JP7591979B2 - Three-dimensional modeling device and modeling method - Google Patents

Description

The present invention relates to a three-dimensional modeling device and modeling method that creates a three-dimensional object by layering a viscous fluid on a stage.

The following patent document describes a technique for creating a three-dimensional object on a stage:

Patent No. 6362954

The objective of this specification is to appropriately create a three-dimensional object by layering a viscous fluid on a stage.

To solve the above problems, this specification discloses a three-dimensional printing device that includes a lifting device that raises and lowers a stage, a modeling unit that ejects a viscous fluid onto the stage and raises and lowers the stage using the lifting device to layer the viscous fluid to form a three-dimensional model, an imaging device that images a mark marked on the stage, a calculation device that calculates a tilt angle of the lifting direction of the stage relative to the vertical direction and a tilt direction of the tilt angle based on image data of the mark when the stage is located at a first height due to the operation of the lifting device and image data of the mark when the stage is located at a second height different from the first height due to the operation of the lifting device, and a control device that controls the operation of the modeling unit based on the tilt angle and the tilt direction calculated by the calculation device.

In order to solve the above problems, the present specification discloses a modeling method for forming a three-dimensional object using a three-dimensional modeling device including a lifting device for raising and lowering a stage, a modeling unit for discharging a viscous fluid onto the stage and raising and lowering the stage using the lifting device to laminate the viscous fluid to form a three-dimensional object, and an imaging device for imaging a mark marked on the stage, the modeling method including a calculation step for calculating an inclination angle of the lifting direction of the stage with respect to the vertical direction and an inclination direction of the inclination angle based on imaging data of the mark when the stage is located at a first height due to the operation of the lifting device and imaging data of the mark when the stage is located at a second height different from the first height due to the operation of the lifting device, and a modeling step for controlling the operation of the modeling unit to form a three-dimensional object based on the inclination angle and the inclination direction calculated in the calculation step.

In the present disclosure, a mark is marked on the stage, and the tilt angle and tilt direction of the stage's ascending/descending direction relative to the vertical direction are calculated based on imaging data of the mark when the stage is at a first height and imaging data of the mark when the stage is at a second height. Then, a three-dimensional object is formed based on the calculated tilt angle and tilt direction. This makes it possible to appropriately form a three-dimensional object by layering a viscous fluid on the stage.

FIG. 1 is a diagram showing a circuit forming device. FIG. 2 is a block diagram showing a control device. FIG. 2 is a cross-sectional view showing a circuit board with a resin laminate formed thereon. FIG. 2 is a cross-sectional view showing a circuit board having wiring formed on a resin laminate. FIG. 13 is a diagram showing a state in which a pallet is raised and lowered when a resin laminate is formed. FIG. 13 is a diagram showing a state in which a pallet is raised and lowered when a resin laminate is formed. FIG. 13 is a diagram showing a pallet descending in a state inclined relative to the vertical direction. FIG. FIG. 2 is a diagram showing a pallet imaged by a camera. FIG. 2 is a conceptual diagram illustrating a palette captured by a camera. FIG. 1 is a conceptual diagram showing a pallet descending in a state inclined with respect to the vertical direction. FIG. FIG. 2 is a diagram showing a pallet imaged by a camera. FIG. 2 is a conceptual diagram illustrating a palette captured by a camera. FIG. 2 is a conceptual diagram illustrating a palette captured by a camera.

Figure 1 shows a circuit forming apparatus 10 of the first embodiment. The circuit forming apparatus 10 includes a conveying device 20, a first modeling unit 22, a second modeling unit 24, an imaging unit 26, and a control device (see Figure 2) 28. The conveying device 20, the first modeling unit 22, the second modeling unit 24, and the imaging unit 26 are arranged on a base 29 of the circuit forming apparatus 10. The base 29 is generally rectangular in shape, and in the following description, the longitudinal direction of the base 29 is referred to as the X-axis direction, the lateral direction of the base 29 as the Y-axis direction, and the direction perpendicular to both the X-axis direction and the Y-axis direction as the Z-axis direction. The Z-axis direction is the same as the vertical direction.

