JP7550633B2 - DICING APPARATUS AND METHOD FOR INSPECTING DICING APPARATUS - Google Patents

Description

The present invention relates to a dicing device and a method for inspecting a dicing device.

Dicing equipment is inspected to see whether pitching and yawing are within the tolerances in the X-axis and Y-axis directions when it is shipped from the factory, when it is relocated, and during regular inspections.

Specifically, when the holding table is moved a predetermined distance in the X-axis direction, the X-axis pitching, i.e., the runout in the Z-axis direction, which is the vertical direction of the top surface of the holding table, and the X-axis yawing, i.e., the runout in the Y-axis direction of the holding table, are inspected to see if they are within the allowable range. Furthermore, when the dicing mechanism is moved a predetermined distance in the Y-axis direction, the Y-axis pitching, i.e., the runout in the Z-axis direction of the tip of the spindle of the dicing mechanism, and the Y-yawing, i.e., the runout in the X-axis direction of the tip of the spindle, are inspected to see if they are within the allowable range.

During the above-mentioned inspection, the straight edge is fixed onto a holding table, and a dial gauge is fixed to the tip of the spindle (see, for example, Patent Document 1). The measurement point of the dial gauge is then positioned on the top or side of the straight edge, and the straight edge is moved a specified distance in the X-axis or Y-axis direction to measure the pitching and yawing mentioned above.

JP 2017-199777 A

However, in the method described in Patent Document 1 and elsewhere, it takes time to set up measuring tools such as a straight edge and a dial gauge, making the inspection time-consuming and requiring improvement.

The object of the present invention is to provide a dicing device and a method for inspecting a dicing device that can reduce the amount of work required for inspection.

In order to solve the above-mentioned problems and achieve the object, the dicing device of the present invention is a dicing device that includes a holding table mechanism having a holding table for holding a workpiece, a dicing mechanism for dicing the workpiece held by the holding table, a processing feed unit that moves the holding table mechanism in the X-axis direction relative to the dicing mechanism, an indexing feed unit that moves the holding table mechanism relatively in the Y-axis direction perpendicular to the X-axis direction relative to the dicing mechanism, and a controller that controls at least the dicing mechanism, the processing feed unit, and the indexing feed unit, and the holding table mechanism includes a Y-axis acceleration detector that detects acceleration in the Y-axis direction, and an indexing feed unit that detects acceleration in the Y-axis direction and an indexing feed unit that detects acceleration in the Y-axis direction and perpendicular to the X-axis direction and the Y-axis direction, respectively. The controller has a Z-axis acceleration detector that detects acceleration in the Z-axis direction, and the controller has a holding table mechanism yawing calculation unit that detects the amount of shake of the holding table mechanism in the Y-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction by integrating twice the acceleration in the Y-axis direction detected by the Y-axis acceleration detector while the holding table mechanism is moved a predetermined distance in the X-axis direction, and a holding table mechanism pitching calculation unit that detects the amount of shake of the holding table mechanism in the Z-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction by integrating twice the acceleration in the Z-axis direction detected by the Z-axis acceleration detector while the holding table mechanism is moved a predetermined distance in the X-axis direction.

In the dicing device, the indexing feed unit moves the dicing mechanism in the Y-axis direction relative to the holding table mechanism, and the dicing mechanism has a dicing mechanism X-axis acceleration detector at its tip that detects acceleration in the X-axis direction, and a dicing mechanism Z-axis acceleration detector that detects acceleration in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, respectively. The controller may also have a dicing mechanism yawing calculation unit that detects the amount of deflection of the dicing mechanism in the X-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction by integrating twice the acceleration in the X-axis direction detected by the dicing mechanism X-axis acceleration detector while the dicing mechanism is moved a predetermined distance in the Y-axis direction, and a dicing mechanism pitching calculation unit that detects the amount of deflection of the dicing mechanism in the Z-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction by integrating twice the acceleration in the Z-axis direction detected by the dicing mechanism Z-axis acceleration detector while the dicing mechanism is moved a predetermined distance in the Y-axis direction.

The inspection method for a dicing device of the present invention is a method for inspecting a dicing device, which includes a holding table for holding a workpiece, a Y-axis acceleration detector for detecting acceleration in a Y-axis direction parallel to the horizontal direction, and a Z-axis acceleration detector for detecting acceleration in a Z-axis direction perpendicular to the Y-axis direction and parallel to the vertical direction, and is characterized by having a holding table mechanism yawing calculation step for detecting the amount of deflection of the holding table mechanism in the Y-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction parallel to the horizontal direction and perpendicular to the Y-axis direction by a processing feed unit, by integrating twice the acceleration in the Y-axis direction detected by the Y-axis acceleration detector while the holding table mechanism is moved a predetermined distance in the X-axis direction, and a holding table mechanism pitching calculation step for detecting the amount of deflection of the holding table mechanism in the Z-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction, by integrating twice the acceleration in the Z-axis direction detected by the Z-axis acceleration detector while the holding table mechanism is moved a predetermined distance in the X-axis direction.

The inspection method for the dicing device may include a processing tool for dicing the workpiece held by the holding table, a dicing mechanism X-axis acceleration detector at the tip for detecting acceleration in the X-axis direction, and a dicing mechanism Z-axis acceleration detector for detecting acceleration in the Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, and may include a dicing mechanism yawing calculation step for detecting the amount of deflection of the dicing mechanism in the X-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction by the indexing feed unit, by twice integrating the acceleration in the X-axis direction detected by the dicing mechanism X-axis acceleration detector while the dicing mechanism is moved a predetermined distance in the Y-axis direction, and a dicing mechanism pitching calculation step for detecting the amount of deflection of the dicing mechanism in the Z-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction, by twice integrating the acceleration in the Z-axis direction detected by the dicing mechanism Z-axis acceleration detector while the dicing mechanism is moved a predetermined distance in the Y-axis direction.

The present invention has the effect of reducing the amount of work required for testing.

FIG. 1 is a perspective view showing a schematic configuration example of a dicing device according to the first embodiment. FIG. 2 is a perspective view showing a state in which the holding table mechanism of the dicing apparatus shown in FIG. 1 is moved a predetermined distance. FIG. 3 is a perspective view showing a state in which the dicing mechanism of the dicing apparatus shown in FIG. 1 is moved a predetermined distance. FIG. 4 is a diagram showing the detection result of the acceleration detector when the holding table mechanism or the dicing mechanism of the dicing apparatus shown in FIG. 1 is moved a predetermined distance. FIG. 5 is a diagram showing the result of integrating the detection result of the acceleration detector shown in FIG. 4 with respect to time. FIG. 6 is a diagram showing the result of integrating the detection result of the acceleration detector shown in FIG. 4 twice with respect to time. FIG. 7 is a flowchart showing the flow of the inspection method for the dicing device according to the first embodiment. FIG. 8 is a perspective view showing a schematic configuration example of a dicing device according to a modified example of the first embodiment. FIG. 9 is a perspective view showing a schematic configuration example of a dicing device according to the second embodiment. FIG. 10 is a flowchart showing the flow of the inspection method for the dicing device according to the second embodiment.

The following describes in detail the form (embodiment) for carrying out the present invention with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. The components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Various omissions, substitutions, or modifications of the configuration can be made without departing from the spirit of the present invention.

