JPS5853196U - Heat dissipation mechanism - Google Patents
Heat dissipation mechanismInfo
- Publication number
- JPS5853196U JPS5853196U JP14839181U JP14839181U JPS5853196U JP S5853196 U JPS5853196 U JP S5853196U JP 14839181 U JP14839181 U JP 14839181U JP 14839181 U JP14839181 U JP 14839181U JP S5853196 U JPS5853196 U JP S5853196U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation mechanism
- circuit board
- housing
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はリンキングコンバータ方式の電源回路の回路図
、第２図はこの考案の一実施例の断面構′成図、第３図
は第２図におけるＡ−Ａ’矢矢視内向断面図ある。
１・・・・・・上部シャーシ、２・・・・・−下ｉシャ
ーシ、４・・・・・・印刷基板、５，８・・・・・・回
路部品、６・・回熱伝導板。Fig. 1 is a circuit diagram of a linking converter type power supply circuit, Fig. 2 is a sectional view of an embodiment of this invention, and Fig. 3 is an inward sectional view taken along the line A-A' in Fig. 2. . 1...Upper chassis, 2...-Lower i chassis, 4...Printed circuit board, 5, 8...Circuit components, 6... Heat conduction plate .
Claims (1)
の内壁面に一端部が固着され他端部が上記印刷基板に固
着された熱伝導部材と、この熱伝導部材に取り付けられ
た回路部品とを具備したことを特徴とする放熱機構。integrally, a printed circuit board provided within the housing, a thermally conductive member having one end fixed to the inner wall surface of the housing and the other end fixed to the printed circuit board, and a circuit attached to the thermally conductive member. A heat dissipation mechanism characterized by comprising parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14839181U JPS5853196U (en) | 1981-10-06 | 1981-10-06 | Heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14839181U JPS5853196U (en) | 1981-10-06 | 1981-10-06 | Heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5853196U true JPS5853196U (en) | 1983-04-11 |
Family
ID=29941210
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14839181U Pending JPS5853196U (en) | 1981-10-06 | 1981-10-06 | Heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5853196U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327250A (en) * | 1992-05-22 | 1993-12-10 | Mitsubishi Electric Corp | Heat radiating device for electronic equipment |
| JP2006147862A (en) * | 2004-11-19 | 2006-06-08 | Hoshizaki Electric Co Ltd | Operation control device of cooling storage |
-
1981
- 1981-10-06 JP JP14839181U patent/JPS5853196U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05327250A (en) * | 1992-05-22 | 1993-12-10 | Mitsubishi Electric Corp | Heat radiating device for electronic equipment |
| JP2006147862A (en) * | 2004-11-19 | 2006-06-08 | Hoshizaki Electric Co Ltd | Operation control device of cooling storage |
| JP4555057B2 (en) * | 2004-11-19 | 2010-09-29 | ホシザキ電機株式会社 | Cooling storage operation control device |
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