The transport device 20 includes an X-axis slide mechanism 30 and a Y-axis slide mechanism 32. The X-axis slide mechanism 30 includes an X-axis slide rail 34 and an X-axis slider 36. The X-axis slide rail 34 is disposed on the base 29 so as to extend in the X-axis direction. The X-axis slider 36 is held by the X-axis slide rail 34 so as to be slidable in the X-axis direction. The X-axis slide mechanism 30 also includes an electromagnetic motor (see FIG. 2) 38, and the X-axis slider 36 is moved to any position in the X-axis direction by the drive of the electromagnetic motor 38. The Y-axis slide mechanism 32 also includes a Y-axis slide rail 50 and a table 52. The Y-axis slide rail 50 is disposed on the base 29 so as to extend in the Y-axis direction and is movable in the X-axis direction. One end of the Y-axis slide rail 50 is connected to the X-axis slider 36. The table 52 is held on the Y-axis slide rail 50 so as to be slidable in the Y-axis direction. Furthermore, the Y-axis slide mechanism 32 has an electromagnetic motor (see FIG. 2) 56, and the table 52 moves to any position in the Y-axis direction by driving the electromagnetic motor 56. As a result, the table 52 moves to any position on the base 29 by driving the X-axis slide mechanism 30 and the Y-axis slide mechanism 32.

The table 52 has a base 60, a holding device 62, and a lifting device (see FIG. 2) 64. The base 60 is formed in a flat plate shape, and a pallet 70 (see FIG. 3) is placed on the upper surface. The holding device 62 is provided on both sides of the base 60 in the X-axis direction. The pallet 70 is fixedly held by clamping both edges in the X-axis direction of the pallet 70 placed on the base 60 between the holding device 62. The lifting device 64 is disposed below the base 60, and raises and lowers the base 60.

The first modeling unit 22 is a unit that models the wiring of the circuit board, and has a first printing section 72 and a baking section 74. The first printing section 72 has an inkjet head (see FIG. 2) 76 that ejects metal ink in a linear shape. The metal ink is a dispersion of nanometer-sized metal particles, such as silver particles, in a solvent. The surfaces of the metal particles are coated with a dispersant to prevent aggregation in the solvent. The inkjet head 76 ejects the metal ink from multiple nozzles, for example, by a piezoelectric method using piezoelectric elements.

The baking section 74 has an infrared irradiation device 78 (see FIG. 2). The infrared irradiation device 78 is a device that irradiates the ejected metal ink with infrared rays, and the metal ink irradiated with infrared rays is baked to form wiring. Note that baking of metal ink is a phenomenon in which the application of energy causes the evaporation of the solvent and the decomposition of the protective film for the metal particles, i.e., the dispersant, and the like, and the metal particles come into contact or fuse together, thereby increasing the conductivity. Then, the metal ink is baked to form metal wiring.

The second modeling unit 24 is a unit that models the resin layer of the circuit board, and has a second printing unit 84 and a curing unit 86. The second printing unit 84 has an inkjet head (see FIG. 2) 88 that ejects ultraviolet curable resin. The ultraviolet curable resin is a resin that is cured by irradiation with ultraviolet light. The inkjet head 88 may be, for example, a piezo type that uses a piezoelectric element, or a thermal type that heats the resin to generate bubbles and ejects the resin from multiple nozzles.

The curing section 86 has a flattening device (see FIG. 2) 90 and an irradiation device (see FIG. 2) 92. The flattening device 90 flattens the top surface of the UV-curable resin discharged by the inkjet head 88, for example by leveling the surface of the UV-curable resin while scraping off excess resin with a roller or blade, thereby making the thickness of the UV-curable resin uniform. The irradiation device 92 has a mercury lamp or LED as a light source, and irradiates the discharged UV-curable resin with ultraviolet light. This causes the discharged UV-curable resin to harden, forming a resin layer.

The imaging unit 26 is a unit that captures an image of the pallet 70 placed on the base 60 of the table 52, and has a camera 100. The camera 100 is disposed above the base 29 facing downward, and captures an image of the top surface of the pallet 70 placed on the base 60 of the table 52 from above.

As shown in FIG. 2, the control device 28 includes a controller 110, a plurality of drive circuits 112, an image processing device 114, and a storage device 116. The plurality of drive circuits 112 are connected to the electromagnetic motors 38, 56, the holding device 62, the lifting device 64, the inkjet head 76, the infrared irradiation device 78, the inkjet head 88, the flattening device 90, and the irradiation device 92. The controller 110 includes a CPU, a ROM, a RAM, and the like, and is mainly a computer, and is connected to the plurality of drive circuits 112. As a result, the operation of the transport device 20, the first modeling unit 22, the second modeling unit 24, and the imaging unit 26 is controlled by the controller 110. The controller 110 is also connected to the image processing device 114. The image processing device 114 processes the imaging data obtained by the camera 100, and the controller 110 acquires various information from the imaging data. The storage device 116 stores various information calculated based on the imaging data.

