JP7627570B2 - 3D object manufacturing device and display method - Google Patents

Description

This disclosure relates to a three-dimensional object manufacturing device that inspects three-dimensional objects using images captured by a camera.

Various techniques have been proposed in the past for the above-mentioned three-dimensional object manufacturing apparatus. For example, the technique described in the following Patent Document 1 is a modeling apparatus that models a predetermined object by repeating a laying process of laying material powder in layers and a heating and solidifying process of heating and solidifying the material powder laid in layers, and has an imaging unit that images the surface of the material powder laid in layers after the laying process or the heating and solidifying process, and a success/failure determination unit that determines whether the modeling is normal or abnormal based on the image captured by the imaging unit.

According to the description in the following Patent Document 1, the modeling device has a success/failure determination unit that determines whether the modeling is normal or abnormal based on the image captured by the imaging unit of the surface of the material powder laid in layers. This makes it possible to recognize the occurrence of modeling defects without waiting for the completion of modeling of the model, thereby reducing processing time and waste of material powder.

JP 2019-142101 A

However, the captured image used in the judgment by the correct/incorrect judgment unit is an image of the surface of the material powder. Therefore, when the correct/incorrect judgment unit is applied to a 3D object manufacturing device that manufactures 3D objects by 3D additive manufacturing, it is possible to judge whether the 3D additive manufacturing is normal or abnormal for the surface of the 3D object upon completion of each process of the 3D additive manufacturing, but it is difficult to verify the 3D additive manufacturing in three dimensions.

The present disclosure has been made in consideration of the above-mentioned points, and aims to provide a three-dimensional object manufacturing device that can verify three-dimensionally the three-dimensional additive manufacturing process using a 3D model generated from a captured image of the three-dimensional object manufactured by the three-dimensional additive manufacturing process.

The present specification relates to a three-dimensional object manufacturing apparatus for manufacturing a three-dimensional laminated electronic device composed of a plurality of structures through a plurality of processes of three-dimensional additive manufacturing based on three-dimensional information, the apparatus comprising: a camera for photographing the three-dimensional laminated electronic device from above; a three-dimensional CG (computer graphics) processing section for generating a 3D model of the three-dimensional laminated electronic device; and a display for displaying the 3D model of the three-dimensional laminated electronic device, the three-dimensional CG processing section including an acquisition processing section for acquiring an image of a process-completed body for each process by photographing the three-dimensional laminated electronic device at the completion of the process of three-dimensional additive manufacturing of the same type of structure as a process-completed body without photographing with the camera every time the modeling of one layer is completed during three-dimensional additive manufacturing of the same type of structure, and a display for displaying the 3D model of the same type of structure that is three-dimensionally additively manufactured every time the process of three -dimensional additive manufacturing of the same type of structure is completed. a display processing unit that displays the 3D model of the three-dimensional stacked electronic device on the display with a viewer capable of displaying a cross section of the 3D model of the three-dimensional stacked electronic device or displaying the 3D model of the structure in a movable manner, wherein the plurality of structures include a plurality of types of structures, each of the plurality of types of structures including a plurality of types of structures and electronic components made of a plurality of types of materials, the plurality of processes include a process of forming structures made of the same type of material and a process of mounting electronic components, and the same type of structures is formed by one of the plurality of processes, and the second generation processing unit generates the 3D model of the three-dimensional stacked electronic device by arranging the 3D models of the plurality of types of structures generated for the plurality of processes .

According to the present disclosure, a three-dimensional object manufacturing device is capable of stereoscopically verifying three-dimensional additive manufacturing using a 3D model generated from captured images of a three-dimensional object manufactured by the three-dimensional additive manufacturing process.

FIG. 1 is a diagram showing a three-dimensional stacked electronic device manufacturing apparatus. FIG. 2 is a block diagram showing a control device. FIG. 2 is a block diagram showing a control device. 2A to 2C are diagrams illustrating each process of a manufacturing method for a three-dimensional stacked electronic device. 1 is a flowchart showing a method for displaying a three-dimensional laminated electronic device as a 3D model. FIG. 2 is a diagram illustrating a photographing unit when photographing is performed by a camera. 11A to 11C are images acquired for each process of 3D additive manufacturing, showing images of a 3D integrated electronic device projected from above when each process is completed. FIG. 11 is a diagram showing images acquired for each process of three-dimensional additive manufacturing, in which an area showing a modeled part in each process is extracted. 1A to 1C are diagrams showing 3D models of the molded parts for each process of 3D additive manufacturing. FIG. 13 is a diagram showing an aspect in which a 3D model of a three-dimensional laminated electronic device is displayed on a display. 1 is a flowchart showing a method for displaying a three-dimensional laminated electronic device as a 3D model. FIG. 2 is a diagram illustrating a photographing unit when photographing is performed by a camera. FIG. 13 shows a 3D model of a three-dimensional laminated electronic device upon completion of each process of three-dimensional additive manufacturing.

Below, preferred embodiments of the present disclosure will be described in detail with reference to the drawings. Note that in each drawing, some basic components are omitted, and the dimensional ratios of the various parts are not necessarily accurate.

Figure 1 shows a three-dimensional stacked electronic device manufacturing apparatus 10. The three-dimensional stacked electronic device manufacturing apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 24, a mounting unit 26, a heating section 214, an image capturing section 218, and a control device (see Figure 2) 27. The conveying device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the heating section 214, and the image capturing section 218 are disposed on a base 28 of the three-dimensional stacked electronic device manufacturing apparatus 10. The base 28 is generally rectangular, and in the following description, the longitudinal direction of the base 28 is referred to as the X-axis direction, and the lateral direction of the base 28 is referred to as the Y-axis direction.