[Embodiment 1]
A dicing apparatus according to a first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an example of a schematic configuration of the dicing apparatus according to the first embodiment. FIG. 2 is a perspective view showing a state in which the holding table mechanism of the dicing apparatus shown in FIG. 1 is moved a predetermined distance. FIG. 3 is a perspective view showing a state in which the dicing mechanism of the dicing apparatus shown in FIG. 1 is moved a predetermined distance. FIG. 4 is a diagram showing a detection result of an acceleration detector when the holding table mechanism or the dicing mechanism of the dicing apparatus shown in FIG. 1 is moved a predetermined distance. FIG. 5 is a diagram showing a result of integrating the detection result of the acceleration detector shown in FIG. 4 with respect to time. FIG. 6 is a diagram showing a result of integrating the detection result of the acceleration detector shown in FIG. 4 twice with respect to time.

The dicing device 1 shown in FIG. 1 according to the first embodiment is a dicing device that cuts (corresponding to dicing) a workpiece 200. The workpiece 200 to be processed by the dicing device 1 shown in FIG. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose substrate is silicon, gallium arsenide, SiC (silicon carbide), sapphire, or the like. The workpiece 200 has a plurality of planned division lines 202 formed in a lattice pattern on its surface 201, and a device 203 is formed in each area partitioned by the plurality of planned division lines 202. The device 203 is an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), a charge coupled device (CCD), or an image sensor such as a CMOS (Complementary Metal Oxide Semiconductor).

In the present invention, the workpiece 200 may be a so-called TAIKO (registered trademark) wafer with a thin central portion and a thick peripheral portion, or may be a package substrate with device chips sealed with resin, a ceramic plate, or a glass substrate. In embodiment 1, the workpiece 200 has the back surface 204 on the back side of the front surface 201 attached to a tape 206 with an annular frame 205 attached to the outer periphery, and is attached to the opening 208 of the annular frame 205 via the tape 206. The workpiece 200 according to embodiment 1 is divided into individual chips 207 along the planned division lines 202. The chips 207 include a portion of the substrate and the devices 203 formed on the substrate.

The dicing device 1 shown in FIG. 1 according to the first embodiment is a cutting device that holds the workpiece 200 on a holding table 11 and cuts the workpiece 200 along a planned division line 202 with a cutting blade 21, which is a processing tool, to divide the workpiece 200 into individual chips 207. The dicing device 1 includes a holding table mechanism 10 that holds the workpiece 200, a dicing mechanism 20, an imaging unit (not shown), and a controller 100. As shown in FIG. 1, the dicing device 1 is a cutting device that includes two dicing mechanisms 20, i.e., a two-spindle dicer, a so-called facing dual type.

As shown in FIG. 1, the dicing device 1 also includes a moving unit 30 that moves the holding table mechanism 10 and the dicing mechanism 20 relatively. The moving unit 30 includes an X-axis moving unit 31, which is a processing feed unit that processes and feeds the holding table mechanism 10 in the X-axis direction parallel to the horizontal direction, a Y-axis moving unit 32, which is an indexing feed unit that moves the dicing mechanism 20 in the Y-axis direction, which is an indexing feed direction parallel to the horizontal direction and perpendicular to the X-axis direction, a Z-axis moving unit 33 that moves the dicing mechanism 20 in the Z-axis direction, which is a cutting feed direction parallel to the vertical direction and perpendicular to the X-axis direction and the Y-axis direction, and a rotational moving unit 34 that rotates the holding table 11 around an axis parallel to the Z-axis direction. That is, the moving unit 30 moves the holding table mechanism 10 and the dicing mechanism 20 relatively in the X-axis direction, the Y-axis direction, and the Z-axis direction.

The X-axis movement unit 31 moves the holding table mechanism 10 together with the rotation movement unit 34 in the X-axis direction, which is the processing feed direction, thereby moving the holding table mechanism 10 in the X-axis direction relative to the dicing mechanism 20. The X-axis movement unit 31 moves the holding table mechanism 10 along the X-axis direction between a processing area where the dicing mechanism 20 cuts the workpiece 200 held by the holding table mechanism 10, and a load/unload area where the workpiece 200 is loaded and unloaded from the holding table mechanism 10.

The Y-axis movement unit 32 moves the dicing mechanism 20 in the Y-axis direction, which is the indexing feed direction, relative to the holding table mechanism 10, thereby moving the holding table mechanism 10 in the Y-axis direction relative to the dicing mechanism 20. The Z-axis movement unit 33 moves the dicing mechanism 20 in the Z-axis direction, which is the cutting feed direction, relative to the holding table mechanism 10. The rotation movement unit 34 is installed on a moving frame 35 that is moved in the X-axis direction by the X-axis movement unit 31, and rotates the table base 12 of the holding table mechanism 10 around an axis parallel to the Z-axis direction.

The X-axis moving unit 31, the Y-axis moving unit 32 and the Z-axis moving unit 33 are equipped with well-known ball screws 311, 321, 331 that are rotatable around their axes, well-known motors 312, 322, 332 that rotate the ball screws 311, 321, 331 around their axes, and well-known guide rails 313, 323, 333 that support the holding table mechanism 10 or the dicing mechanism 20 so that they can move freely in the X-axis, Y-axis or Z-axis directions.

The holding table mechanism 10 has a holding table 11 that holds the workpiece 200 by suction on a holding surface 111, a table base 12 on which the holding table mechanism 10 is installed, a Y-axis acceleration detector 13, and a Z-axis acceleration detector 14. The Y-axis acceleration detector 13 and the Z-axis acceleration detector 14 are left attached to the table base 12 not only when the inspection method for the dicing device according to the first embodiment is performed, but also when cutting the workpiece 200.

The holding table 11 is disk-shaped, and the holding surface 111 that holds the workpiece 200 is formed from porous ceramics or the like. The holding table 11 of the holding table mechanism 10 is fixed to the upper surface of the table base 12, and is provided so as to be movable in the X-axis direction between the loading/unloading area and the processing area by the X-axis moving unit 31, and is provided so as to be rotatable about an axis parallel to the Z-axis direction by the rotation moving unit 34. The holding surface 111 of the holding table 11 is connected to a vacuum suction source (not shown), and is sucked by the vacuum suction source to suck and hold the workpiece 200 placed on the holding surface 111. In the first embodiment, the holding table 11 sucks and holds the workpiece 200 via the tape 206.

The table base 12 has the holding table 11 fixed to its upper surface. The table base 12 is provided so as to be movable in the X-axis direction together with the rotational movement unit 34 by the X-axis movement unit 31, and is provided so as to be rotatable around an axis parallel to the Z-axis direction by the rotational movement unit 34.

The Y-axis acceleration detector 13 detects the acceleration of the holding table mechanism 10 in the Y-axis direction. The Z-axis acceleration detector 14 detects the acceleration of the holding table mechanism 10 in the Z-axis direction. These acceleration detectors 13, 14 are fixed to the table base 12. It is desirable to place the Y-axis acceleration detector 13 as far away as possible from the axis of the holding surface 111 of the holding table 11. This is because the acceleration of the holding table mechanism 10 in the Y-axis direction detected by the Y-axis acceleration detector 13 increases as the detector moves away from the axis of the holding surface 111 of the holding table 11.

It is desirable to place the Z-axis acceleration detector 14 as close as possible to the holding surface 111 of the holding table 11. This is because the acceleration in the Z-axis direction of the holding table mechanism 10 detected by the Z-axis acceleration detector 14 increases if the detector is closer to the holding surface 111 of the holding table 11. The acceleration detectors 13 and 14 are composed of well-known accelerometers. The acceleration detectors 13 and 14 output the detection results to the controller 100 at predetermined time intervals.

The holding table mechanism 10 also includes multiple clamping portions 15 around the holding table 11 that clamp the annular frame 205, as shown in FIG. 1.

The dicing mechanism 20 is a cutting unit that cuts the workpiece 200 held by the holding table 11. The dicing mechanism 20 is provided so as to be movable in the Y-axis direction relative to the holding table mechanism 10 by the Y-axis movement unit 32, and is provided so as to be movable in the Z-axis direction relative to the holding table mechanism 10 by the Z-axis movement unit 33.