In the circuit forming device 10, with the above-mentioned configuration, a resin laminate is formed on the pallet 70 placed on the base 60 of the table 52, and wiring is formed on the upper surface of the resin laminate to form a circuit board.

Specifically, when the pallet 70 is set on the base 60 of the table 52, the table 52 moves to below the second modeling unit 24. Then, in the second modeling unit 24, a resin laminate 122 is formed on the pallet 70 as shown in FIG. 3. The resin laminate 122 is formed by repeatedly ejecting ultraviolet curable resin from the inkjet head 88 and irradiating the ejected ultraviolet curable resin with ultraviolet light by the irradiation device 92.

More specifically, in the second printing section 84 of the second modeling unit 24, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the top surface of the pallet 70. Next, once the ultraviolet curable resin has been ejected in a thin film, the ultraviolet curable resin is flattened by the flattening device 90 in the curing section 86 so that the film thickness of the ultraviolet curable resin is uniform. Then, the irradiation device 92 irradiates the thin film of ultraviolet curable resin with ultraviolet light. This forms a thin film resin layer 124 on the pallet 70.

Then, the inkjet head 88 ejects a thin film of ultraviolet curable resin onto the thin film resin layer 124. The thin film of ultraviolet curable resin is then flattened by the flattening device 90, and the irradiation device 92 irradiates the ejected thin film of ultraviolet curable resin with ultraviolet light, thereby laminating a thin film of resin layer 124 on top of the thin film of resin layer 124. In this manner, ejection of ultraviolet curable resin onto the thin film of resin layer 124 and irradiation with ultraviolet light are repeated, and a plurality of resin layers 124 are laminated to form a resin laminate 122.

Next, when the resin laminate 122 is formed, the table 52 moves below the first modeling unit 22. Then, in the first printing section 72 of the first modeling unit 22, the inkjet head 76 ejects the metal ink 130 in a line shape according to the circuit pattern onto the upper surface of the resin laminate 122, as shown in FIG. 4. Next, in the baking section 74 of the first modeling unit 22, the infrared irradiation device 78 irradiates the metal ink 130 ejected according to the circuit pattern with infrared rays. This bakes the metal ink 130, and wiring 132 is formed on the upper surface of the resin laminate 122.

In this way, the resin laminate 122 is formed on the pallet 70 in the second modeling unit 24, and the wiring 132 is formed on the resin laminate 122 in the first modeling unit 22, thereby forming the circuit board 136. When the resin laminate 122 is formed in the second modeling unit 24, the pallet 70 is lowered by the operation of the lifting device 64 while the multiple resin layers 124 are stacked to form the resin laminate 122.

In detail, before the resin laminate 122 is formed in the second modeling unit 24, the base 60 of the table 52 is raised by the operation of the lifting device 64, and the upper surface of the pallet ₇₀ set on the base 60 is located at a height of H ₀ as shown in FIG. 5A. The height H 0 is the height of the upper surface of the pallet 70 when the table 52 is raised to the highest position within the movable range of the lifting device 64. Then, as shown in FIG. 5B, a resin layer 124 is formed on the upper surface of the pallet 70 located at the height H ₀ in the above-mentioned procedure. That is, the ultraviolet curing resin is discharged on the upper surface of the pallet 70 located at the height H ₀ , and after the ultraviolet curing resin is flattened, the ultraviolet curing resin is irradiated with ultraviolet light to form the first resin layer 124. The amount of ultraviolet curing resin discharged and the thickness of the ultraviolet curing resin when flattened are controlled so that the thickness of the resin layer 124 becomes t.

Then, when the first resin layer 124 is formed on the upper surface of the pallet 70, the base 60 of the table 52 is lowered by the operation of the lifting device 64 by a distance corresponding to t. As a result, the upper surface of the pallet 70 set on the base 60 is located at a height of (H ₀ -t) as shown in FIG. 5C. Then, the second resin layer 124b is formed on the upper surface of the first resin layer 124a of the pallet 70 located at the height (H ₀ -t) as shown in FIG. 5D. The thickness of the second resin layer 124b is also t, like the first resin layer 124a. Then, when the third and subsequent resin layers 124 are formed, the base 60 is lowered by the operation of the lifting device 64 by a distance corresponding to t, and then the resin layer 124 having a thickness t is laminated on the resin layer 124 having a thickness t.