The direction perpendicular to both the X-axis direction and the Y-axis direction will be referred to as the Z-axis direction (see Figures 6 and 12). The Z-axis direction is the up-down direction of the base 28, and is perpendicular to the horizontal plane. Furthermore, the Z-axis direction is the up-down direction of the three-dimensional stacked electronic device 222 (see (i) in Figure 4), that is, the height direction of the three-dimensional stacked electronic device 222.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 28 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. Furthermore, the X-axis slide mechanism 30 includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 includes a Y-axis slide rail 50 and a stage 52. The Y-axis slide rail 50 is disposed on the base 28 so as to extend in the Y-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. Therefore, the Y-axis slide rail 50 is movable in the X-axis direction. A stage 52 is held on the Y-axis slide rail 50 so that it can slide in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the stage 52 moves to any position in the Y-axis direction when driven by the electromagnetic motor 56. As a result, the stage 52 moves to any position on the base 28 when driven by the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The stage 52 has a base 60, a holding device 62, and a lifting device 64. The base 60 is formed in a flat plate shape, and a substrate (not shown) is placed on the upper surface. The holding devices 62 are provided on both sides of the base 60 in the X-axis direction. The substrate is fixedly held by clamping both edges in the X-axis direction of the substrate placed on the base 60 between the holding devices 62. The lifting device 64 is disposed below the base 60, and raises and lowers the base 60 in the Z-axis direction.

The substrate is made of a wax-based material (e.g., a brazing material) that melts with heat or a solvent. However, the substrate is not limited to this, and may be made of a peelable base material (e.g., a double-sided tape or film material with weak adhesive strength). However, when such double-sided tape is used as the substrate, the substrate is fixedly held to the base 60 by its adhesive strength, and the holding device 62 is not necessary.

The first modeling unit 22 is a unit that models a circuit wiring layer on a substrate placed on the base 60 of the stage 52, and has a first printing section 72 and a baking section 74. The first printing section 72 has an inkjet head (see FIG. 2) 76, and ejects metal ink in a linear shape onto the substrate placed on the base 60. Metal ink is a dispersion of metal particles in a solvent. The inkjet head 76 ejects metal ink from multiple nozzles, for example, by a piezo method using a piezoelectric element.

The baking section 74 has a laser irradiation device 78 (see FIG. 2). The laser irradiation device 78 is a device that irradiates a laser onto the metal ink discharged onto the substrate, and the metal ink irradiated with the laser is baked to form a circuit wiring layer. Note that baking of metal ink is a phenomenon in which the application of energy causes the evaporation of the solvent and the decomposition of the metal particle protective film, and the metal particles come into contact or fuse together, thereby increasing the electrical conductivity. Then, the metal ink is baked to form a metal circuit wiring layer.

The second modeling unit 24 is a unit that models an insulating layer on a substrate placed on the base 60 of the stage 52, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88, and ejects ultraviolet curing resin onto the substrate placed on the base 60. The ultraviolet curing resin is a resin that hardens when exposed to ultraviolet light. The inkjet head 88 may be, for example, a piezoelectric type that ejects resin from multiple nozzles by deformation of a piezoelectric element, or a thermal type that heats the resin to generate bubbles and eject the resin from multiple nozzles.

The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the top surface of the UV-curable resin discharged onto the substrate by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform. The irradiation device 92 is equipped with a mercury lamp or LED as a light source, and irradiates the UV-curable resin discharged onto the substrate with UV rays. This causes the UV-curable resin discharged onto the substrate to harden, forming an insulating layer.

The mounting unit 26 is a unit that mounts electronic components (see FIG. 4) 250 on a substrate placed on the base 60 of the stage 52, and has a supply section 100 and a mounting section 102. The supply section 100 has a plurality of tape feeders (see FIG. 2) 110 that feed the taped electronic components 250 one by one, and supplies the electronic components 250 at a supply position. Note that the supply section 100 is not limited to the tape feeder 110, and may be a tray-type supply device that picks up and supplies the electronic components 250 from a tray. The supply section 100 may also be configured to include both tape-type and tray-type supply devices, or other types of supply devices.

The mounting unit 102 has a mounting head (see FIG. 2) 112 and a moving device (see FIG. 2) 114. The mounting head 112 has a suction nozzle (not shown) for suctioning and holding the electronic component 250. The suction nozzle suctions and holds the electronic component 250 by sucking air when negative pressure is supplied from a positive/negative pressure supply device (not shown). Then, the electronic component 250 is released when a slight positive pressure is supplied from the positive/negative pressure supply device. The moving device 114 moves the mounting head 112 between the supply position of the electronic component 250 by the tape feeder 110 and the substrate placed on the base 60. As a result, in the mounting unit 102, the electronic component 250 supplied from the tape feeder 110 is held by the suction nozzle, and the electronic component 250 held by the suction nozzle is mounted on the substrate.

The transfer unit 200 is a unit that transfers the first conductive adhesive and the second conductive adhesive onto the substrate placed on the base 60 of the stage 52. The first conductive adhesive and the second conductive adhesive are conductive pastes that are cured by heating. However, the first conductive adhesive is cured by ultraviolet light prior to heating. The ultraviolet light is irradiated by the irradiation device 92 described above.

The transfer unit 200 further includes a supply section 202 and a transfer section 204. The supply section 202 includes a first adhesive supply device 206 (see FIG. 3) and a second adhesive supply device 208 (see FIG. 3). The first adhesive supply device 206 has a dip dish (not shown) onto which the first conductive adhesive is dispensed, and supplies the first conductive adhesive in a state in which the thickness is made uniform by spreading the first conductive adhesive on the dip dish with a squeegee (not shown). Similarly, the second adhesive supply device 208 has a dip dish (not shown) onto which the second conductive adhesive is dispensed, and supplies the second conductive adhesive in a state in which the thickness is made uniform by spreading the second conductive adhesive on the dip dish with a squeegee (not shown).