As shown in FIG. 1, the dicing mechanism 20 is mounted on a gate-shaped support frame 3 that stands upright from the device body 2 via a Y-axis movement unit 32 and a Z-axis movement unit 33. The dicing mechanism 20 is capable of positioning the cutting blade 21 at any position on the holding surface 111 of the holding table 11 by the Y-axis movement unit 32 and the Z-axis movement unit 33.

As shown in FIG. 1, the dicing mechanism 20 has a cutting blade 21 that cuts the workpiece 200 held by the holding table 11, a spindle housing 22 that is movable in the Y-axis and Z-axis directions by a Y-axis moving unit 32 and a Z-axis moving unit 33, a spindle 23 that is rotatably mounted on the spindle housing 22 around its axis and rotated by a motor (not shown) and has the cutting blade 21 attached to its tip, and a cutting fluid supply nozzle 24 that supplies cutting fluid to the workpiece 200. The cutting blade 21 is an extremely thin, annular cutting wheel that has a roughly ring shape. The axes of the cutting blade 21 and spindle 23 of the dicing mechanism 20 are parallel to the Y-axis direction.

As shown in FIG. 1, the dicing mechanism 20 has a dicing mechanism X-axis acceleration detector 25 and a dicing mechanism Z-axis acceleration detector 26. The dicing mechanism X-axis acceleration detector 25 and the dicing mechanism Z-axis acceleration detector 26 are left attached to the dicing mechanism 20 not only when the inspection method for the dicing device according to the first embodiment is performed, but also when cutting the workpiece 200.

The dicing mechanism X-axis acceleration detector 25 detects the acceleration in the X-axis direction of the close tip of the cutting blade 21 of the dicing mechanism 20. The dicing mechanism Z-axis acceleration detector 26 detects the acceleration in the Z-axis direction of the close tip of the cutting blade 21 of the dicing mechanism 20.

These acceleration detectors 25, 26 are fixed to the tip of the spindle housing 22 of one of the dicing mechanisms 20, closer to the cutting blade 21. The acceleration detectors 25, 26 are composed of well-known accelerometers. The acceleration detectors 25, 26 output the detection results to the controller 100 at predetermined time intervals.

The imaging unit is fixed to one of the dicing mechanisms 20 so as to move integrally with the dicing mechanism 20. The imaging unit has an imaging element that captures an image of the area to be divided of the workpiece 200 held on the holding table 11 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS) imaging element. The imaging unit captures the workpiece 200 held on the holding table 11 to obtain an image for performing alignment to align the workpiece 200 with the cutting blade 21, and outputs the obtained image to the controller 100.

The dicing device 1 also includes an X-axis position detection unit (not shown) for detecting the position of the holding table 11 in the X-axis direction, a Y-axis position detection unit (not shown) for detecting the position of the dicing mechanism 20 in the Y-axis direction, and a Z-axis position detection unit for detecting the position of the dicing mechanism 20 in the Z-axis direction. The X-axis position detection unit and the Y-axis position detection unit can be configured with a linear scale parallel to the X-axis direction or the Y-axis direction, and a reading head. The Z-axis position detection unit detects the position of the dicing mechanism 20 in the Z-axis direction with the pulse of the motor 332. The X-axis position detection unit, the Y-axis position detection unit, and the Z-axis position detection unit output the position of the holding table 11 in the X-axis direction, and the position of the dicing mechanism 20 in the Y-axis direction or the Z-axis direction to the controller 100. In addition, in the first embodiment, the positions of the holding table 11 and the dicing mechanism 20 in the X-axis direction, the Y-axis direction, and the Z-axis direction of the dicing device 1 are determined based on a predetermined origin position (not shown).

The controller 100 controls each of the above-mentioned units of the dicing device 1, causing the dicing device 1 to perform processing operations on the workpiece 200. That is, the controller 100 controls at least the dicing mechanism 20, the X-axis movement unit 31, and the Y-axis movement unit 32.

The controller 100 is a computer having an arithmetic processing device with a microprocessor such as a CPU (central processing unit), a storage device with a memory such as a ROM (read only memory) or a RAM (random access memory), and an input/output interface device. The arithmetic processing device of the controller 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the dicing device 1 to the above-mentioned components of the dicing device 1 via the input/output interface device.

The controller 100 is also connected to a display unit, such as a liquid crystal display device that displays the status of the processing operation and images, and an input unit that the operator uses to register processing content information, etc. The input unit is composed of at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

In the above-mentioned dicing device 1, when the X-axis moving unit 31 moves the holding table mechanism 10 in the X-axis direction, the holding table mechanism 10 moves slightly in the Z-axis and Y-axis directions from the normal position determined by design due to dimensional errors in the ball screw 311 and guide rail 313 of the X-axis moving unit 31 and external vibrations acting on the dicing device 1. Since the ball screw 311 rotates around its axis to move the holding table mechanism 10 in the X-axis direction, the holding table mechanism 10 often moves along a sine wave in which the position in the Y-axis or Z-axis direction changes periodically as it moves in the X-axis direction.

Hereinafter, the amount of movement in the Y-axis direction of the holding table mechanism 10 while it is moving in the X-axis direction will be referred to as the amount of runout 301 in the Y-axis direction of the holding table mechanism 10 (shown in FIG. 2). Also, the amount of movement in the Z-axis direction of the holding table mechanism 10 while it is moving in the X-axis direction will be referred to as the amount of runout 302 in the Z-axis direction of the holding table mechanism 10 (shown in FIG. 2).

In addition, in the above-mentioned dicing device 1, when the Y-axis moving unit 32 moves the dicing mechanism 20 in the Y-axis direction, the dicing mechanism 20 moves slightly in the X-axis and Z-axis directions from the normal position determined by design during movement in the Y-axis direction due to dimensional errors in the ball screw 321 and guide rail 323 of the Y-axis moving unit 32 and external vibrations acting on the dicing device 1. Since the ball screw 321 rotates around its axis to move the dicing mechanism 20 in the Y-axis direction, the dicing mechanism 20 often moves along a sine wave in which the position in the X-axis or Z-axis direction changes periodically as it moves in the Y-axis direction.

Hereinafter, the amount of movement in the X-axis direction of the dicing mechanism 20 while it is moving in the Y-axis direction will be referred to as the deflection amount 303 in the X-axis direction of the dicing mechanism 20 (shown in FIG. 3). Also, the amount of movement in the Z-axis direction of the dicing mechanism 20 while it is moving in the Y-axis direction will be referred to as the deflection amount 304 in the Z-axis direction of the dicing mechanism 20 (shown in FIG. 3).

As shown in FIG. 1, the controller 100 also has a holding table mechanism yawing calculation unit 101, a holding table mechanism pitching calculation unit 102, a dicing mechanism yawing calculation unit 103, and a dicing mechanism pitching calculation unit 104.

The holding table mechanism yawing calculation unit 101 detects the velocity 601 (shown in FIG. 5) of the holding table mechanism 10 in the Y-axis direction by integrating over time the acceleration 501 (shown in FIG. 4) in the Y-axis direction detected by the Y-axis acceleration detector 13 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance 401 (shown in FIG. 2) in the X-axis direction by the X-axis moving unit 31. The holding table mechanism yawing calculation unit 101 detects the velocity 601 of the holding table mechanism 10 in the Y-axis direction by integrating over time the velocity 601 of the holding table mechanism 10 in the Y-axis direction to detect the amount of runout 301 (shown in FIG. 6) of the holding table mechanism 10 in the Y-axis direction. In this way, the holding table mechanism yawing calculation unit 101 detects the amount of shake 301 in the Y-axis direction of the holding table mechanism 10 while it is moved a predetermined distance 401 in the X-axis direction by the X-axis moving unit 31, by integrating twice in time the acceleration 501 in the Y-axis direction detected by the Y-axis acceleration detector 13 at predetermined time intervals.

