JPS61192455U - - Google Patents
Info
- Publication number
- JPS61192455U JPS61192455U JP7500985U JP7500985U JPS61192455U JP S61192455 U JPS61192455 U JP S61192455U JP 7500985 U JP7500985 U JP 7500985U JP 7500985 U JP7500985 U JP 7500985U JP S61192455 U JPS61192455 U JP S61192455U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- power transistor
- circuit board
- printed circuit
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案放熱構造の一実施例を示す平面
図、第２図は第１図のＡ‐Ａ断面図、第３図は第
１図のＢ‐Ｂ断面図、第４図は第１図のＣ‐Ｃ断
面図、第５図は従来の側面図である。
１…印刷回路板、２…パワートランジスタ、３
，７…熱伝導性絶縁シート、４…放熱板、６…絶
縁スペーサ、９…金属ケース、１０…樹脂スペー
サ。
Figure 1 is a plan view showing one embodiment of the heat dissipation structure of the present invention, Figure 2 is a sectional view taken along line AA in Figure 1, Figure 3 is a sectional view taken along line BB in Figure 1, and Figure 4 is a sectional view taken along line BB in Figure 1. FIG. 1 is a sectional view taken along line CC, and FIG. 5 is a side view of the conventional device. 1...Printed circuit board, 2...Power transistor, 3
, 7... thermally conductive insulating sheet, 4... heat sink, 6... insulating spacer, 9... metal case, 10... resin spacer.
Claims (1)
刷回路板を金属ケースに収納した小型電装品にお
いて、 (b) パワートランジスタの放熱用ヒートシンク
と印刷回路板との間に挿入され、位置決めを行な
つて半田付け固定された位置決め用突起を設けた
樹脂スペーサと、 (c) 金属ケースに一体となつて設けた張り出し
部を有し、 (d) 前記張り出し部にパワートランジスタの放
熱面を耐熱伝導絶縁シートを介して直接密着固定
した小型電装品におけるパワートランジスタの放
熱構造。[Scope of Claim for Utility Model Registration] (a) A small electrical device in which a printed circuit board mounted with multiple power transistors is housed in a metal case, (b) Between the heat sink for heat dissipation of the power transistors and the printed circuit board. (c) a resin spacer provided with a positioning protrusion that is inserted, positioned, and fixed by soldering; (c) a projecting portion integrally provided with a metal case; (d) a power transistor in the projecting portion; A heat dissipation structure for a power transistor in a small electrical device in which the heat dissipation surface of the power transistor is directly fixed in close contact with a heat-resistant conductive insulating sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7500985U JPS61192455U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7500985U JPS61192455U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192455U true JPS61192455U (en) | 1986-11-29 |
Family
ID=30615830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7500985U Pending JPS61192455U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192455U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01164630U (en) * | 1988-05-06 | 1989-11-16 |
-
1985
- 1985-05-22 JP JP7500985U patent/JPS61192455U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01164630U (en) * | 1988-05-06 | 1989-11-16 |
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