeds I%, the impregnation into the base material will be reduced. Examples of the resin pheno to be impregnated into the base material include pheno-II/resin, creso/L/9j resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutatsuene, polyamide, polyamideimide, boris sulfone, polyphenylene sulfide, polyphenylene oxide, Polybutylene terephthalate, polyether pether μ ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, 1 flt of water, methyl alcohol, acetone, cyclohexanone, styrene, monomer, etc. is used to adjust the viscosity.
The base material is woven fabric or non-woven fabric made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, carbon, polyvinyl alcohol, polyacrylic, aramid, and natural fibers such as cotton. , Maputo or paper, or a combination thereof. Metal foils include copper, iron, aluminum, brass, nickel,
Adhesiveness can be further improved by providing an adhesive layer on one side of a material such as stainless steel, composite material, surface treated product, etc., if necessary.
積層成形としては多段成形法、マルチロール法、接触圧
法、無圧成形法、ダブルベルト法等の積層成形法全般を
用いることができ、特に限定するものではない。As the lamination molding, general lamination molding methods such as a multi-stage molding method, a multi-roll method, a contact pressure method, a pressureless molding method, and a double belt method can be used, and are not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
充填剤として200メツシユの水酸化アルミニウム8%
と繊維径口ミクロン、繊維長おミクロンのシフンカップ
リング剤処理ガラス繊!7%とを含有する不飽和ポリエ
ステル樹脂フェノに厚さ0,2nの長尺ガフスベーバー
を樹脂量が50%になるように含浸した樹脂含浸基材5
枚の上下面に、充填剤を含有しない不飽和ポリエステル
樹脂フェノに厚さ0.2Hの長尺ガフス布を樹脂量が5
0%になるように含浸した樹脂含浸基材を夫々1枚づつ
配し、更にその上下面に接着剤層付厚さ0.035 m
の長尺銅箔を夫々配設した長尺帯状積層体を無圧で14
5°CでI分間積堺成形後、所要寸法に切断して電気用
H層板を得た。Example filler: 200 mesh aluminum hydroxide 8%
And fiber diameter micron, fiber length micron Schiffen coupling agent treated glass fiber! Resin-impregnated base material 5 obtained by impregnating an unsaturated polyester resin pheno containing 7% with a long gaffs barber with a thickness of 0.2n so that the resin amount is 50%.
On the top and bottom surfaces of the sheet, a long guff cloth with a thickness of 0.2H is coated with unsaturated polyester resin phenol containing no filler and the amount of resin is 5.
One resin-impregnated base material impregnated to a concentration of 0% was placed on each side, and an adhesive layer was applied to the top and bottom surfaces to a thickness of 0.035 m.
14 long strip-shaped laminates each having a long copper foil arranged thereon without pressure.
After molding for 1 minute at 5°C, the product was cut into required dimensions to obtain an electrical H-layer board.
比較例
実施例の充填剤を含有しない樹脂含浸ガフス布7枚の上
下面に実施例の銅箔を配設した積層体を実施例と同様に
処理して電気用積層板を得た。Comparative Example A laminate in which the copper foil of the example was disposed on the upper and lower surfaces of seven resin-impregnated guff cloths containing no filler was treated in the same manner as in the example to obtain an electrical laminate.
実施例及び比較例の電気用積層板の性能は第1表で明白
なように本発明のものの性能はよく、本発明の優れてい
ることを確認した。As is clear from Table 1, the performance of the electrical laminates of Examples and Comparative Examples was good, confirming the superiority of the present invention.
第1表 注 奈オープン耐熱性Table 1 note Nana open heat resistance
Claims (3)
を含有する樹脂ワニスを含浸してなる樹脂含浸基材の上
下面に、充填剤を含有しない樹脂含浸基材を配し、更に
その上面及び又は下面に金属箔を配設した積層体を積層
成形してなることを特とする電気用積層板。(1) A resin-impregnated base material containing no filler is arranged on the upper and lower surfaces of a resin-impregnated base material impregnated with a resin varnish containing aluminum hydroxide and glass fibers as fillers, and the upper surface and/or An electrical laminate, characterized in that it is formed by laminating and molding a laminate with metal foil arranged on the bottom surface.
50ミクロンであることを特徴とする特許請求の範囲第
1項記載の電気用積層板。(2) The glass fiber has a diameter of 5 to 15 microns and a length of 5 to 15 microns.
The electrical laminate according to claim 1, characterized in that the thickness is 50 microns.
のであることを特徴とする特許請求の範囲第1項、第2
項記載の電気用積層板。(3) Claims 1 and 2, characterized in that the glass fiber is treated with a silane coupling agent.
Electrical laminate as described in section.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31009687A JPH01150542A (en) | 1987-12-07 | 1987-12-07 | Laminated plate for electric use |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP31009687A JPH01150542A (en) | 1987-12-07 | 1987-12-07 | Laminated plate for electric use |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01150542A true JPH01150542A (en) | 1989-06-13 |
Family
ID=18001134
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP31009687A Pending JPH01150542A (en) | 1987-12-07 | 1987-12-07 | Laminated plate for electric use |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01150542A (en) |
-
1987
- 1987-12-07 JP JP31009687A patent/JPH01150542A/en active Pending
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