As described above, the height of the upper surface of the pallet 70 when the table 52 is at the highest position within the movable range of the lifting device 64 is _H0 , and the height of the upper surface of the pallet 70 when the table 52 is at the lowest position within the movable range of the lifting device 64 is _H1 . For this reason, as shown in Fig. 6, a resin laminate 122 of maximum thickness ( _H0 - _H1 ) can be formed by stacking a plurality of resin layers 124 on the upper surface of the pallet 70.

In this way, each time the pallet 70 is lowered by the lifting device 64 by a distance equivalent to t, the resin layer 124 is laminated on the upper surface of the pallet 70 to form the resin laminate 122. However, although the accuracy of the lifting device 64 for raising and lowering the pallet 70 in the Z-axis direction, i.e., the vertical direction, meets the tolerance standards, there is a slight deviation inherent to each device, and therefore the direction in which the pallet 70 is raised and lowered by the lifting device 64 may be inclined relative to the vertical direction. In other words, when the pallet 70 is lowered by the lifting device, it may be lowered diagonally downward as shown in FIG. 7, rather than vertically. In this way, when the pallet 70 is lowered diagonally downward by the lifting device 64, there is a deviation when the resin layer 124 is laminated on the upper surface of the pallet 70, and the molding accuracy of the resin laminate 122, i.e., the three-dimensional object, decreases.

In the circuit forming device 10, as shown in FIG. 8, a mark 120 is marked on the corner of the pallet 70. Then, based on the image data of the mark 120, the inclination angle of the ascending/descending direction of the pallet 70 relative to the vertical direction and the inclination direction of the inclination angle are calculated, and the calculated inclination angle and inclination direction are used to correct the misalignment of the laminated resin layer 124.

In more detail, a calculation command is prepared for calculating the tilt angle and tilt direction of the lifting and lowering direction of the pallet 70, and when the calculation command is input to the control device 28, the table 52 moves below the camera 100 of the imaging unit 26. The calculation command is input when the circuit forming device 10 is started for the first time, but the pallet 70 is set on the base 60 of the table 52 before the calculation command is input to the control device 28. Therefore, the pallet 70 in a state where no three-dimensional object such as a resin layer 124 has been formed moves below the camera 100. The table 52 moves below the camera 100 so that the mark 120 marked on the pallet 70 is within the imaging range of the camera 100.

The camera 100 captures an image of the pallet 70 when it is raised by the operation of the lifting device 64, and also captures an image of the pallet 70 when it is lowered by the operation of the lifting device 64. At this time, it is preferable to separate the image capturing position of the pallet 70 when it is raised from the image capturing position of the pallet 70 when it is lowered as far as possible in the vertical direction. For this reason, it is preferable to set the image capturing position of the pallet 70 when it is raised to the height H ₀ at which the pallet 70 is most raised by the operation of the lifting device 64, and the image capturing position of the pallet 70 when it is lowered to the height H ₁ at which the pallet 70 is most lowered by the operation of the lifting device 64. However, the depth of field of the camera 100 is not so wide and is narrower than the movable range of the lifting device that raises and lowers the pallet 70. In other words, the depth of field of the camera 100 is narrower than the lifting range of the pallet 70. Specifically, the highest position of the depth of field of the camera 100 is H ₀ , and the lowest position is H ₂ (>H ₁ ).

For this reason, as shown in Fig. 9(A), when the lifting device 64 is operated to raise the pallet 70 to _H0 , the camera 100 captures an image of the mark 120 on the pallet 70. Also, as shown in Fig. 9(B), when the lifting device 64 is operated to lower the pallet 70 to _H2 , the camera 100 captures an image of the mark 120 on the pallet 70. Then, in the controller 110, the coordinate position of the mark 120 (hereinafter referred to as "risen mark position") is calculated based on the image data of the _mark 120 when the pallet 70 is raised to _H0 . Also, the coordinate position of the mark 120 (hereinafter referred to as "descended mark position") is calculated based on the image data of the mark 120 when the pallet 70 is lowered to H2. The calculated ascending mark position A1 (X _A1 , Y _A1 ) and descending mark position A2 (X _A2 , Y _A2 ) are shown in the XY coordinate system in FIG.

