JPH01118493U - - Google Patents
Info
- Publication number
- JPH01118493U JPH01118493U JP1302788U JP1302788U JPH01118493U JP H01118493 U JPH01118493 U JP H01118493U JP 1302788 U JP1302788 U JP 1302788U JP 1302788 U JP1302788 U JP 1302788U JP H01118493 U JPH01118493 U JP H01118493U
- Authority
- JP
- Japan
- Prior art keywords
- components
- lid
- circuit unit
- power supply
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 2
- 230000017525 heat dissipation Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 2
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
Description
第１図は本考案の光海底中継器の給電回路ユニ
ツトを、蓋を取り外した状態で示す平面図、第２
図は第１図の線―における断面図、第３図は
第２図の線―における断面図、第４図は従来
の光海底中継器の給電回路ユニツトを示す断面図
である。
１…回路ユニツトケース、２…蓋、２ａ…放熱
部、３…プリント板、１０…トランス、１１…抵
抗器。
Figure 1 is a plan view showing the power supply circuit unit of the optical submarine repeater of the present invention with the lid removed;
1, FIG. 3 is a sectional view taken along the line ``-'' in FIG. 2, and FIG. 4 is a sectional view showing a power supply circuit unit of a conventional optical submarine repeater. DESCRIPTION OF SYMBOLS 1... Circuit unit case, 2... Lid, 2a... Heat sink, 3... Printed board, 10... Transformer, 11... Resistor.
Claims (1)
の電子回路部品１０，１１を実装したプリント板
３を収容・固定し、前記ケースに金属製の蓋２を
固定して前記回路部品を密封した光海底中継器の
給電回路ユニツトにおいて、少なくとも前記回路
部品の中で発熱性の高い部品１０，１１に対応す
る位置にて、前記蓋２の内壁がこれらの発熱部品
に近接するように、該蓋２の肉厚を大きくしたこ
とを特徴とする給電回路ユニツトの放熱構造。 A printed circuit board 3 on which various electronic circuit components 10 and 11 are mounted is housed and fixed inside a metal circuit unit case 1, and a metal lid 2 is fixed to the case to seal the circuit components. In the power supply circuit unit of the submarine repeater, the lid 2 is arranged such that the inner wall of the lid 2 is close to the heat-generating components at least at a position corresponding to the components 10 and 11 that generate high heat among the circuit components. A heat dissipation structure for a power supply circuit unit characterized by an increased wall thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1302788U JPH01118493U (en) | 1988-02-04 | 1988-02-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1302788U JPH01118493U (en) | 1988-02-04 | 1988-02-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01118493U true JPH01118493U (en) | 1989-08-10 |
Family
ID=31222987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1302788U Pending JPH01118493U (en) | 1988-02-04 | 1988-02-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01118493U (en) |
-
1988
- 1988-02-04 JP JP1302788U patent/JPH01118493U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS59158389U (en) | Control device | |
| JPH01118493U (en) | ||
| JPS61158957U (en) | ||
| JPH0326105U (en) | ||
| JPS6380894U (en) | ||
| JPH0385696U (en) | ||
| JPS6425630U (en) | ||
| JPS5853196U (en) | Heat dissipation mechanism | |
| JPS6255395U (en) | ||
| JPH03102783U (en) | ||
| JPS646085U (en) | ||
| JPS61158990U (en) | ||
| JPH0227759U (en) | ||
| JPS6194394U (en) | ||
| JPH01174990U (en) | ||
| JPS61142487U (en) | ||
| JPS63170996U (en) | ||
| JP2001161931A5 (en) | ||
| JPS6230397U (en) | ||
| JPS61192455U (en) | ||
| JPS60121696U (en) | Heat dissipation structure of printed circuit board mounting case | |
| JPH038447U (en) | ||
| JPS6289199U (en) | ||
| JPS61151392U (en) | ||
| JPS6155393U (en) |