The holding table mechanism pitching calculation unit 102 detects the Z-axis direction velocity 602 (shown in FIG. 5) of the holding table mechanism 10 by integrating the Z-axis direction acceleration 502 (shown in FIG. 4) detected by the Z-axis acceleration detector 14 at each predetermined time interval while the holding table mechanism 10 is moved by the X-axis movement unit 31 a predetermined distance 401 in the X-axis direction over time. The holding table mechanism pitching calculation unit 102 detects the Z-axis direction shake amount 302 (shown in FIG. 6) of the holding table mechanism 10 by integrating the Z-axis direction acceleration 502 detected by the Z-axis acceleration detector 14 at each predetermined time interval while the holding table mechanism 10 is moved by the X-axis movement unit 31 a predetermined distance 401 twice over time, thereby detecting the Z-axis direction shake amount 302 of the holding table mechanism 10 while the holding table mechanism 10 is moved by the X-axis movement unit 31 a predetermined distance 401.

The dicing mechanism yawing calculation unit 103 detects the velocity 603 (shown in FIG. 5) of the dicing mechanism 20 in the X-axis direction by integrating over time the acceleration 503 (shown in FIG. 4) in the X-axis direction detected by the dicing mechanism X-axis acceleration detector 25 at predetermined time intervals while the dicing mechanism 20 is moved a predetermined distance 402 (shown in FIG. 3) in the Y-axis direction by the Y-axis moving unit 32. The dicing mechanism yawing calculation unit 103 detects the deflection amount 303 (shown in FIG. 6) of the dicing mechanism 20 in the X-axis direction by integrating the velocity 603 of the dicing mechanism 20 in the X-axis direction over time. In this way, the dicing mechanism yawing calculation unit 103 detects the amount of deflection 303 in the X-axis direction of the dicing mechanism 20 while it is moved a predetermined distance 402 in the Y-axis direction by the Y-axis movement unit 32, by integrating twice over time the acceleration 503 in the X-axis direction detected by the dicing mechanism X-axis acceleration detector 25 at each predetermined time interval.

The dicing mechanism pitching calculation unit 104 detects the Z-axis direction speed 604 (shown in FIG. 5) of the dicing mechanism 20 by integrating over time the Z-axis direction acceleration 504 (shown in FIG. 4) detected by the dicing mechanism Z-axis acceleration detector 26 at predetermined time intervals while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction by the Y-axis movement unit 32. The dicing mechanism pitching calculation unit 104 detects the Z-axis direction speed 604 of the dicing mechanism 20 by integrating over time the Z-axis direction speed 604 of the dicing mechanism 20 to detect the Z-axis direction runout amount 304 (shown in FIG. 6). In this way, the dicing mechanism pitching calculation unit 104 detects the amount of runout 304 in the Z-axis direction of the dicing mechanism 20 while it is moved a predetermined distance 402 in the Y-axis direction by the Y-axis movement unit 32, by integrating twice over time the acceleration 504 in the Z-axis direction detected by the dicing mechanism Z-axis acceleration detector 26 at predetermined time intervals.

The horizontal axis in Figures 4, 5, and 6 indicates the elapsed time from the start of the movement of the holding table mechanism 10 or the dicing mechanism 20 a predetermined distance 401, 402 in the X-axis or Y-axis direction. The vertical axis in Figure 4 indicates the accelerations 501, 502, 503, and 504 detected by the acceleration detectors 13, 14, 25, and 26. The vertical axis in Figure 5 indicates the velocities 601, 602, 603, and 604 obtained by integrating the accelerations 501, 502, 503, and 504 shown in Figure 4 over time. The vertical axis in Figure 6 indicates the deflection amounts 301, 302, 303, and 304 obtained by integrating the accelerations 501, 502, 503, and 504 shown in Figure 4 twice over time.

Furthermore, the functions of the holding table mechanism yawing calculation unit 101, the holding table mechanism pitching calculation unit 102, the dicing mechanism yawing calculation unit 103, and the dicing mechanism pitching calculation unit 104 are each realized by the calculation processing device performing calculation processing in accordance with a computer program stored in the storage device.

Next, a method for inspecting a dicing device according to the first embodiment will be described. FIG. 7 is a flowchart showing the flow of the method for inspecting a dicing device according to the first embodiment. The method for inspecting a dicing device according to the first embodiment is a method for inspecting a dicing device 1 having the above-described configuration, and is carried out, for example, when the dicing device 1 is shipped from a factory where the dicing device 1 is manufactured, when the dicing device 1 is relocated, and during regular inspections.

The inspection method for the dicing device according to the first embodiment is started by the dicing device 1 when the controller 100 receives and registers the inspection content information registered by the operator and receives an instruction to start the inspection from the operator. The inspection content information includes a predetermined distance 401 for moving the holding table mechanism 10 in the X-axis direction and a predetermined distance 402 for moving the dicing mechanism 20 in the Y-axis direction.

As shown in FIG. 7, the inspection method for the dicing device includes a holding table mechanism inspection step 1001 and a dicing mechanism inspection step 1011.

The holding table mechanism inspection step 1001 is a step in which the holding table mechanism 10 is moved in the X-axis direction by a predetermined distance 401 shown in FIG. 2 by the X-axis movement unit 31 to detect the aforementioned runout amounts 301, 302. As shown in FIG. 7, the holding table mechanism inspection step 1001 includes a holding table mechanism yawing calculation step 1002 and a holding table mechanism pitching calculation step 1003.

The holding table mechanism yawing calculation step 1002 is a step for detecting the amount of vibration 301 in the Y-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction by integrating twice the acceleration 501 in the Y-axis direction detected by the Y-axis acceleration detector 13 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction.

The holding table mechanism pitching calculation step 1003 is a step for detecting the amount of vibration 302 in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction by integrating twice the acceleration 502 in the Z-axis direction detected by the Z-axis acceleration detector 14 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction.

In the holding table mechanism yawing calculation step 1002 and the holding table mechanism pitching calculation step 1003, the controller 100 controls the X-axis movement unit 31 to move the holding table mechanism 10 a predetermined distance 401 in the X-axis direction.

In the holding table mechanism yawing calculation step 1002, the holding table mechanism yawing calculation unit 101 integrates twice in time the acceleration 501 in the Y-axis direction detected by the Y-axis acceleration detector 13 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction, to detect the amount of shake 301 in the Y-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction. In the holding table mechanism yawing calculation step 1002, the holding table mechanism yawing calculation unit 101 stores the detected amount of shake 301 in the Y-axis direction of the holding table mechanism 10 in a storage device.

In the holding table mechanism pitching calculation step 1003, the holding table mechanism pitching calculation unit 102 integrates twice in time the acceleration 502 in the Z-axis direction detected by the Z-axis acceleration detector 14 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction, to detect the amount of vibration 302 in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction. In the holding table mechanism pitching calculation step 1003, the holding table mechanism pitching calculation unit 102 stores the detected amount of vibration 302 in the Z-axis direction of the holding table mechanism 10 in a storage device.

The dicing mechanism inspection step 1011 is a step in which the dicing mechanism 20 is moved in the Y-axis direction by a predetermined distance 402 shown in FIG. 3 by the Y-axis movement unit 32 to detect the runout amounts 303 and 304 described above. As shown in FIG. 7, the dicing mechanism inspection step 1011 includes a dicing mechanism yawing calculation step 1012 and a dicing mechanism pitching calculation step 1013.