From this figure, it can be seen that when the pallet 70 descends from _H0 to _H2 , the pallet 70 descends in the direction of a vector starting from the ascent mark position A1 and ending at the descent mark position A2, while shifting by a distance corresponding to the line segment of the vector. In other words, when the pallet 70 descends from _H0 to _H2 , as shown in Figure 11, the pallet 70 descends along the hypotenuse KA2 of a right triangle with the long side KA1 as the height and the short side A1A2 as the base. Therefore, the angle α between the long side KA1 and the hypotenuse KA2 is the inclination angle of the ascent/descent direction of the pallet 70 with respect to the vertical direction. Also, the direction of the vector starting from the ascent mark position A1 and ending at the descent mark position A2 is the inclination direction of the inclination angle. The length of the long side KA1 is ( _{H0 -H2} ), and the length of the short side A1A2 is calculated based on the ascending mark position A1 ( _XA1 , _YA1 ) and the descending mark position A2 ( _XA2 , _YA2 ). The inclination angle α of the pallet 70 in the ascending/descending direction is calculated according to the following formula:
tan α=length of long side KA1/length of short side A1A2 Furthermore, the inclination direction of the inclination angle α is calculated based on the ascending mark position A1 (X _A1 , Y _A1 ) and the descending mark position A2 (X _A2 , Y _A2 ).

In this way, when the inclination angle α of the lifting and lowering direction of the pallet 70 and the inclination direction of the inclination angle α are calculated, the inclination angle α and the inclination direction are stored in the storage device 116. Then, when the resin laminate 122 is formed, the misalignment of the laminated resin layers 124 is corrected using the inclination angle α and the inclination direction stored in the storage device 116. In detail, for example, before the Nth resin layer 124 is formed, the misalignment amount L of the pallet 70 is calculated based on the height H _N of the upper surface of the pallet 70 when the Nth resin layer 124 is formed. The ratio of the misalignment amount L of the pallet 70 to the lowering amount (H ₀ -H _N ) of the pallet 70 when the Nth resin layer 124 is formed is equal to the tangent of the inclination angle α as shown in FIG. 11, and therefore the misalignment amount L of the pallet 70 is calculated according to the following formula.
L=tanα×(H ₀ −H _N )

When the Nth resin layer 124 is formed, it is formed at a position shifted in the tilt direction stored in the memory device 116 by a distance equivalent to the calculated amount of shift L of the pallet 70. This allows the resin layers 124 to be appropriately stacked and the resin laminate 122 to be formed with high precision, even when the lifting and lowering direction of the pallet 70 is tilted relative to the vertical direction.

Furthermore, conventionally, an operator would manually measure the tilt angle and tilt direction of the pallet 70 in the ascending and descending direction, and manually input the measured values into the control device 28. On the other hand, with the circuit forming device 10, an operator simply inputs a calculation command, and the tilt angle and tilt direction of the pallet 70 in the ascending and descending direction are automatically calculated, and the calculated values are automatically input into the control device 28. This reduces the burden on the operator. It also makes it possible to prevent human errors, such as operator errors in measuring the tilt angle, or errors in inputting the measured values into the control device.

Moreover, not only in circuit formation device 10 but also in other circuit formation devices, the lifting and lowering direction of pallet 70 may be inclined with respect to the vertical direction, and the inclination angle of the lifting and lowering direction of pallet 70 differs from device to device. For this reason, when a three-dimensional object is formed in various circuit formation devices, a device-specific misalignment occurs. Therefore, by applying the same configuration as circuit formation device 10 to various circuit formation devices, it is possible to correct the device-specific misalignment when a three-dimensional object is formed. This makes it possible to reduce the difference in modeling quality among various circuit formation devices.

As described above, the inclination angle α of the ascending/descending direction of the pallet 70 and the inclination direction of the inclination angle α are calculated based on the ascending mark position A1 and the descending mark position A2 when the pallet 70 descends from H ₀ to H _2. The calculated inclination angle α and inclination direction are stored in the storage device 116. Therefore, when forming the N-th resin layer 124 on the pallet 70 located between H ₀ and H ₂ , it is naturally possible to apply the inclination angle α and inclination direction stored in the storage device 116 by the above-mentioned method. On the other hand, even if the pallet is not located between H ₀ and H ₂ , that is, even if the pallet descends from H ₂ and is located between H ₁ and H ₂ , it can be estimated that the pallet descends toward the inclination angle α and inclination direction stored in the storage device 116, similarly to between H ₀ and H ₂ . Therefore, even when forming the Nth resin layer 124 on a pallet 70 located other than between _H0 and _H2 , the inclination angle α and the inclination direction stored in the memory device 116 are applied in the above-described manner.