The transfer unit 204 has a transfer head 210 (see FIG. 3) and a moving device (see FIG. 3) 212. The transfer head 210 has a plurality of transfer needles (not shown) for transferring the first conductive adhesive or the second conductive adhesive. The transfer needles are dipped into the first conductive adhesive or the second conductive adhesive in each dip dish of the first adhesive supply device 206 or the second adhesive supply device 208. As a result, the first conductive adhesive or the second conductive adhesive adheres to the tip of the transfer needle. The transfer head 210 uses a plurality of transfer needles, one for adhering the first conductive adhesive and one for adhering the second conductive adhesive. The moving device 212 moves the transfer head 210 between each dip dish of the first adhesive supply device 206 or the second adhesive supply device 208 and the substrate placed on the base 60. As a result, in the transfer unit 204, the first conductive adhesive or the second conductive adhesive attached to the tip of the transfer needle is transferred onto the substrate.

The heating unit 214 has an irradiation device (see FIG. 3) 216. The irradiation device 216 is equipped with an infrared lamp or an infrared heater, and irradiates infrared rays onto the substrate. As a result, the first conductive adhesive or the second conductive adhesive transferred onto the substrate is heated and cured. The heating unit 214 may be equipped with an electric furnace instead of the irradiation device 216.

The photographing section 218 has a camera 220 (see FIG. 3). The camera 220 is arranged so as to be located directly above the substrate placed on the base 60 when the stage 52 moves below the photographing section 218. This allows the camera 220 to photograph the substrate from above.

As shown in Fig. 2 and Fig. 3, the control device 27 includes a controller 120 and a plurality of drive circuits 122. As shown in Fig. 2, the plurality of drive circuits 122 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the inkjet head 76, the laser irradiation device 78, the inkjet head 88, the flattening device 90, the irradiation device 92, the tape feeder 110, the mounting head 112, and the moving device 114. Furthermore, as shown in Fig. 3, the plurality of drive circuits 122 are connected to the first adhesive supply device 206, the second adhesive supply device 208, the transfer head 210, the moving device 212, the irradiation device 216, and the camera 220. The controller 120 includes a CPU 125, a ROM 126, a RAM 127, an EEPROM 128, etc., and is mainly a computer, and is connected to the plurality of drive circuits 122. As a result, the controller 120 controls the operations of the transport device 20, the first modeling unit 22, the second modeling unit 24, the mounting unit 26, the transfer unit 200, the heating unit 214, and the photographing unit 218. The EEPROM 128 stores manufacturing process data 129 (hereinafter referred to as process data 129) for the three-dimensional laminated electronic device manufacturing apparatus 10.

The controller 120 also includes an image processing device 130. The image processing device 130 processes the image data obtained by the camera 220. This allows the controller 120 to obtain various information from the image data. Furthermore, the controller 120 can perform three-dimensional CG (computer graphics) using the image processing device 130.

Furthermore, as shown in FIG. 2, the control device 27 includes a communication circuit 124. The communication circuit 124 is connected to the controller 120 and a PC (Personal Computer) 134. The PC 134 includes a display 134 and the like. This allows the controller 120 to, for example, control the operation of the display 134 of the PC 134 or to obtain various information from the PC 134.

Figure 4 shows a method for manufacturing a three-dimensional laminated electronic device 222 performed by the three-dimensional laminated electronic device manufacturing apparatus 10. In the method for manufacturing a three-dimensional laminated electronic device 222, each process (a) to (i) of three-dimensional additive manufacturing using the full additive method is performed based on three-dimensional information. As a result, after the completion of process (i), the three-dimensional laminated electronic device 222 is manufactured. The three-dimensional information is the above-mentioned process data 129 created using three-dimensional CAD data of the three-dimensional laminated electronic device 222, and is stored in the EEPROM 128 of the controller 120 by being transmitted from the PC 134 to the control device 27 of the three-dimensional laminated electronic device manufacturing apparatus 10, for example.

In the insulating layer forming process of (a), the first insulating layer 228 is formed on the substrate. To do so, the stage 52 is moved below the second modeling unit 24. As a result, the substrate set on the base 60 of the stage 52 is moved below the second modeling unit 24. Furthermore, in the second printing unit 84, the inkjet head 88 ejects a thin film of ultraviolet curing resin onto the upper surface of the substrate. Next, in the curing unit 86, the flattening device 90 flattens the ejected ultraviolet curing resin so that the film thickness is uniform. After that, the irradiation device 92 irradiates the flattened ultraviolet curing resin with ultraviolet light. As a result, the ultraviolet curing resin is hardened. Thereafter, the above-mentioned process in the second modeling unit 24 (i.e., the process in the second printing unit 84 and the process in the curing unit 86) are repeated, and the first insulating layer 228 is formed on the substrate.

However, in the process in the second modeling unit 24, when the process in the second printing section 84 and the process in the curing section 86 are repeated, the inkjet head 88 ejects the ultraviolet curable resin onto the upper surface of the substrate so that a predetermined portion is exposed in a generally circular shape. As a result, two through holes 230 are formed along the Z-axis direction in the first insulating layer 228. Each through hole 230 has a shape that gradually widens from the upper surface to the lower surface of the first insulating layer 228.

