JPS6289199U - - Google Patents
Info
- Publication number
- JPS6289199U JPS6289199U JP17914685U JP17914685U JPS6289199U JP S6289199 U JPS6289199 U JP S6289199U JP 17914685 U JP17914685 U JP 17914685U JP 17914685 U JP17914685 U JP 17914685U JP S6289199 U JPS6289199 U JP S6289199U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- case body
- stay
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 3
- 230000037431 insertion Effects 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例の構成を説明する一
部破断断面図である。
１……プリント基板、２……ステー、２ａ……
挟持部、２ｂ，２ｃ……挟持片、３……ケース、
３ａ……蓋体、３ｂ……突起部、３ｃ……ガイド
レール、３ｄ……ケース本体、４……ねじ、１０
……パワートランジスタ、１１……ねじ。
FIG. 1 is a partially cutaway sectional view illustrating the configuration of an embodiment of the present invention. 1... Printed circuit board, 2... Stay, 2a...
Clamping part, 2b, 2c...clipping piece, 3...case,
3a...Lid, 3b...Protrusion, 3c...Guide rail, 3d...Case body, 4...Screw, 10
...Power transistor, 11...Screw.
Claims (1)
するケース本体と、前記開口部を覆うために前記
ケース本体に固定される蓋体とを備え、 前記プリント基板は挟持部を有する一対のステ
ーを介して前記蓋体に取付けられ、 前記ケース本体には、前記プリント基板の挿入
方向に延び、しかも前記各ステーに設けられた前
記挟持部に嵌合される一対のガイドレールが設け
られているプリント基板上電子部品の放熱装置で
あつて、 前記ステーは熱伝導性に優れた材料から形成さ
れ、前記プリント基板上の発熱性電子部品は、前
記ステーに固定されていることを特徴とするプリ
ント基板上電子部品の放熱装置。 (2) 前記ステー、ケース本体および蓋体はそれ
ぞれ金属性とされることを特徴とする前記実用新
案登録請求の範囲第１項記載のプリント基板上電
子部品の放熱装置。[Claims for Utility Model Registration] (1) A case body having an opening for inserting a printed circuit board, and a lid fixed to the case body to cover the opening, the printed circuit board are attached to the lid body via a pair of stays having clamping parts, and the case body has a pair of brackets extending in the insertion direction of the printed circuit board and fitted into the clamping parts provided on each of the stays. The heat dissipation device for electronic components on a printed circuit board is provided with a guide rail, wherein the stay is made of a material with excellent thermal conductivity, and the heat generating electronic component on the printed circuit board is fixed to the stay. A heat dissipation device for electronic components on a printed circuit board, characterized by: (2) The heat dissipation device for electronic components on a printed circuit board according to claim 1, wherein the stay, the case body, and the lid are each made of metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17914685U JPS6289199U (en) | 1985-11-22 | 1985-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17914685U JPS6289199U (en) | 1985-11-22 | 1985-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6289199U true JPS6289199U (en) | 1987-06-08 |
Family
ID=31121946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17914685U Pending JPS6289199U (en) | 1985-11-22 | 1985-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6289199U (en) |
-
1985
- 1985-11-22 JP JP17914685U patent/JPS6289199U/ja active Pending
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