In the above description, the calculation command is input when the circuit forming device 10 is started, and the inclination angle α and the inclination direction calculated by the input of the calculation command are stored in the memory device 116. Then, the operation of the second modeling unit 24 is controlled using the inclination angle α and the inclination direction stored in the memory device 116 to form the resin laminate 122. In other words, the inclination angle α and the inclination direction are calculated only once when the circuit forming device 10 is started, and the subsequent modeling process of the resin laminate 122 is repeatedly performed using the inclination angle α and the inclination direction. This makes it possible to minimize the impact on the production takt time of the three-dimensional object in the circuit forming device 10. However, when replacing parts due to a malfunction, damage, etc., it is preferable to recalculate the inclination angle α and the inclination direction by inputting the calculation command again to the control device 28.

In the circuit forming apparatus of the first embodiment described above, the inclination angle and the inclination direction are calculated based on the image data of the mark on the pallet, but in the circuit forming apparatus of the second embodiment, not only the inclination angle and the inclination direction but also the rotation angle around the vertical direction of the pallet is calculated. More specifically, in the circuit forming apparatus of the second embodiment, as shown in FIG. 12, two marks 150 and 152 are written on the pallet 70. The two marks 150 and 152 are written on two corners facing each other across the center of the pallet 70. In addition, in the circuit forming apparatus of the first embodiment, the mark 120 is imaged when the pallet 70 is located at two different heights, H ₀ and H ₂ , but in the circuit forming apparatus of the second embodiment, the marks 150 and 152 are imaged when the pallet 70 is located at three or more different heights between H ₀ and H _2. Below, a case where the marks 150 and 152 are imaged when the pallet 70 is located at three different heights between H ₀ and H ₂ in the circuit forming apparatus of the second embodiment will be described.

Specifically, as shown in Fig. 13A, when the lifting device 64 is operated to raise the pallet 70 to _H0 , the camera 100 captures images of the marks 150 and 152 on the pallet 70. Also, as shown in Fig. 13B, when the lifting device 64 is operated to lower the pallet 70 to _H3, which is halfway between _H0 and _H2 , the camera 100 captures images of the marks 150 and 152 on the pallet 70. Furthermore, as shown in Fig. 13C, when the lifting device 64 is operated to lower the pallet 70 to _H2 , the camera 100 captures images of the marks 150 and 152 on the pallet 70. Then, the controller 110 calculates the coordinate positions of the marks 150 and 152 (hereinafter referred to as "first mark positions") based on the image data of the marks 150 and 152 when the pallet 70 is raised to _H0 . Furthermore, the coordinate positions of the marks 150, 152 (hereinafter referred to as the "second mark positions") are calculated based on the image data of the marks 150, 152 when the pallet 70 is lowered to _H3 . Furthermore, the coordinate positions of the marks 150, 152 (hereinafter referred to as the "third mark positions") are calculated based on the image data of the marks 150, 152 when the pallet 70 is lowered to _H2 . The calculated first mark positions A1, B1 and second mark positions A2, B2 are shown in the XY coordinate system of FIG. 14, and the calculated second mark positions A2, B2 and third mark positions A3, B3 are shown in the XY coordinate system of FIG.

First, from Fig. 14, it can be seen that when the pallet 70 descends from _H0 to _H3 , the mark 150 of the pallet 70 descends in the direction of a vector starting from the first mark position A1 and ending at the second mark position A2, while shifting by a distance corresponding to the line segment of the vector. Therefore, based on the same method as in the first embodiment, the inclination angle of the ascending/descending direction of the mark 150 of the pallet 70 and the inclination direction of the inclination angle are calculated. Also, it can be seen that when the pallet 70 descends from _H0 to _H3 , the mark 152 of the pallet 70 descends in the direction of a vector starting from the first mark position B1 and ending at the second mark position B2, while shifting by a distance corresponding to the line segment of the vector. Therefore, based on the same method as in the first embodiment, the inclination angle of the ascending/descending direction of the mark 152 of the pallet 70 and the inclination direction of the inclination angle are calculated. The calculated tilt angle and tilt direction of the ascending and descending directions of the marks 150, 152 are then stored in the storage device 116. Also, the angle β1 at which the line connecting the first mark position A1 and the first mark position B1 intersects with the line connecting the second mark position A2 and the second mark position B2 becomes the rotation angle of the pallet 70 about the vertical axis when the pallet 70 descends from _H0 to _H3 . Therefore, the rotation angle β1 of the pallet 70 when the pallet 70 descends from _H0 to _H3 is calculated based on the first mark positions A1, B1 and the second mark positions A2, B2. The calculated rotation angle β1 of the pallet 70 is then stored in the storage device 116.

