[go: up one dir, main page]

JP7652879B2 - ライナー付き両面粘着シート - Google Patents

ライナー付き両面粘着シート Download PDF

Info

Publication number
JP7652879B2
JP7652879B2 JP2023503372A JP2023503372A JP7652879B2 JP 7652879 B2 JP7652879 B2 JP 7652879B2 JP 2023503372 A JP2023503372 A JP 2023503372A JP 2023503372 A JP2023503372 A JP 2023503372A JP 7652879 B2 JP7652879 B2 JP 7652879B2
Authority
JP
Japan
Prior art keywords
liner
double
sided
adhesive sheet
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023503372A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022185610A1 (zh
Inventor
高正 平山
昭徳 西尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of JPWO2022185610A1 publication Critical patent/JPWO2022185610A1/ja
Application granted granted Critical
Publication of JP7652879B2 publication Critical patent/JP7652879B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2023503372A 2021-03-05 2021-11-01 ライナー付き両面粘着シート Active JP7652879B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021035435 2021-03-05
JP2021035435 2021-03-05
PCT/JP2021/040262 WO2022185610A1 (ja) 2021-03-05 2021-11-01 ライナー付き両面粘着シート

Publications (2)

Publication Number Publication Date
JPWO2022185610A1 JPWO2022185610A1 (zh) 2022-09-09
JP7652879B2 true JP7652879B2 (ja) 2025-03-27

Family

ID=83154233

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503372A Active JP7652879B2 (ja) 2021-03-05 2021-11-01 ライナー付き両面粘着シート

Country Status (5)

Country Link
JP (1) JP7652879B2 (zh)
KR (1) KR20230141836A (zh)
CN (1) CN116897196A (zh)
TW (1) TWI809659B (zh)
WO (1) WO2022185610A1 (zh)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292916A (ja) 2002-04-08 2003-10-15 Nitto Denko Corp 粘着シートを用いた被着体加工方法
JP2004266179A (ja) 2003-03-04 2004-09-24 Denki Kagaku Kogyo Kk 半導体ウエハ固定用シート
JP2012025813A (ja) 2010-07-21 2012-02-09 Dic Corp 両面粘着テープ
JP2012184292A (ja) 2011-03-03 2012-09-27 Nitto Denko Corp 加熱剥離型粘着シート
JP2015168711A (ja) 2014-03-05 2015-09-28 日東電工株式会社 粘着シート
JP2015183162A (ja) 2014-03-26 2015-10-22 ニッタ株式会社 仮固定用両面粘着テープおよびそれを用いた被加工物の仮固定方法
JP2016535151A (ja) 2013-09-17 2016-11-10 日東電工株式会社 両面粘着テープ
JP2018127582A (ja) 2017-02-10 2018-08-16 リンテック株式会社 粘着シートおよび貼着体の製造方法
JP2019070072A (ja) 2017-10-06 2019-05-09 日東電工株式会社 剥離フィルム付き粘着シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4069625B2 (ja) 2002-01-09 2008-04-02 日立化成工業株式会社 セパレータ付き感圧型接着シート及び光学部材組立体並びにその組立方法
CN107201186A (zh) * 2016-03-16 2017-09-26 利昌电气工业有限公司 加热可降低黏着力的黏着胶带
DE102017221270B4 (de) * 2017-11-28 2021-08-12 Tesa Se Verfahren zur Herstellung eines Siegelklebebandes und Verwendung

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003292916A (ja) 2002-04-08 2003-10-15 Nitto Denko Corp 粘着シートを用いた被着体加工方法
JP2004266179A (ja) 2003-03-04 2004-09-24 Denki Kagaku Kogyo Kk 半導体ウエハ固定用シート
JP2012025813A (ja) 2010-07-21 2012-02-09 Dic Corp 両面粘着テープ
JP2012184292A (ja) 2011-03-03 2012-09-27 Nitto Denko Corp 加熱剥離型粘着シート
JP2016535151A (ja) 2013-09-17 2016-11-10 日東電工株式会社 両面粘着テープ
JP2015168711A (ja) 2014-03-05 2015-09-28 日東電工株式会社 粘着シート
JP2015183162A (ja) 2014-03-26 2015-10-22 ニッタ株式会社 仮固定用両面粘着テープおよびそれを用いた被加工物の仮固定方法
JP2018127582A (ja) 2017-02-10 2018-08-16 リンテック株式会社 粘着シートおよび貼着体の製造方法
JP2019070072A (ja) 2017-10-06 2019-05-09 日東電工株式会社 剥離フィルム付き粘着シート

Also Published As

Publication number Publication date
JPWO2022185610A1 (zh) 2022-09-09
TWI809659B (zh) 2023-07-21
TW202235567A (zh) 2022-09-16
CN116897196A (zh) 2023-10-17
WO2022185610A1 (ja) 2022-09-09
KR20230141836A (ko) 2023-10-10

Similar Documents

Publication Publication Date Title
US7635516B2 (en) Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
US7811647B2 (en) Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
JP5349803B2 (ja) 熱剥離型両面粘着テープ又はシートおよび被着体の加工方法
JP6378501B2 (ja) 粘着シート
JP5921927B2 (ja) 加熱剥離型粘着シート
JP7652880B2 (ja) ライナー付両面粘着シート
US20130335879A1 (en) Double-sided adhesive tape or sheet, and adherend processing method
JP2000248240A (ja) 加熱剥離型粘着シート
US20100119757A1 (en) Heat-peelable double-sided pressure-sensitive adhesive sheet
JP2016108353A (ja) 粘着シート
WO2022123932A1 (ja) 粘着シート
JP7133355B2 (ja) 粘着シート
JP7428473B2 (ja) 電子部品の製造方法
JP7652879B2 (ja) ライナー付き両面粘着シート
WO2023021773A1 (ja) 粘着シート
WO2022185611A1 (ja) 粘着シート
WO2022123931A1 (ja) 粘着シート
JP2025024948A (ja) 粘着シートおよびダイシング・ダイボンドフィルム
WO2025022707A1 (ja) 粘着シート
JP2024171007A (ja) 粘着シート

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230524

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240729

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241022

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241217

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250212

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250213

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250304

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250314