In the circuit wiring layer formation process of (b), the first circuit wiring layer 232 is formed on the first insulating layer 228 and hardened. To do so, the stage 52 is moved below the first modeling unit 22. Furthermore, in the first printing section 72, the inkjet head 76 ejects metal ink in a line shape according to the wiring circuit pattern onto the upper surface of the first insulating layer 228. As a result, two first circuit wiring layers 232 are formed on the upper surface of the first insulating layer 228. After that, in the baking section 74, the laser irradiation device 78 irradiates the metal ink ejected in a line shape with a laser. As a result, the metal ink is hardened. In this way, each of the first circuit wiring layers 232 is hardened on the upper surface of the first insulating layer 228.

In the via formation process of (c), the stage 52 is moved below the transfer unit 200. In the transfer unit 200, the first conductive adhesive supplied by the first adhesive supply device 206 is attached to the tip of the transfer needle of the transfer head 210. The attached first conductive adhesive fills each through hole 230 of the first insulating layer 228 as the transfer head 210 moves by the moving device 212. As a result, in the first insulating layer 228, the first conductive adhesive is transferred to each through hole 230. After that, the stage 52 is moved to the curing section 86 of the second modeling unit 24. In the curing section 86, the irradiation device 92 irradiates the transferred first conductive adhesive with ultraviolet light. As a result, in the first insulating layer 228, the first conductive adhesive in each through hole 230 is cured, and each via 234 of the first layer is formed in a structure electrically connected to each circuit wiring layer 232 of the first layer.

In the insulating layer formation process of (d), a second insulating layer 236 is formed on the first insulating layer 228. To achieve this, a process similar to that of (a) above is performed. At this time, two through holes 238 are formed in the second insulating layer 236 along the Z-axis direction. In each through hole 238, a part of the first insulating layer 228 and a part of each first circuit wiring layer 232 are exposed. Each through hole 238 has a shape that gradually widens from the top surface to the bottom surface of the second insulating layer 236.

In the circuit wiring layer formation process (e), two second circuit wiring layers 240 are formed on the second insulating layer 236 and cured. To achieve this, a process similar to that of the circuit wiring layer formation (b) above is carried out.

In the via formation process of (f), a process similar to the via formation process of (c) above is performed. As a result, in the second insulating layer 236, the first conductive adhesive in each through hole 238 hardens, forming each via 242 in the second layer in a structure in which it is electrically connected to each circuit wiring layer 232 in the first layer and each circuit wiring layer 240 in the second layer.

In the cavity layer formation process (g), a third insulating layer 244 is formed on the second insulating layer 236. To achieve this, a process similar to that of the insulating layer formation in (a) above is performed. However, in the process in the second modeling unit 24, when the process in the second printing section 84 and the process in the curing section 86 are repeated, the inkjet head 88 ejects ultraviolet curing resin onto the upper surface of the second insulating layer 236 so that a predetermined portion is exposed in a roughly rectangular shape. As a result, a cavity 246 is formed in the third insulating layer 244. Furthermore, the third insulating layer 244 is separated into two by the cavity 246. Note that a portion of each of the second circuit wiring layers 240 is exposed within the cavity 246.

In the process of forming the connection bumps (h), the stage 52 is moved below the transfer unit 200. In the transfer unit 200, the second conductive adhesive supplied by the second adhesive supply device 208 is attached to the tip of the transfer needle of the transfer head 210. As the transfer head 210 moves by the moving device 212, the attached second conductive adhesive is transferred to the upper surface of each of the second circuit wiring layers 240, a portion of which is exposed in the cavity 246. As a result, each bump 248 is formed in the cavity 246 with a structure in which it is electrically connected to each of the second circuit wiring layers 240.

(i) In the component mounting process, the stage 52 is moved below the mounting unit 26. In the mounting unit 26, the electronic component 250 supplied by the tape feeder 110 is held by the suction nozzle of the mounting head 112. The held electronic component 250 is mounted in the cavity 246 as the mounting head 112 moves by the moving device 114. At this time, each electrode (not shown) of the electronic component 250 faces downward and is connected to the second circuit wiring layer 240 via bumps 248. Two electronic components 250 are mounted in the cavity 246.

Then, the stage 52 is moved below the heating section 214. In the heating section 214, the irradiation device 216 irradiates infrared rays onto the substrate. This hardens the first conductive adhesive (the vias 234, 242 of the first and second layers) as well as the second conductive adhesive (the bumps 248), and the electronic component 250 is fixed. In this manner, the three-dimensional stacked electronic device 222 is manufactured.

In the three-dimensional laminated electronic device manufacturing apparatus 10, for example, a processing program for implementing the display method 12 shown in the flowchart of FIG. 5 is stored in the ROM 126 of the controller 120 and executed by the CPU 125 of the controller 120. As a result, a 3D model 258 (see FIG. 10) of the three-dimensional laminated electronic device 222 is generated based on the three-dimensional laminated electronic device 222 manufactured by the three-dimensional additive manufacturing shown in FIG. 4 above, and is displayed on the display 134 of the PC 132. The flowchart of the display method 12 will be described below.

First, the manufacturing process S10 and the imaging process S12 are repeated until the manufacturing of the three-dimensional stacked electronic device 222 is completed (S14: NO). At that time, each time the manufacturing process S10 is repeated, each process (a) to (i) of the three-dimensional stacked manufacturing is performed in sequence. Furthermore, each time the imaging process S12 is repeated, that is, each time each process (a) to (i) of the three-dimensional stacked manufacturing is completed, the stage 52 is moved below the photographing unit 218 and photographed by the camera 220. For example, when the process of forming the insulating layer (a) is completed, as shown in FIG. 6, in the photographing unit 218, the first insulating layer 228 having each through hole 230 is photographed from above by the camera 220, and an image I(a) is obtained.

Therefore, when the manufacturing of the three-dimensional laminated electronic device 222 is completed (S14: YES), a number of images I(a)-I(i) are acquired as shown in FIG. 7. Each image I(a)-I(i) shows the three-dimensional laminated electronic device 222 (hereinafter referred to as the process-completed body) from above when each of the three-dimensional additive manufacturing processes (a)-(i) is completed.