The dicing mechanism yawing calculation step 1012 is a step for detecting the amount of deflection 303 in the X-axis direction of the dicing mechanism 20 while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction by integrating twice the acceleration 503 in the X-axis direction detected by the dicing mechanism X-axis acceleration detector 25 while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction.

The dicing mechanism pitching calculation step 1013 is a step for detecting the amount of runout 304 in the Z-axis direction of the dicing mechanism 20 while the dicing mechanism 20 is moved a predetermined distance 4002 in the Y-axis direction by integrating twice the acceleration 504 in the Z-axis direction detected by the dicing mechanism Z-axis acceleration detector 26 while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction.

In the dicing mechanism yawing calculation step 1012 and the dicing mechanism pitch calculation step 1013, the controller 100 controls the Y-axis movement unit 32 to move the dicing mechanism 20 a predetermined distance 402 in the Y-axis direction.

In the dicing mechanism yawing calculation step 1012, the dicing mechanism yawing calculation unit 103 integrates twice in time the acceleration 503 in the X-axis direction detected by the dicing mechanism X-axis acceleration detector 25 at each predetermined time interval while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction, to detect the amount of runout 303 in the X-axis direction of the dicing mechanism 20 while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction. In the dicing mechanism yawing calculation step 1012, the dicing mechanism yawing calculation unit 103 stores the detected amount of runout 303 in the X-axis direction of the dicing mechanism 20 in the storage device.

In dicing mechanism pitching calculation step 1013, dicing mechanism pitching calculation unit 104 integrates twice in time the acceleration 504 in the Z-axis direction detected by dicing mechanism Z-axis acceleration detector 26 at predetermined time intervals while dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction, to detect the amount of runout 304 in the Z-axis direction of dicing mechanism 20 while dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction. In dicing mechanism pitching calculation step 1013, dicing mechanism pitching calculation unit 104 stores the detected amount of runout 304 in the Z-axis direction of dicing mechanism 20 in a storage device.

The controller 100 of the dicing device 1 performs the holding table mechanism inspection step 1001 and the dicing mechanism inspection step 1011, and then ends the inspection method for the dicing device. The operator or the like determines whether the runout amounts 301, 302, 303, and 304 detected are within the tolerances (i.e., whether they are equal to or less than a predetermined tolerance) to determine whether the dicing device 1 is good or bad. When making the determination, if the operator determines that all of the runout amounts 301, 302, 303, and 304 are equal to or less than the tolerances, for example, the dicing device 1 is determined to be good, and if at least one of the runout amounts 301, 302, 303, and 304 exceeds the tolerance, the dicing device 1 is determined to be defective.

As described above, in the dicing device 1 according to the first embodiment, the holding table mechanism 10 has the Y-axis acceleration detector 13 and the Z-axis acceleration detector 14. The controller 100 integrates the accelerations 501 and 502 detected by the acceleration detectors 13 and 14 twice over time to detect the deflection amount 301 in the Y-axis direction and the deflection amount 302 in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance 401 in the X-axis direction. For this reason, the dicing device 1 does not need to attach a measuring tool to the holding table mechanism 10 or the dicing mechanism 20 in order to detect the deflection amounts 301 and 302 of the holding table mechanism 10. As a result, the dicing device 1 has the effect of reducing the effort required for inspection.

In addition, in the dicing device 1, the dicing mechanism 20 has a dicing mechanism X-axis acceleration detector 25 and a dicing mechanism Z-axis acceleration detector 26. The controller 100 integrates the accelerations 503, 504 detected by the acceleration detectors 25, 26 twice over time to detect the deflection amount 303 in the X-axis direction and the deflection amount 304 in the Z-axis direction of the dicing mechanism 20 while the dicing mechanism 20 is moved a predetermined distance 402 in the Y-axis direction. As a result, the dicing device 1 has the effect of eliminating the need for measuring instruments to detect the deflection amounts 303, 304 of the dicing mechanism 20.

In addition, since the dicing device inspection method according to the first embodiment is performed by the dicing device 1 having the above-described configuration, no measuring tools are required during inspection, which has the effect of reducing the amount of work required for inspection.

[Modifications]
A dicing device according to a modified example of the first embodiment of the present invention will be described with reference to the drawings. Fig. 8 is a perspective view showing a schematic configuration example of a dicing device according to a modified example of the first embodiment. In Fig. 1, the same parts as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 8, the dicing device 1-1 according to the modified example is the same as that of the first embodiment, except that it further includes a dicing mechanism Y-axis acceleration detector 27 fixed to the tip of the spindle housing 22 of one of the dicing mechanisms 20, closer to the cutting blade 21, and the controller 100 further includes a Z-axis position accuracy calculation unit 105 and a Y-axis position accuracy calculation unit 106.

The dicing mechanism Y-axis acceleration detector 27 detects the acceleration in the Z-axis direction of the tip of the cutting blade 21 of the dicing mechanism 20. The dicing mechanism Y-axis acceleration detector 27 outputs the detection result to the controller 100 at predetermined time intervals.

The Z-axis position accuracy calculation unit 105 uses the Z-axis movement unit 33 to position the dicing mechanism 20 at a predetermined position in the Z-axis direction a predetermined number of times, and integrates twice the acceleration detected by the dicing mechanism Z-axis acceleration detector 26 when the dicing mechanism 20 is positioned at a predetermined position in the Z-axis direction a predetermined number of times to detect multiple positions of the dicing mechanism 20 in the Z-axis direction, calculates the variation in the multiple detected positions of the dicing mechanism 20 in the Z-axis direction, and stores the calculated positions in a storage device.

The Y-axis position accuracy calculation unit 106 uses the Y-axis movement unit 32 to position the dicing mechanism 20 at a predetermined position in the Y-axis direction a predetermined number of times, and when the dicing mechanism 20 is positioned at a predetermined position in the Z-axis direction a predetermined number of times, it integrates twice the acceleration detected by the dicing mechanism Y-axis acceleration detector 27 to detect multiple positions of the dicing mechanism 20 in the Y-axis direction, calculates the variation in the multiple detected positions of the dicing mechanism 20 in the Y-axis direction, and stores the calculated positions in a storage device.

The dicing device 1-1 according to the modified example has acceleration detectors 13, 14, 25, 26, and 27, so as in the first embodiment, no measuring tools are required during inspection, which has the effect of reducing the amount of work required for inspection.

In addition, in the dicing device 1-1 according to the modified example, the controller 100 is equipped with a Z-axis position accuracy calculation unit 105 and a Y-axis position accuracy calculation unit 106, so that the positional variation in the Y-axis and Z-axis directions of the dicing mechanism 20 can be grasped.

The functions of the holding table mechanism yawing calculation unit 101, the Z-axis position accuracy calculation unit 105, and the Y-axis position accuracy calculation unit 106 are each realized by the calculation processing unit performing calculation processing in accordance with a computer program stored in the storage device.

[Embodiment 2]
A dicing device according to embodiment 2 will be described with reference to the drawings. Fig. 9 is a perspective view showing a schematic configuration example of a dicing device according to embodiment 2. In Fig. 9, the same parts as those in embodiment 1 are denoted by the same reference numerals, and description thereof will be omitted.

The dicing device 1-2 according to the second embodiment is a laser processing device that irradiates a laser beam onto the workpiece 200 to perform laser processing (corresponding to dicing) on the workpiece 200.

