KR102645229B1 - Inspection jig and inspection method - Google Patents

Abstract

[Task] To provide an inspection jig and inspection method that can accurately measure the pixel size of an imaging device.
[Solution] A plate-shaped inspection jig 100 for measuring the pixel size of an imaging means of a processing device, comprising a first pattern 102, a second pattern 103, and a first pattern 102 having different widths on the surface of a plate 101. It has three patterns 104 and a two-dimensional code 105 in which the actual measured values of the widths (La, Lb, Lc) of the first pattern 102, the second pattern 103, and the third pattern 104 are recorded. .

Description

Inspection jig and inspection method {INSPECTION JIG AND INSPECTION METHOD}

The present invention relates to an inspection jig for measuring the pixel size of an imaging means formed in a processing device and an inspection method using the inspection jig.

Generally, a processing device that cuts and processes workpieces such as wafers performs an operation called a kerf check that detects the width of chipping or processing grooves from images captured on the processing device (for example, see Patent Document 1). . At this time, the pixel size (length per pixel; also called image resolution) of the imaging means is used to measure the width of chipping or processing grooves.

Japanese Patent Publication No. 05-326700

However, in order to accurately perform the above-described kerf check, it is necessary to accurately measure the pixel size of the imaging means. However, in the conventional configuration, the pattern that is the target of the imaging means is moved by a predetermined distance by relatively moving the wafer having the pattern as a standard for inspection and the imaging means, and the movement amount of the pattern is converted into the amount of change (movement amount) of the pixel. By dividing, the processing device was performing an operation called pixel size measurement, which automatically calculates the pixel size. In this case, if there is a slight error in the mechanical movement amount of the wafer with the pattern that serves as the standard for inspection and the imaging means, the calculated pixel size is not accurate, and the chipping or processing groove width measured using the pixel size is not accurate. There was a possibility that it wouldn't happen.

Accordingly, the purpose of the present invention is to provide an inspection jig and an inspection method that can accurately measure the pixel size of an imaging means.

According to one aspect of the present invention, a plate-shaped inspection jig for measuring the pixel size of an imaging means of a processing device is provided, which includes a pattern on the surface and a two-dimensional code with the width of the pattern recorded.

According to this configuration, by reading the two-dimensional code with an imaging means, the actual width of the pattern recorded in the two-dimensional code can be obtained, so the actual width of this pattern is divided by the number of pixels corresponding to the width of the pattern. This allows the pixel size to be accurately calculated. Moreover, even in the case of having a plurality of inspection jigs, the two-dimensional code formed on the inspection jig can be recognized by the imaging means, so misreading of the inspection jig can be prevented. Additionally, by recording the actual width of the pattern in the two-dimensional code, the pixel size can be measured with high precision even without manufacturing the pattern with high precision to a predetermined length.

In this configuration, the pattern may be formed in plural patterns with different widths. According to this configuration, by calculating the pixel size by respectively imaging a plurality of patterns with different widths, errors due to, for example, distortion of the lens of the imaging means can be reduced.

According to another aspect of the present invention, an inspection for measuring the pixel size of the imaging means in a processing device including a control means, a holding means, a processing means, an imaging means, and a screen for displaying the captured image. As a method, an inspection jig having a two-dimensional code with a pattern and the width of the pattern written on the surface is held in the holding means, the two-dimensional code is read by the imaging means, and the width of the pattern is measured by the control means. A reading step to store the pattern in parallel, a parallel alignment step to parallelize the pattern and the imaging means, a measurement step to image the pattern and measure the number of pixels corresponding to the width of the pattern on the screen, and in the reading step An inspection method is provided that includes a calculation step for calculating the pixel size by dividing the width of the read pattern by the number of pixels measured in the measurement step.

According to the present invention, by reading the two-dimensional code with an imaging means, the actual width of the pattern recorded in the two-dimensional code can be obtained, so the actual width of the pattern is divided by the number of pixels corresponding to the width of the pattern. This allows the pixel size to be accurately calculated.

Fig. 1 is a perspective view showing a configuration example of a processing device in which the inspection jig according to the first embodiment is used.
Fig. 2 is a plan view showing a configuration example of an inspection jig according to the first embodiment.
Fig. 3 is a block diagram showing an example of the configuration of the control means of the processing device.
Fig. 4 is a flow chart showing the procedure of the inspection method.
Fig. 5 is a schematic diagram of image data of the inspection jig displayed on the screen.
Fig. 6 is a plan view showing a configuration example of an inspection jig according to the second embodiment.
Fig. 7 is a plan view showing a configuration example of an inspection jig according to the third embodiment.

An inspection jig and an inspection method related to an embodiment of the present invention will be described. The present invention is not limited to the content described in the following embodiments. In addition, the components described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Additionally, the configurations described below can be combined appropriately. In addition, various omissions, substitutions, or changes in the structure may be made without departing from the gist of the present invention.