Image I(a) therefore shows the first insulating layer 228 with each through hole 230 as a process-completed body 252(a) when the process of forming the insulating layer in (a) is completed. Image I(b) shows the first insulating layer 228 and each of the first circuit wiring layers 232 formed on the first insulating layer 228 as a process-completed body 252(b) when the process of forming the circuit wiring layer in (b) is completed.

Image I(c) shows the first insulating layer 228 and each of the first circuit wiring layers 232, and each of the first vias 234 formed in the first insulating layer 228, of the process-completed body 252(c) when the via formation process in (c) is completed. Image I(d) shows the first insulating layer 228 and each of the first circuit wiring layers 232, and the second insulating layer 236 with each through hole 238, of the process-completed body 252(d) when the insulating layer formation process in (d) is completed. In image I(d), the first insulating layer 228 and each of the first circuit wiring layers 232 are shown in each through hole 238.

Image I(e) shows the first insulating layer 228 and the second insulating layer 236 of the process-completed body 252(e) when the process of forming the circuit wiring layer in (e) is completed, as well as the second circuit wiring layer 240 formed in the second insulating layer 236. In image I(e), the first insulating layer 228 is shown in each through hole 238. Image I(f) shows the second insulating layer 236 and the second circuit wiring layer 240 of the process-completed body 252(f) when the process of forming the via in (f) is completed, as well as the second via 242 formed in the second insulating layer 236.

Image I(g) shows the second insulating layer 236 and the second circuit wiring layers 240, the third insulating layers 244 formed on the second insulating layer 236, and the cavities 246 formed between the third insulating layers 244 of the process-completed body 252(g) when the process of forming the cavity layer in (g) is completed. Image I(h) shows the second insulating layer 236, the second circuit wiring layers 240, the third insulating layers 244, and the cavities 246 of the process-completed body 252(h) when the process of forming the connection bumps in (h) is completed, and the bumps 248 formed on the second circuit wiring layers 240.

Image I(i) shows the second insulating layer 236, the second circuit wiring layers 240, the third insulating layers 244, and the cavity 246 of the process-completed body 252(i) when the component mounting process in (i) is completed, as well as the electronic components 250 mounted in the cavity 246. Note that FIG. 4 above is also a perspective view showing each of the process-completed bodies 252(a)-252(i). In the following description, images I(a)-I(i) are referred to collectively without distinction and are referred to as image I, and each of the process-completed bodies 252(a)-252(i) are referred to collectively without distinction and are referred to as process-completed body 252.

In this way, in the imaging process S12 in FIG. 5, each time each of the processes (a) to (i) of the three-dimensional additive manufacturing is completed, the three-dimensional laminated electronic device 222 at the time of the completion of the process is photographed by the camera 220 as the process-completed body 252, and an image I of the process-completed body 252 is acquired. Thereafter, when the manufacture of the three-dimensional laminated electronic device 222 is completed (S14: YES), the cutting process S16 is performed.

In the cutout process S16, the image processing device 130 extracts the modeling parts for each process (a) to (i) of the three-dimensional additive manufacturing from each image I(a) to I(i). The extraction is performed based on the data related to each modeling part included in the process data 129. As shown in FIG. 8, in image I(a), an image area showing the first insulating layer 228 is extracted as the modeling part 254(a) of the insulating layer formation process (a). In image I(b), an image area showing each circuit wiring layer 232 of the first layer is extracted as the modeling part 254(b) of the circuit wiring layer formation process (b). In image I(c), an image area showing each via 234 of the first layer is extracted as the modeling part 254(c) of the via formation process (c).

In image I(d), an image area showing the second insulating layer 236 is extracted as the shaping portion 254(d) of the insulating layer formation process in (d). In image I(e), an image area showing each of the second circuit wiring layers 240 is extracted as the shaping portion 254(e) of the circuit wiring layer formation process in (e). In image I(f), an image area showing each of the second vias 242 is extracted as the shaping portion 254(f) of the via formation process in (f).

In image I(g), image regions showing the third insulating layers 244 are extracted as the shaping portion 254(g) of the cavity layer formation process (g). In image I(h), image regions showing the bumps 248 are extracted as the shaping portion 254(h) of the connection bump formation process (h). In image I(i), image regions showing the electronic components 250 are extracted as the shaping portion 254(i) of the component mounting process (i). In the following description, when the shaping portions 254(a) to 254(i) are not differentiated and are referred to collectively, they are referred to as shaping portions 254.

In this way, in the cutout process S16 in FIG. 5, the image area of the shaping portion 254 is extracted from the image I based on the data related to the shaping portion 254 contained in the process data 129. Then, the extrusion process S18 is performed.

In the extrusion process S18, the image area of the shaping portion 254 is extruded in the height direction of the three-dimensional stacked electronic device 222 in a direction corresponding to the lower side of the three-dimensional stacked electronic device 222, thereby generating a 3D model of the shaping portion 254. The extrusion is performed by the image processing device 130 based on data related to the shaping portion 254 included in the process data 129. As a result, each of the 3D models 256(a) to 256(i) is generated, as shown in FIG. 9.

3D model 256(a) is a 3D model of shaping portion 254(a) in the insulating layer formation process of (a), and is generated by extruding an image area showing first insulating layer 228 based on data relating to shaping portion 254(a) contained in process data 129. In other words, 3D model 256(a) is a 3D model of first insulating layer 228.

3D model 256(b) is a 3D model of shaping portion 254(b) in the process of forming the circuit wiring layer (b), and is generated by extruding an image area showing each of the first circuit wiring layers 232 based on data relating to shaping portion 254(b) included in process data 129. In other words, 3D model 256(b) is a 3D model of each of the first circuit wiring layers 232.