The dicing device 1-2 according to the second embodiment includes a holding table mechanism 10 having a holding table 11 that holds the workpiece 200, a laser beam irradiation unit 20-2 (corresponding to a dicing mechanism) that laser processes the workpiece 200 held by the holding table 11, a moving unit 30-2 that moves the holding table mechanism 10 and the laser beam irradiation unit 20-2 relative to one another, and a controller 100 that controls at least the laser beam irradiation unit 20-2 and the moving unit 30-2.

The holding table mechanism 10 includes an X-axis acceleration detector 16 fixed to the table base 12, in addition to a Y-axis acceleration detector 13 and a Z-axis acceleration detector 14. The X-axis acceleration detector 16 remains attached to the table base 12 not only when the inspection method for the dicing device according to the second embodiment is performed, but also when laser processing is performed on the workpiece 200.

The X-axis acceleration detector 16 is fixed to the table base 12 and detects the acceleration of the holding table mechanism 10 in the X-axis direction. It is desirable to place the X-axis acceleration detector 16 in a position as far away as possible from the axis of the holding surface 111 of the holding table 11. This is because the acceleration of the holding table mechanism 10 in the X-axis direction detected by the X-axis acceleration detector 16 increases with distance from the axis of the holding surface 111 of the holding table 11. The X-axis acceleration detector 16 is composed of a well-known accelerometer, and outputs the detection results to the controller 100 at predetermined time intervals.

The moving unit 30-2 of the dicing device 1-2 includes an X-axis moving unit 31-2, which is a processing feed unit that moves the holding table mechanism 10 in the X-axis direction relative to the laser beam irradiation unit 20-2, a Y-axis moving unit 32-2, which is an indexing feed unit that moves the holding table mechanism 10 in the Y-axis direction relative to the laser beam irradiation unit 20-2, and a Z-axis moving unit 33-2 that moves the holding table mechanism 10 in the Z-axis direction, which is the cutting feed direction, relative to the laser beam irradiation unit 20-2. That is, the moving unit 30-2 moves the holding table mechanism 10 and the laser beam irradiation unit 20-2 relatively in the X-axis, Y-axis, and Z-axis directions.

The Y-axis moving unit 32-2 is installed on the device body 2, and moves the support frame 36 supporting the holding table mechanism 10 and the second support frame 37 supporting the X-axis moving unit 31-2 in the Y-axis direction, which is the indexing feed direction, thereby moving the holding table mechanism 10 in the Y-axis direction relative to the laser beam irradiation unit 20-2. The X-axis moving unit 31-2 is installed on the second support frame 37, and moves the support frame 36 supporting the holding table mechanism 10 in the X-axis direction, which is the processing feed direction, thereby moving the holding table mechanism 10 in the X-axis direction relative to the laser beam irradiation unit 20-2.

The Z-axis movement unit 33-2 is installed on an erect wall 5 erected from one end of the device body 2 in the Y-axis direction, and moves the laser beam irradiation unit 20-2 in the Z-axis direction, thereby moving the holding table mechanism 10 relative to the dicing mechanism 20 in the Z-axis direction.

The X-axis moving unit 31-2, the Y-axis moving unit 32-2 and the Z-axis moving unit 33-2 are equipped with well-known ball screws 311, 321, 331 that are rotatable about their axes, well-known motors 312, 322, 332 that rotate the ball screws 311, 321, 331 about their axes, and well-known guide rails 313, 323, 333 that support the holding table mechanism 10 or the dicing mechanism 20 so that they can move freely in the X-axis, Y-axis or Z-axis directions.

The dicing device 1-2 also includes an X-direction position detection unit (not shown) for detecting the position of the holding table mechanism 10 in the X-axis direction, a Y-direction position detection unit (not shown) for detecting the position of the holding table mechanism 10 in the Y-axis direction, and a Z-direction position detection unit (not shown) for detecting the position of the laser beam irradiation unit 20-2 in the Z-axis direction. These position detection units can be configured with a linear scale installed parallel to the X-axis direction, the Y-axis direction, or the Z-axis direction, and a reading head that reads the linear scale installed on the support frame 36, 37 or the laser beam irradiation unit 20-2 that moves in the X-axis direction, the Y-axis direction, or the Z-axis direction. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position of the holding table mechanism 10 or the laser beam irradiation unit 20-2 in the X-axis direction, the Y-axis direction, or the Z-axis direction to the controller 100.

The laser beam irradiation unit 20-2 includes a laser beam oscillator that emits a laser beam having a wavelength that is absorbent or transmissive to the substrate of the workpiece 200, and a focusing lens 28 that focuses the laser beam emitted by the laser beam oscillator onto the workpiece 200 and moves in the Z-axis direction by the Z-axis moving unit 33. In the second embodiment, the laser beam irradiation unit 20-2 also includes a dicing mechanism Z-axis acceleration detector 29.

The dicing mechanism Z-axis acceleration detector 29 moves in the Z-axis direction together with the focusing lens 28 by the Z-axis moving unit 33, and detects the acceleration of the focusing lens 28 in the Z-axis direction.

The controller 100 controls each of the above-mentioned components of the dicing device 1-2 to cause the dicing device 1-2 to perform processing operations on the workpiece 200.

In the above-mentioned dicing device 1-2, when the Y-axis moving unit 32-2 moves the second support frame 37 supporting the holding table mechanism 10 and the like in the Y-axis direction, the holding table mechanism 10 moves slightly in the Z-axis and X-axis directions from the normal position determined by design during the movement in the Y-axis direction due to dimensional errors in the ball screw 321 and guide rail 323 of the Y-axis moving unit 32-2 and external vibrations acting on the dicing device 1-2. Since the ball screw 321 rotates around its axis and the holding table mechanism 10 moves in the Y-axis direction, the holding table mechanism 10 often moves along a sine wave in which the position in the X-axis or Z-axis direction changes periodically as it moves in the Y-axis direction.

In addition, in the above-mentioned dicing device 1-2, when the X-axis moving unit 31-2 moves the support frame 36 supporting the holding table mechanism 10 in the X-axis direction, the holding table mechanism 10 moves slightly in the Y-axis and Z-axis directions from the normal position determined by design during the movement in the X-axis direction due to dimensional errors in the ball screw 311 and guide rail 313 of the X-axis moving unit 31-2 and external vibrations acting on the dicing device 1-2. Because the ball screw 311 rotates around its axis and the holding table mechanism 10 moves in the X-axis direction, the holding table mechanism 10 often moves along a sine wave in which the position in the Y-axis or Z-axis direction changes periodically as it moves in the X-axis direction.

Hereinafter, the amount of movement in the X-axis direction during the movement of the holding table mechanism 10 will be referred to as the amount of runout in the X-axis direction of the holding table mechanism 10. Also, the amount of movement in the Y-axis direction during the movement of the holding table mechanism 10 will be referred to as the amount of runout in the Y-axis direction of the holding table mechanism 10. Also, the amount of movement in the Z-axis direction during the movement of the holding table mechanism 10 will be referred to as the amount of runout in the Z-axis direction of the holding table mechanism 10.

In addition, in the second embodiment, the controller 100 has a holding table mechanism X-axis yaw calculation unit 101-1, a holding table mechanism Y-axis yaw calculation unit 101-2, a holding table mechanism pitching calculation unit 102-2, and a lens position accuracy calculation unit 107, as shown in FIG. 9.

The holding table mechanism X-axis yaw calculation unit 101-1 detects the amount of deflection of the holding table mechanism 10 in the X-axis direction by integrating twice with time the acceleration in the X-axis direction detected by the X-axis acceleration detector 16 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction by the Y-axis movement unit 32-2 with the X-axis movement unit 31-2 stopped.