15, when the pallet 70 descends from _H3 to _H2 , the mark 150 of the pallet 70 descends in the direction of a vector starting from the second mark position A2 and ending at the third mark position A3, shifting by a distance corresponding to the line segment of the vector. Therefore, the inclination angle of the ascending/descending direction of the mark 150 of the pallet 70 and the inclination direction of the inclination angle are calculated based on the same method as in the first embodiment. Also, when the pallet 70 descends from _H3 to _H2 , the mark 152 of the pallet 70 descends in the direction of a vector starting from the second mark position B2 and ending at the third mark position B3, shifting by a distance corresponding to the line segment of the vector. Therefore, the inclination angle of the ascending/descending direction of the mark 152 of the pallet 70 and the inclination direction of the inclination angle are calculated based on the same method as in the first embodiment. The calculated tilt angle and tilt direction of the ascending and descending directions of the marks 150 and 152 are then stored in the storage device 116. Also, the angle β2 at which the line connecting the second mark position A2 and the second mark position B2 intersects with the line connecting the third mark position A3 and the third mark position B3 is the rotation angle of the pallet 70 about the vertical axis when the pallet 70 descends from _H3 to _H2 . Therefore, the rotation angle β2 of the pallet 70 when the pallet 70 descends from _H3 to _H2 is calculated based on the second mark positions A2 and B2 and the third mark positions A3 and B3. The calculated rotation angle β2 of the pallet 70 is then stored in the storage device 116.

Then, in the circuit forming apparatus of the second embodiment, when the resin laminate 122 is formed, the misalignment of the laminated resin layer 124 is corrected using the inclination angle, inclination direction, and rotation angle stored in the storage device 116. The method of correcting the misalignment of the laminated resin layer 124 using the inclination angle and inclination direction stored in the storage device 116 in the second embodiment is the same as that in the first embodiment, so a description thereof will be omitted. However, when the misalignment of the resin layer 124 is corrected using the inclination angle and inclination direction in the second embodiment, the inclination angle and inclination direction according to the height of the pallet when the Nth resin layer is formed are used. That is, when the pallet 70 is located between H ₀ and H ₃ when the Nth resin layer 124 is formed, the misalignment amount L of the pallet 70 is calculated based on the inclination angle when the pallet 70 descends from H ₀ to H _3. Then, the Nth resin layer 124 is formed so as to correct the calculated misalignment amount L and the inclination direction when the pallet 70 descends from H ₀ to H ₃ . Furthermore, if the pallet 70 is located between _H3 and _H2 when the Nth resin layer 124 is formed, the amount of deviation L of the pallet 70 is calculated based on the angle of inclination when the pallet 70 descends from _H3 to _H2 . Then, the Nth resin layer 124 is formed so as to correct the calculated amount of deviation L and the direction of inclination when the pallet 70 descends from _H3 to _H2 .

Furthermore, when the rotation angle of the pallet 70 stored in the storage device 116 is used to correct the misalignment of the laminated resin layers 124, the Nth resin layer 124 is formed in a state rotated by the rotation angle stored in the storage device 116 around the vertical direction passing through the center of the resin layer as the axis. Note that even when the rotation angle is used to correct the misalignment of the resin layer 124, a rotation angle according to the height of the pallet when the Nth resin layer is formed is used, as in the case when the tilt angle and tilt direction are used to correct the misalignment of the resin layer 124. In other words, when the pallet 70 is located between H ₀ and H ₃ when the Nth resin layer 124 is formed, the Nth resin layer is formed in a state rotated by the rotation angle β1 when the pallet 70 descends from H ₀ to H ₃ . Furthermore, if the pallet 70 is located between _H3 and _H2 when the Nth resin layer 124 is formed, the Nth resin layer is formed in a state rotated by a rotation angle β2 when the pallet 70 descends from _H3 to _H2 . In this way, the rotation angle of the pallet 70 is used to correct misalignment of the resin layers 124 that are laminated when the resin laminate 122 is formed, and the resin laminate 122 can be formed with high accuracy.

The controller 110 of the control device 28 has a calculation unit 170 and a control unit 172, as shown in FIG. 2. The calculation unit 170 is a functional unit for calculating the tilt angle in the lifting and lowering direction of the pallet 70, the tilt direction of the tilt angle, and the rotation angle of the pallet 70. The control unit 172 is a functional unit for controlling the operation of the second modeling unit 24 based on the calculated tilt angle, tilt direction, and rotation angle, and for forming the resin laminate 122.