The 3D model 256(c) is a 3D model of the shaping portion 254(c) of the via formation process of (c), and is generated by extruding an image area showing each via 234 of the first layer based on data on the shaping portion 254(c) included in the process data 129. In other words, the 3D model 256(c) is a 3D model of each via 234 of the first layer. However, in this case, data on each through hole 230 formed in the first insulating layer 228 is used for the data on the shaping portion 254(c) included in the process data 129. Therefore, when the 3D model 256(c) is generated, the image area showing each via 234 of the first layer is extruded so as to gradually widen as it proceeds in a direction corresponding to the bottom of the three-dimensional stacked electronic device 222.

3D model 256(d) is a 3D model of shaping portion 254(d) in the process of forming the insulating layer (d), and is generated by extruding an image area showing second insulating layer 236 based on data relating to shaping portion 254(d) contained in process data 129. In other words, 3D model 256(d) is a 3D model of second insulating layer 236.

3D model 256(e) is a 3D model of the shaping portion 254(e) of the circuit wiring layer formation process of (e), and is generated by extruding an image area showing each circuit wiring layer 240 of the second layer based on data related to the shaping portion 254(e) included in process data 129. In other words, 3D model 256(e) is a 3D model of each circuit wiring layer 240 of the second layer.

The 3D model 256(f) is a 3D model of the shaping portion 254(f) of the via formation process of (f), and is generated by extruding an image area showing each via 242 of the second layer based on data on the shaping portion 254(f) included in the process data 129. In other words, the 3D model 256(f) is a 3D model of each via 242 of the second layer. However, in this case, data on each through hole 238 formed in the second insulating layer 236 is used for the data on the shaping portion 254(f) included in the process data 129. Therefore, when the 3D model 256(f) is generated, the image area showing each via 242 of the second layer is extruded so as to gradually widen as it proceeds in a direction corresponding to the bottom of the three-dimensional stacked electronic device 222.

The 3D model 256(g) is a 3D model of the shaping portion 254(g) of the cavity layer formation process (g), and is generated by extruding an image area showing each of the third insulating layers 244 based on data relating to the shaping portion 254(g) contained in the process data 129. In other words, the 3D model 256(g) is a 3D model of each of the third insulating layers 244.

3D model 256(h) is a 3D model of the shaping portion 254(h) of the process of forming the connection bumps (h), and is generated by extruding image regions representing each bump 248 based on data regarding shaping portion 254(h) contained in process data 129. In other words, 3D model 256(h) is a 3D model of each bump 248.

3D model 256(i) is a 3D model of shaping portion 254(i) of the component mounting process (i), and is generated by extruding an image area representing each electronic component 250 based on data relating to shaping portion 254(i) included in process data 129. In other words, 3D model 256(i) is a 3D model of each electronic component 250. In the following description, when 3D models 256(a) to 256(i) are referred to collectively without distinction, they will be referred to as 3D model 256.

In this way, in the extrusion process S18 in FIG. 5, the image area of the part to be formed 254 is extruded in a direction corresponding to the lower side of the three-dimensional stacked electronic device 222 based on the data related to the part to be formed 254 contained in the process data 129, thereby generating a 3D model 256 of the part to be formed 254. Then, the determination process S20 is performed.

In the judgment process S20, a modeling abnormality in the 3D additive manufacturing is judged. In this judgment, the image processing device 130 compares and collates the data representing the 3D model 256 of the modeling portion 254 with reference data. The reference data is prepared for each of the 3D models 256(a) to 256(i) and is stored in advance in the ROM 126 or the EEPROM 128. If the result of the comparison and collation shows that the degree of agreement between the data representing the 3D model 256 of the modeling portion 254 and the reference data is less than a certain standard, the 3D additive manufacturing is judged to be abnormal, and if the degree of agreement is equal to or greater than the certain standard, the 3D additive manufacturing is judged to be normal.

If the 3D additive manufacturing is abnormal (S20: YES), abnormality processing S22 is performed. In abnormality processing S22, the fact that the 3D additive manufacturing is abnormal is notified, for example, by displaying the abnormality on the display 134 of the PC 132. In this case, an alarm sound may be output from the PC 132. After that, the display method 12 ends, but the placement processing S24 described below may continue.

In contrast, if the three-dimensional additive manufacturing is normal (S20: NO), the placement process S24 is performed. In the placement process S24, the 3D models 256 of the parts to be manufactured 254 are combined to generate a 3D model 258 of the three-dimensional additive electronic device 222. The image processing device 130 performs this combination by placing each of the 3D models 256(a)-256(i) based on data related to the height direction of each of the parts to be manufactured 254(a)-254(i) contained in the process data 129.

In the viewer process S26, the 3D model 258 of the three-dimensional stacked electronic device 222 is displayed on the display 134 of the PC 132 in a viewer that is at least capable of rotating or displaying a cross section of the 3D model 258 of the three-dimensional stacked electronic device 222, or moving or rotating the 3D model 256 of the molded portion 254. The application software for such a viewer is stored in the ROM 126 of the controller 120, and is executed by the CPU 125 of the controller 120. Furthermore, in the display, for example, as shown in FIG. 10, the 3D model 258 of the three-dimensional stacked electronic device 222 is in a transparent state, and the top surfaces of the first insulating layer 228, the first circuit wiring layer 232, the first vias 234, the second insulating layer 236, the second circuit wiring layer 240, the second vias 242, and the bumps 248, which cannot be seen from the outside of the three-dimensional stacked electronic device 222, are displayed. Then, display method 12 ends.