The holding table mechanism Y-axis yawing calculation unit 101-2 detects the amount of deflection of the holding table mechanism 10 in the Y-axis direction by integrating twice in time the acceleration in the Y-axis direction detected by the Y-axis acceleration detector 13 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction by the X-axis movement unit 31-2 with the Y-axis movement unit 32-2 stopped, and stores the amount of deflection in the Y-axis direction of the holding table mechanism 10 in a storage device.

The holding table mechanism pitching calculation unit 102-2 integrates twice with time the acceleration in the Z-axis direction detected by the Z-axis acceleration detector 14 at each predetermined time interval while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction by the Y-axis movement unit 32 with the X-axis movement unit 31-2 stopped, and while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction by the X-axis movement unit 31-2 with the Y-axis movement unit 32-2 stopped, to detect the amount of deflection in the Z-axis direction of the holding table mechanism 10 and store the detected amount in a storage device.

The lens position accuracy calculation unit 107 uses the Z-axis movement unit 33 to position the focusing lens 28 of the laser beam irradiation unit 20-2 at a predetermined position in the Z-axis direction a predetermined number of times, and integrates twice the acceleration detected by the dicing mechanism Z-axis acceleration detector 26 when the focusing lens 28 is positioned at a predetermined position in the Z-axis direction a predetermined number of times to detect multiple positions of the focusing lens 28 in the Z-axis direction, calculates the variation in the multiple detected positions of the focusing lens 28 in the Z-axis direction, and stores the calculated values in a storage device.

Furthermore, the functions of the holding table mechanism X-axis yaw calculation unit 101-1, the holding table mechanism Y-axis yaw calculation unit 101-2, the holding table mechanism pitch calculation unit 102, and the lens position accuracy calculation unit 107 are each realized by the arithmetic processing unit of the controller 100 performing arithmetic processing in accordance with a computer program stored in the storage device.

Next, a method for inspecting a dicing device according to the second embodiment will be described. FIG. 10 is a flowchart showing the flow of the method for inspecting a dicing device according to the second embodiment. The method for inspecting a dicing device according to the second embodiment is a method for inspecting a dicing device 1 according to the second embodiment having the above-described configuration, and is carried out, for example, when the dicing device 1 is shipped from a factory where the dicing device 1 is manufactured, when the dicing device 1 is relocated, and during regular inspection, as in the first embodiment.

The inspection method for the dicing device according to the second embodiment is started by the dicing device 1 when the controller 100 receives and registers the inspection content information registered by the operator and receives an instruction to start the inspection from the operator. The inspection content information includes a predetermined distance to move the holding table mechanism 10 in the X-axis and Y-axis directions, and a predetermined position in the Z-axis direction to position the focusing lens 28 of the laser beam irradiation unit 20-2.

As shown in FIG. 10, the inspection method for the dicing device according to the second embodiment includes a first holding table mechanism inspection step 1001-1, a second holding table mechanism inspection step 1001-2, and a lens position accuracy calculation step 1020.

As shown in FIG. 10, the first holding table mechanism inspection step 1001-1 includes a first holding table mechanism yawing calculation step 1002-1 and a first holding table mechanism pitching calculation step 1003-1.

The first holding table mechanism yawing calculation step 1002-1 is a step for detecting the amount of deflection in the X-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction by the Y-axis moving unit 32-2 with the X-axis moving unit 31-2 stopped, by integrating twice the acceleration in the X-axis direction detected by the X-axis acceleration detector 16 while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction.

The first holding table mechanism pitching calculation step 1003-1 is a step for detecting the amount of deflection in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction by the Y-axis moving unit 32-2 with the X-axis moving unit 31-2 stopped, by integrating twice the acceleration in the Z-axis direction detected by the Z-axis acceleration detector 14 while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction.

In the first holding table mechanism yawing calculation step 1002-1 and the first holding table mechanism pitching calculation step 1003-1, the controller 100 controls the X-axis moving unit 31-2 and the Y-axis moving unit 32-2 to move the holding table mechanism 10 a predetermined distance in the Y-axis direction with the Y-axis moving unit 32-2 stopped.

In the first holding table mechanism yawing calculation step 1002-1, the holding table mechanism X-axis yawing calculation unit 101-1 integrates twice in time the acceleration in the X-axis direction detected by the X-axis acceleration detector 16 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction by the Y-axis movement unit 32-2, to detect the amount of runout in the X-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction. In the first holding table mechanism yawing calculation step 1002-1, the holding table mechanism X-axis yawing calculation unit 101-1 stores the detected amount of runout in the X-axis direction of the holding table mechanism 10 in a storage device.

In the first holding table mechanism pitching calculation step 1003-1, the holding table mechanism pitching calculation unit 102-2 integrates twice over time the acceleration in the Z-axis direction detected by the Z-axis acceleration detector 14 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction by the Y-axis movement unit 32-2, to detect the amount of runout in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the Y-axis direction. In the first holding table mechanism pitching calculation step 1003-1, the holding table mechanism pitching calculation unit 102-2 stores the detected amount of runout in the Z-axis direction of the holding table mechanism 10 in a storage device.

As shown in FIG. 10, the second holding table mechanism inspection step 1001-2 includes a second holding table mechanism yawing calculation step 1002-2 and a second holding table mechanism pitching calculation step 1003-2.

The second holding table mechanism yawing calculation step 1002-2 is a step for detecting the amount of deflection in the Y-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction by the X-axis moving unit 31-2 with the Y-axis moving unit 32-2 stopped, by integrating twice the acceleration in the Y-axis direction detected by the Y-axis acceleration detector 13 while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction.

The second holding table mechanism pitching calculation step 1003-2 is a step for detecting the amount of deflection in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction by the X-axis moving unit 31-2 with the Y-axis moving unit 32-2 stopped, by integrating twice the acceleration in the Z-axis direction detected by the Z-axis acceleration detector 14 while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction.

In second holding table mechanism yawing calculation step 1002-2 and second holding table mechanism pitching calculation step 1003-2, the controller 100 controls the X-axis moving unit 31-2 and the Y-axis moving unit 32-2 to move the holding table mechanism 10 a predetermined distance in the X-axis direction with the Y-axis moving unit 32-2 stopped.

In the second holding table mechanism yawing calculation step 1002-2, the holding table mechanism Y-axis yawing calculation unit 101-2 integrates twice in time the acceleration in the Y-axis direction detected by the Y-axis acceleration detector 13 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction by the X-axis movement unit 31-2, to detect the amount of runout in the Y-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction. In the second holding table mechanism yawing calculation step 1002-2, the holding table mechanism Y-axis yawing calculation unit 101-2 stores the detected amount of runout in the Y-axis direction of the holding table mechanism 10 in a storage device.

In the second holding table mechanism pitching calculation step 1003-2, the holding table mechanism pitching calculation unit 102-2 integrates twice in time the acceleration in the Z-axis direction detected by the Z-axis acceleration detector 14 at predetermined time intervals while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction by the X-axis moving unit 31-2, to detect the amount of runout in the Z-axis direction of the holding table mechanism 10 while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction. In the second holding table mechanism pitching calculation step 1003-2, the holding table mechanism pitching calculation unit 102-2 stores the detected amount of runout in the Z-axis direction of the holding table mechanism 10 in a storage device.

The lens position accuracy calculation step 1020 is a step for calculating the accuracy of the position of the focusing lens 28 of the laser beam irradiation unit 20-2 in the Z-axis direction. In the lens position accuracy calculation step 1020, the controller 100 controls the Z-axis movement unit 33 to position the focusing lens 28 of the laser beam irradiation unit 20-2 at a predetermined position in the Z-axis direction a predetermined number of times.

