JPH05315718A - Electrical laminated plate - Google Patents

Abstract

PURPOSE:To provide an electrical laminate excellent in heat resistance by integrally disposing a metal foil on the upper and lower surfaces of predetermined sheets of resin-impregnated base materials, each resin-impregnated base material containing a conductor containing resin-impregnated base material coated with resin. CONSTITUTION:Resin used for a resin-impregnated base material includes single materials, denatured materials, and mixed materials of phenol resin and epoxy resin and the like for example. To the resin there are added a conductor coated with thermosetting resin or thermoplastic resin. For the conductor there are employed silver, copper, and carbon, etc. For the amount of addition of the conductor 10 to 200 pts. are preferable to 100 pts. by weight of the resin. For the metal foil there are employed single foils, alloy foils, and composite foils of copper, aluminum, brass, nickel, and iron, and the like, and there may be provided a bonding agent layer if necessary. For conditions of integration there may be selected hardening temperature, hardening time, and molding pressure for the resin, base material, and thickness thereof, and there may be employed a continuous fabrication method such as a zero-pressure continuous process, a double belt molding process, and a multi-roll process, etc.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric laminate used in electronic equipment, electric equipment, calculators, communication equipment and the like.

[0002]

2. Description of the Related Art In recent years, printed wiring boards, multilayer printed wiring boards,
There is a strong demand for high thermal conductivity of electrical laminates. For this reason, silica and alumina fillers having high thermal conductivity are added to the resin, but the thermal conductivity is 50 to 6 in the former case.
0 cal / cm. sec. ° C. × 10 ^-4 , the latter 60 ~
70 cal / cm. sec. ° C. It is about 10 ⁻⁴ .

[0003]

As described in the prior art, the thermal conductivity is 50 to 70 cal / cm.sup.2 even when silica or alumina filler having excellent high thermal conductivity is used. sec.
° C. It is about 10 ⁻⁴ . The present invention has been made in view of the above problems in the prior art, and an object of the present invention is to provide an electrical laminate having excellent thermal conductivity, which is used for a printed wiring board and a multilayer printed wiring board. To do so.

[0004]

According to the present invention, a metal foil is disposed and integrated on the upper surface and / or the lower surface of a required number of resin-impregnated base materials including a resin-coated conductive material-containing resin-impregnated base material. The present invention will be described in detail below because the above-mentioned object can be achieved because of the characteristic electrical laminate.

The resin of the resin-impregnated base material used in the present invention includes phenol resin, unsaturated polyester resin, epoxy resin, polyimide resin, polyphenylene oxide resin,
The polyethylene terephthalate resin, the polybutylene terephthalate resin, the polyphenylene sulfide resin, the fluororesin, and the like may be used alone, or as a modified product or mixture. A resin-coated conductive material is added to the resin. As the conductive material, silver, copper, carbon or the like is used, and if it is left as it is, there is a great risk of electric short circuit, so phenol resin, melamine resin, unsaturated polyester resin, epoxy resin, polyimide resin, polyester resin, fluorine resin, silicon It is used after being coated with a thermosetting resin such as a resin or a thermoplastic resin. The amount of the conductive material added is preferably 10 to 200 parts with respect to 100 parts by weight of the resin (hereinafter simply referred to as "part"). That is, if it is less than 10 parts, it is difficult to improve the thermal conductivity, and if it exceeds 200 parts, there is a risk of electrical short circuit. The resin coating of the conductive material is, for example, a resin powder that has been dried after being mixed with the resin varnish and baked, and is not particularly limited. As the filler other than the conductive material added as necessary, talc, clay, silica, calcium carbonate, inorganic powder filler such as aluminum hydroxide, glass fiber, asbestos fiber,
Fibrous fillers such as pulp fibers, synthetic fibers and ceramic fibers can be included. As the base material of the resin-impregnated base material, glass, inorganic fibers such as asbestos, polyester, polyamide, polyacryl, polyvinyl alcohol, polyimide, organic fibers such as fluororesin and natural fibers such as cotton, woven cloth, nonwoven cloth, paper Is. Further, the resin may be impregnated with only the same resin, but it is also possible to make the impregnation more uniform by primary impregnation with the same resin or different type resin and secondary impregnation. Thus, a resin-impregnated base material containing a conductive material and a resin-impregnated base material that does not contain a conductive material are obtained by impregnating the base material with a resin and then heating and drying the resin as necessary. As for the combination of the resin-impregnated base materials, it is preferable to dispose a conductive material-containing resin-impregnated base material whose core portion is coated with a resin, and a normal resin-impregnated base material on the upper and lower surfaces thereof. As the metal foil, copper, aluminum, brass,
Nickel, iron or the like alone, an alloy, or a composite foil is used, and an adhesive layer can be provided on one side of the metal foil if necessary. As for the integration conditions, the curing temperature, curing time, and molding pressure can be selected depending on the resin, substrate, thickness, etc., and continuous manufacturing methods such as pressureless continuous method, double belt molding method, and multi-roll method should be used. Can also The present invention will be described below based on examples.

[0006]

Example 1 A conductive material 1 obtained by baking 100 parts by weight of a bisphenol A type epoxy resin (hereinafter simply referred to as "part") with 2 parts of dicyandiamide and 100 parts of silver powder with 5 parts of an epoxy resin.
A glass nonwoven fabric having a thickness of 0.8 mm was impregnated with 00 parts of varnish to a resin content of 45%, and dried to obtain a resin-coated conductive material-containing prepreg. A varnish prepared by adding 2 parts of dicyandiamide to 100 parts of an epoxy resin is impregnated into a glass cloth having a thickness of 0.1 mm so that the amount of the resin is 45%, dried, and two prepregs each are placed, and further outside thereof. Thickness 0.03
Molding pressure of 40Kg / cm for laminates with 5mm copper foil
² , 1.2m thick by heat and pressure molding at 165 ° C for 90 minutes
A double-sided copper clad laminate of m was obtained.

[0007]

Example 2 A double-sided copper clad laminate having a thickness of 1.2 mm was obtained in the same manner as in Example 1 except that 100 parts of copper powder was used instead of 100 parts of silver powder.

[0008]

[Comparative Example] A glass nonwoven fabric was treated in the same manner as in Example 1 except that the same resin varnish as that of the glass cloth was used, and the thickness was 1.2 m.
A double-sided copper clad laminate of m was obtained.

Table 1 shows the thermal conductivity (cal / cm.sec. ° C. × 10 ^-4 ) of the laminated plates of Examples 1 and 2 and Comparative Example.

[0010]

[Table 1]

[0011]

The present invention is constructed as described above.
It was confirmed that the electrical laminate having the structure described in the claims has an improved thermal conductivity and is excellent in the present invention.

Claims (1)

[Claims] 1. A laminated board for electrical use, characterized in that a required number of resin-impregnated base materials including a resin-impregnated resin-impregnated base material coated with resin are provided with metal foils on the upper surface and / or lower surface thereof. ..