In addition, in the three-dimensional stacked electronic device manufacturing apparatus 10, instead of the processing program for realizing the display method 12 shown in the flowchart of FIG. 5, a processing program for realizing the display method 12 shown in the flowchart of FIG. 11 may be stored in the ROM 126 of the controller 120 and executed by the CPU 125 of the controller 120. Below, the flowchart of the display method 12 in such a case will be described. However, in the following description, the same parts in the flowchart of FIG. 5 and the flowchart of FIG. 11 are given the same reference numerals and their description will be omitted.

In the imaging process S32, each time the imaging process S32 is repeated, that is, each time each of the processes (a) to (i) of the three-dimensional additive manufacturing is completed, the stage 52 is moved below the imaging unit 218 and photographed by the camera 220. For example, when the process of forming the insulating layer (a) is completed, as shown in FIG. 12, the first insulating layer 228 having each through hole 230 is photographed from above by the camera 220 in the imaging unit 218. However, the camera 220 has two lens mechanisms and a shutter mechanism, and photographs are taken simultaneously from two different directions. As a result, images I1(a) and I2(a) are obtained. The process-completed body 252(a) is reflected in the images I1(a) and I2(a). This is also true for each of the processes (b) to (i) of the three-dimensional additive manufacturing. The imaging unit 218 may photograph simultaneously from two different directions by two cameras.

In the three-dimensional processing S36, the image processing device 130 generates a 3D model of the process-completed body 252 for each of the processes (a) to (i) of the three-dimensional additive manufacturing. In the case of the process of forming the insulating layer (a), the generation is performed based on the image I1(a) and the image I2(a). As a result, as shown in FIG. 13, a 3D model 260(a) is generated for the process-completed body 252(a) at the completion of the process of forming the insulating layer (a). The same applies to each of the processes (b) to (i) of the three-dimensional additive manufacturing, and 3D models 260(b) to 260(i) are generated for the process-completed bodies 252(b) to 252(i) at the completion of each of the processes (b) to (i). In the following description, when the 3D models 260(a) to 260(i) are not distinguished and are collectively referred to, they are referred to as the 3D model 260.

In the difference processing S38, the image processing device 130 generates a 3D model 256 of the shaping portion 254. The generation is performed by extracting the difference between the 3D models 260 of two process-completed bodies 252 corresponding to successive processes in the three-dimensional additive manufacturing. For example, the generation of the 3D model 256(b) of the shaping portion 254(b) of the process of forming the circuit wiring layer (b) is performed by extracting the difference between the 3D model 260(a) of the process-completed body 252(a) at the time of completing the process of forming the insulating layer (a) and the 3D model 260(b) of the process-completed body 252(b) at the time of completing the process of forming the circuit wiring layer (b). This generation is also the same for the 3D models 256(b) to (i) of the shaping portions 254(c) to (i) of the processes (c) to (i).

However, for the 3D model 256(a) of the shaping portion 254(a) of the process of forming the insulating layer (a), the 3D model 260(a) of the process-completed body 252(a) at the time of completion of the process of forming the insulating layer (a) is used.

As described above in detail, in the three-dimensional laminated electronic device manufacturing apparatus 10 of this embodiment, a 3D model 258 of the three-dimensional laminated electronic device 222 is generated from an image I (including image I1(a) and image I2(a), etc.) taken by the camera 220 of the three-dimensional laminated electronic device 222 manufactured by three-dimensional additive manufacturing, and the 3D model 258 of the three-dimensional laminated electronic device 222 is displayed on the display 134, making it possible to verify the three-dimensional additive manufacturing in a three-dimensional manner.

Incidentally, in this embodiment, the three-dimensional stacked electronic device manufacturing apparatus 10 is an example of a three-dimensional object manufacturing apparatus. The controller 120 is an example of a three-dimensional CG processing unit. The process data 129 is an example of three-dimensional information. The PC 132 is an example of an alarm device. The three-dimensional stacked electronic device 222 is an example of a three-dimensional object. The 3D model 258 of the three-dimensional stacked electronic device 222 is an example of a 3D model of a three-dimensional object. The data regarding each of the shaping portions 254(a)-254(i) is an example of information regarding the shaping portions. The data regarding the height direction of each of the shaping portions 254(a)-254(i) is an example of information regarding the height direction of the shaping portions.

The controller 120 that executes the imaging process S12 is an example of an acquisition processing unit. The controller 120 that executes the cutting process S16 and the extrusion process S18 is an example of a first generation processing unit. The controller 120 that executes the determination process S20 and the abnormality process S22 is an example of an abnormality processing unit. The controller 120 that executes the placement process S24 is an example of a second generation processing unit. The controller 120 that executes the viewer process S26 is an example of a display processing unit. The controller 120 that executes the imaging process S32 is an example of an acquisition processing unit. The controller 120 that executes the three-dimensional process S36 and the difference process S38 is an example of a first generation processing unit. The controller 120 that executes the three-dimensional process S36 is an example of a third generation processing unit. The controller 120 that executes the difference process S38 is an example of a fourth generation processing unit.

The imaging process S12 is an example of an acquisition process. The cutting process S16 and the extrusion process S18 are examples of a first generation process. The placement process S24 is an example of a second generation process. The viewer process S26 is an example of a display process. The imaging process S32 is an example of an acquisition process. The three-dimensional process S36 and the difference process S38 are examples of a first generation process.

The present disclosure is not limited to the above-described embodiment, and various modifications are possible without departing from the spirit of the present disclosure.
For example, three-dimensional CAD data of the three-dimensional stacked electronic device 222 may be used instead of the process data 129. Also, a see-through 3D model 258 of the three-dimensional stacked electronic device 222 may be displayed as a model sliced at an arbitrary layer position.