In the above embodiment, the circuit forming device 10 is an example of a three-dimensional modeling device. The second modeling unit 24 is an example of a modeling unit. The lifting device 64 is an example of a lifting device. The pallet 70 is an example of a stage. The camera 100 is an example of an imaging device. The marks 120, 150, and 152 are examples of marks. The circuit board 136 is an example of a three-dimensional object. The calculation unit 170 is an example of a calculation device. The control unit 172 is an example of a control device. In addition, the process executed by the calculation unit 170 is an example of a calculation process. The process executed by the control unit 172 is an example of a control process.

The present invention is not limited to the above-mentioned embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of a person skilled in the art. For example, in the above-mentioned first embodiment, the marks are captured when the pallet 70 is located at two different heights, _H0 and _H2, but as in the second embodiment, the marks may be captured when the pallet 70 is located at three or more different heights between _H0 and _H2 .

In addition, in the above embodiment, the marks are made on the pallet 70, but the marks may be made on the base 60 of the table 52. In such a case, the base 60 of the table 52 functions as a stage, and the resin laminate 122 is formed on the upper surface of the base 60 via the pallet 70. The resin laminate 122 may also be formed directly on the upper surface of the base 60.

Furthermore, in the above embodiment, the camera 100 is used with a depth of field narrower than the lifting range of the pallet 70, but a camera with a depth of field wider than the lifting range of the pallet 70 may be used. In this way, when a camera with a depth of field wider than the lifting range of the pallet 70 is used, in the first embodiment, images of the marks are captured when the pallet 70 is located at two different heights, _H0 and _H1 .

In the above embodiment, an ultraviolet curable resin is used as the resin for forming the three-dimensional object, but various curable resins such as two-liquid mixed curable resin, thermosetting resin, and thermoplastic resin can be used. In addition, the material for forming the three-dimensional object is not limited to resin, and various materials can be used as long as the material is a fluid that hardens.

In addition, in the above embodiment, a circuit board 136 is used as the three-dimensional object, but various other three-dimensional objects such as figurines can also be used.

10: Circuit forming device (3D modeling device) 24: Second modeling unit (modeling unit) 64: Lifting device 70: Pallet (stage) 100: Camera (imaging device) 120: Mark 136: Circuit board (3D model) 150: Mark 152: Mark 170: Calculation unit (calculation device) 172: Control unit (control device)

Claims (3)

A lifting device for lifting and lowering the stage;
a modeling unit that discharges a viscous fluid onto the stage and raises and lowers the stage using the lifting device to layer the viscous fluid and form a three-dimensional object; and
an imaging device for imaging the mark on the stage;
a calculation device that calculates an inclination angle of a lifting/lowering direction of the stage with respect to a vertical direction and an inclination direction of the inclination angle based on imaging data of the mark when the stage is located at a first height due to the operation of the lifting device and imaging data of the mark when the stage is located at a second height different from the first height due to the operation of the lifting device;
a control device that controls an operation of the modeling unit based on the tilt angle and the tilt direction calculated by the arithmetic device; and
A three-dimensional printing apparatus comprising: the imaging device that images the marks on the stage;
a calculation device that calculates the tilt angle, the tilt direction, and a rotation angle of the stage about a vertical axis based on imaging data of the plurality of marks when the stage is located at the first height due to the operation of the lifting device and imaging data of the plurality of marks when the stage is located at the second height due to the operation of the lifting device;
The three-dimensional printing apparatus according to claim 1 . A lifting device for lifting and lowering the stage;
a modeling unit that discharges a viscous fluid onto the stage and raises and lowers the stage using the lifting device to layer the viscous fluid and form a three-dimensional object; and
an imaging device for imaging the mark on the stage;
A method for forming a three-dimensional object using a three-dimensional printing apparatus comprising:
a calculation step of calculating an inclination angle of a lifting/lowering direction of the stage with respect to a vertical direction and an inclination direction of the inclination angle based on imaging data of the mark when the stage is located at a first height due to the operation of the lifting device and imaging data of the mark when the stage is located at a second height different from the first height due to the operation of the lifting device;
a modeling step of controlling an operation of the modeling unit to model a three-dimensional object, based on the tilt angle and the tilt direction calculated in the calculation step;
A molding method comprising:

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