In the lens position accuracy calculation step 1020, the lens position accuracy calculation unit 107 detects multiple positions in the Z-axis direction of the focusing lens 28 by integrating twice the acceleration detected by each dicing mechanism Z-axis acceleration detector 26 when the focusing lens 28 is positioned at a predetermined position in the Z-axis direction a predetermined number of times. In the lens position accuracy calculation step 1020, the lens position accuracy calculation unit 107 calculates the variation in the multiple detected positions in the Z-axis direction of the focusing lens 28 and stores it in the storage device.

In the dicing device 1-2 according to the second embodiment, the holding table mechanism 10 has an X-axis acceleration detector 16, a Y-axis acceleration detector 13, and a Z-axis acceleration detector 14. The controller 100 integrates the acceleration detected by each of the acceleration detectors 13, 14, and 16 twice over time to detect the amount of deflection of the holding table mechanism in the X-axis direction, the amount of deflection in the Y-axis direction, and the amount of deflection in the Z-axis direction while the holding table mechanism 10 is moved a predetermined distance in the X-axis direction or the Y-axis direction. As a result, the dicing device 1-2 does not need to attach a measuring tool to the holding table mechanism 10 or the laser beam irradiation unit 20-2 in order to detect the amount of deflection of the holding table mechanism 10, and as a result, similar to the first embodiment, it has the effect of reducing the effort required for inspection.

In addition, in the dicing device 1-2 according to the second embodiment, the controller 100 is equipped with a lens position accuracy calculation unit 107, so that the variation in the position of the focusing lens 28 of the laser beam irradiation unit 20-2 in the Z-axis direction can be grasped.

The present invention is not limited to the above embodiment. In other words, the present invention can be implemented in various modifications without departing from the gist of the invention.

1, 1-1, 1-2 dicing device 10 holding table mechanism 11 holding table 13 Y-axis acceleration detector 14 Z-axis acceleration detector 20 dicing mechanism 20-2 laser beam irradiation unit (dicing mechanism)
25 Dicing mechanism X-axis acceleration detector 26 Dicing mechanism Z-axis acceleration detector 31, 31-2 X-axis movement unit (processing feed unit)
32, 32-2 Y-axis movement unit (indexing feed unit)
100 Controller 101 Holding table mechanism yaw calculation unit 102 Holding table mechanism pitching calculation unit 103 Dicing mechanism yaw calculation unit 104 Dicing mechanism pitching calculation unit 200 Workpiece 301 Runout amount in Y-axis direction 302 Runout amount in Z-axis direction 303 Runout amount in X-axis direction 304 Runout amount in Z-axis direction 401, 402 Predetermined distance 501 Acceleration in Y-axis direction 502 Acceleration in Z-axis direction 503 Acceleration in X-axis direction 504 Acceleration in Z-axis direction 1002 Holding table mechanism yaw calculation step 1003 Holding table mechanism pitching calculation step 1002-1 First holding table mechanism yaw calculation step 1003-1 First holding table mechanism pitching calculation step 1002-2 Second holding table mechanism yaw calculation step 1003-2 Second holding table mechanism pitching calculation step 1012 Dicing mechanism yawing calculation step 1013 Dicing mechanism pitching calculation step

Claims (4)

A dicing apparatus comprising:
a holding table mechanism having a holding table for holding a workpiece;
a dicing mechanism that dices the workpiece held by the holding table;
a processing feed unit that moves the holding table mechanism in an X-axis direction relative to the dicing mechanism;
an indexing feed unit that moves the holding table mechanism relative to the dicing mechanism in a Y-axis direction perpendicular to the X-axis direction;
A controller for controlling at least the dicing mechanism, the processing feed unit, and the indexing feed unit;
the holding table mechanism has a Y-axis acceleration detector that detects acceleration in the Y-axis direction, and a Z-axis acceleration detector that detects acceleration in a Z-axis direction that is perpendicular to the X-axis direction and the Y-axis direction,
The controller
a holding table mechanism yawing calculation unit that detects a shake amount of the holding table mechanism in the Y-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction by integrating twice the acceleration in the Y-axis direction detected by the Y-axis acceleration detector while the holding table mechanism is moved the predetermined distance in the X-axis direction;
a holding table mechanism pitching calculation unit that detects the amount of vibration of the holding table mechanism in the Z-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction by twice integrating the acceleration in the Z-axis direction detected by the Z-axis acceleration detector while the holding table mechanism is moved the predetermined distance in the X-axis direction. The indexing feed unit moves the dicing mechanism in the Y-axis direction relative to the holding table mechanism;
the dicing mechanism has at its tip a dicing mechanism X-axis acceleration detector for detecting acceleration in the X-axis direction, and a dicing mechanism Z-axis acceleration detector for detecting acceleration in a Z-axis direction perpendicular to the X-axis direction and the Y-axis direction,
The controller
a dicing mechanism yawing calculation unit that detects an amount of deflection of the dicing mechanism in the X-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction by integrating twice the acceleration in the X-axis direction detected by the dicing mechanism X-axis acceleration detector while the dicing mechanism is moved the predetermined distance in the Y-axis direction; and
2. The dicing apparatus of claim 1, further comprising: a dicing mechanism pitching calculation unit that detects the amount of deflection of the dicing mechanism in the Z-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction by integrating twice the acceleration in the Z-axis direction detected by the dicing mechanism Z-axis acceleration detector while the dicing mechanism is moved a predetermined distance in the Y-axis direction. A method for inspecting a dicing device, comprising the steps of:
a holding table mechanism yawing calculation step, which includes a holding table for holding a workpiece, a Y-axis acceleration detector for detecting acceleration in a Y-axis direction parallel to the horizontal direction, and a Z-axis acceleration detector for detecting acceleration in a Z-axis direction perpendicular to the Y-axis direction and parallel to the vertical direction, and which detects an amount of runout of the holding table mechanism in the Y-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction parallel to the horizontal direction and perpendicular to the Y-axis direction by a processing feed unit, by integrating twice the acceleration in the Y-axis direction detected by the Y-axis acceleration detector while the holding table mechanism is moved a predetermined distance in the X-axis direction parallel to the horizontal direction;
a holding table mechanism pitching calculation step of detecting an amount of deflection of the holding table mechanism in the Z-axis direction while the holding table mechanism is moved a predetermined distance in the X-axis direction by integrating twice the acceleration in the Z-axis direction detected by the Z-axis acceleration detector while the holding table mechanism is moved the predetermined distance in the X-axis direction;
A method for inspecting a dicing device comprising the steps of: a dicing mechanism yawing calculation step in which the dicing mechanism has a processing tool for dicing a workpiece held by the holding table, a dicing mechanism X-axis acceleration detector at its tip for detecting acceleration in the X-axis direction, and a dicing mechanism Z-axis acceleration detector for detecting acceleration in a Z-axis direction perpendicular to the X-axis direction and the Y-axis direction, and the dicing mechanism is moved in the Y-axis direction relatively to the holding table mechanism by an indexing feed unit, and the acceleration in the X-axis direction detected by the dicing mechanism X-axis acceleration detector while the dicing mechanism is moved a predetermined distance in the Y-axis direction is integrated twice to detect an amount of runout of the dicing mechanism in the X-axis direction while the dicing mechanism is moved the predetermined distance in the Y-axis direction;
a dicing mechanism pitching calculation step of detecting an amount of run-out of the dicing mechanism in the Z-axis direction while the dicing mechanism is moved a predetermined distance in the Y-axis direction by integrating twice the acceleration in the Z-axis direction detected by the dicing mechanism Z-axis acceleration detector while the dicing mechanism is moved the predetermined distance in the Y-axis direction;
The method for inspecting a dicing device according to claim 3, further comprising:

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