The camera 220 may be provided on either the inkjet heads 76, 88 or the mounting head 112. In this case, the image capturing unit 218 is not necessary. When each camera 220 is equipped with a lens mechanism and a shutter mechanism for one camera, the image capturing from two different directions in the image capturing process S32 is performed by moving each inkjet head 76, 88 or the mounting head 112 to two image capturing positions.

The processing program for implementing the display method 12 shown in the flowchart of FIG. 5 and the processing program for implementing the display method 12 shown in the flowchart of FIG. 11 may be executed by the PC 132 or by a control device connected to the three-dimensional stacked electronic device manufacturing apparatus 10 via a communication network.

10: 3D laminated electronic device manufacturing apparatus, 12: Display method, 120: Controller, 129: Process data, 132: PC, 134: Display, 220: Camera, 222: 3D laminated electronic device, 252: Processed body, 254: (Image area of) the formed part, 256: 3D model of the formed part, 258: 3D model of the 3D laminated electronic device, 260: 3D model of the processed body, I: Image of the processed body, S12: Imaging process, S16: Cutting process, S18: Extrusion process, S20: Judgment process, S22: Abnormality process, S24: Placement process, S26: Viewer process, S32: Imaging process, S36: 3D process, S38: Difference process

Claims (5)

A three-dimensional object manufacturing apparatus that manufactures a three-dimensional laminated electronic device composed of a plurality of structures by a plurality of processes of three-dimensional additive manufacturing based on three-dimensional information, comprising:
a camera for photographing the three-dimensional stacked electronic device from above;
a three-dimensional CG (computer graphics) processing unit that generates a 3D model of the three-dimensional stacked electronic device;
a display for displaying a 3D model of the three-dimensional stacked electronic device;
The three-dimensional CG processing unit includes:
an acquisition processing unit that acquires an image of the process-completed body for each process by capturing an image of the three-dimensional laminated electronic device at the completion of the process of the three-dimensional additive manufacturing of the same type of structure with the camera as the process-completed body when the process of the three-dimensional additive manufacturing of the same type of structure is completed without capturing an image with the camera every time the modeling of one layer is completed during the three-dimensional additive manufacturing of the same type of structure ;
a first generation processing unit that generates a 3D model of the same type of structure to be three-dimensionally additively manufactured using the image each time a process of three-dimensional additive manufacturing of the same type of structure is completed;
a second generation processing unit that generates a 3D model of the three-dimensional laminated electronic device by arranging a 3D model of the structure based on information regarding a height direction of the structure included in the three-dimensional information;
a display processing unit that displays a 3D model of the three-dimensional multilayer electronic device on the display using a viewer that is capable of displaying a cross section of the 3D model of the three-dimensional multilayer electronic device or a movably displaying 3D model of the structure ;
the plurality of structures includes a plurality of types of structures, each of the plurality of types of structures including a plurality of types of structures and electronic components made of a plurality of types of materials;
The plurality of processes include a process for forming a structure made of the same type of material and a process for mounting electronic components;
the same type of structure is formed by one of the plurality of processes;
the second generation processing unit generates a 3D model of the three-dimensional laminated electronic device by arranging the 3D models of the plurality of types of structures generated for the plurality of processes . The three-dimensional object manufacturing device according to claim 1, wherein the first generation processing unit generates a 3D model of the structure by extracting an image area of the structure from the image and extruding it in the height direction of the three-dimensional stacked electronic device based on information about the structure included in the three-dimensional information. The acquisition processing unit acquires at least two of the images each time a process for three-dimensional additive manufacturing of the same type of structure is completed by photographing the process-completed object with the camera from two different directions,
The first generation processing unit is
a third generation processing unit that generates a 3D model of the processed object from the two images each time the process of the three-dimensional additive manufacturing of the same type of structure is completed;
and a fourth generation processing unit that generates a 3D model of the structure by extracting a difference between 3D models of two process-completed bodies corresponding to successive 3D additive manufacturing processes of the same type of structure in the 3D additive manufacturing process. An alarm device is provided.
4. The three-dimensional object manufacturing apparatus according to claim 1, wherein the first generation processing unit includes an abnormality processing unit that notifies the notification device of a modeling abnormality in the three-dimensional laminated electronic device in accordance with a result obtained by comparing and matching data representing a 3D model of the structure with reference data. A display method for displaying, as a 3D model, a three-dimensional laminated electronic device that is composed of a plurality of structures manufactured by a plurality of processes of three-dimensional additive manufacturing based on three-dimensional information in a three-dimensional object manufacturing device, comprising:
an acquisition step of acquiring an image for each process by photographing the three-dimensional laminated electronic device with a camera when the process of the three-dimensional additive manufacturing of the same type of structure is completed without photographing with a camera every time modeling of one layer is completed during the three-dimensional additive manufacturing of the same type of structure;
a first generation step of generating a 3D model of the same type of structure to be three-dimensionally additively manufactured using the image each time a process of three-dimensional additive manufacturing of the same type of structure is completed;
a second generation step of generating a 3D model of the three-dimensional laminated electronic device by arranging a 3D model of the structure based on information regarding a height direction of the structure included in the three-dimensional information;
a display step of displaying the 3D model of the three-dimensional laminated electronic device on a display using a viewer capable of displaying a cross section of the 3D model of the three-dimensional laminated electronic device or a movable display of the 3D model of the structure ,
the plurality of structures includes a plurality of types of structures, each of the plurality of types of structures including a plurality of types of structures and electronic components made of a plurality of types of materials;
The plurality of processes include a process for forming a structure made of the same type of material and a process for mounting electronic components;
the same type of structure is formed by one of the plurality of processes;
The second generation step generates a 3D model of the three-dimensional stacked electronic device by arranging 3D models of the plurality of types of structures generated for the plurality of processes .

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