[First Embodiment]

Fig. 1 is a perspective view showing a configuration example of a processing device in which the inspection jig according to the first embodiment is used. Fig. 2 is a plan view showing a configuration example of an inspection jig according to the first embodiment. Fig. 3 is a block diagram showing an example of the configuration of the control means of the processing device. The processing device 1 is a device that processes the wafer 200 as a workpiece and divides the wafer 200 into individual chips. As shown in FIG. 1, the processing device 1 includes a chuck table (holding means) 10, processing means 20, a door-shaped frame 30, processing conveying means 40, and output conveying means. (50), a cutting means (60), an imaging means (70), a display means (74), and a control means (80).

The wafer 200 is a workpiece such as a semiconductor wafer on which semiconductor devices or optical devices are formed, an optical device wafer, an inorganic material substrate, a flexible resin material substrate, a ceramic substrate, or a glass substrate. The wafer 200 is formed in the shape of a disk, and has a plurality of division lines arranged in a grid on its surface and a plurality of regions divided by these division lines, and each region contains ICs, LSIs, etc. Each device is formed. The wafer 200 is supported on the annular frame 202 via, for example, an adhesive tape 201.

The chuck table 10 is arranged to be movable along an opening 2a formed in the X-axis direction on the upper surface of the device main body 2. The chuck table 10 is provided with a holding surface 11 and a plurality of holding parts 12. The chuck table 10 is formed in the shape of a disk, and is rotated on a rotation axis orthogonal to the center of the holding surface 11 by rotation means (not shown). The holding surface 11 is the vertical upper surface of the chuck table 10 and is formed to be flat with respect to the horizontal surface. The holding surface 11 is made of, for example, porous ceramic, etc., and suction-holds the wafer 200 by negative pressure from a vacuum suction source (not shown). A plurality of holding portions 12 are formed in a four-point arrangement around the holding surface 11, and sandwich and secure the annular frame 202.

The processing means 20 processes the wafer 200 held on the chuck table 10. The processing means 20 is formed by standing the device main body 2 so as to span the opening 2a formed on the upper surface of the device main body 2 in the Y-axis direction, and the output and feed means 50 are inserted into the gate-shaped frame 30. It is fixed via a transfer means (60). The processing means 20 includes a cutting blade 21, a spindle 22, and a housing 23. The cutting blade 21 is a cutting grindstone formed in an ultra-thin disk shape or annular shape. The spindle 22 is detachably equipped with a cutting blade 21 at its tip. The housing 23 has a drive source, such as a motor (not shown), and supports the spindle 22 so that it can freely rotate around the rotation axis in the Y-axis direction. The spindle 22 is rotated at high speed to cut the wafer 200 with the cutting blade 21.

The processing transfer means 40 relatively moves the chuck table 10 and the processing means 20 in the X-axis direction. For example, the machining transfer means 40 has a drive source such as a ball screw or pulse motor (not shown) extending in the Move it in the axial direction. Additionally, in the opening 2a, a cover member 41 that covers the X-axis movable base and a bellows member 42 extending in the

The calculation transfer means 50 relatively moves the chuck table 10 and the processing means 20 in the Y-axis direction. For example, the output conveying means 50 includes a pair of guide rails 51 extending in the Y-axis direction, a ball screw 52 disposed parallel to the guide rail 51, and a ball screw 52. A Y-axis moving base 53 is fixed to a nut not shown and screwed to the guide rail 51 and is arranged to slide freely on the guide rail 51, and a pulse motor not shown to rotate the ball screw 52. there is. The output conveying means 50 rotates the ball screw 52 using a pulse motor to move the Y-axis moving base 53 supporting the cutting conveying means 60 in the Y-axis direction.

The cutting feed means 60 moves the machining means 20 in the Z-axis direction orthogonal to the holding surface 11 of the chuck table 10. For example, the cutting feed means 60 includes a pair of guide rails 61 extending in the Z-axis direction and fixed to the Y-axis moving base 53, and balls disposed in parallel with the guide rails 61. A screw 62 and a Z-axis movement base 63 fixed to a nut (not shown) screwed to the ball screw 62 and disposed to freely slide on the guide rail 61, and a ball screw 62 It is provided with a pulse motor 64 that rotates. The cutting feed means 60 rotates the ball screw 62 using the pulse motor 64 to move the Z-axis moving base 63 supporting the machining means 20 in the Z-axis direction.

The imaging means 70 is comprised of an optical system 71 and an imaging body 72 integrally, and is fixed to the door-shaped frame 30 via an output conveying means 50 and an infeed conveying means 60. . The optical system 71 acquires an optical image of the surface of the wafer 200 held on the chuck table 10 or the inspection jig 100 (described later). The optical system 71 is configured by combining one or more lenses (not shown), is set at a predetermined position with respect to the wafer 200 or the inspection jig 100, and forms an image of the incident light to capture an image. An optical image is formed on the body 72.

The imaging body 72 captures the optical image of the wafer 200 or the inspection jig 100 acquired by the optical system 71, and is, for example, a camera using a CCD (Charge Coupled Device) image sensor. The imaging body 72 performs photoelectric conversion on the optical image and outputs image data to the control means 80 .

The display means 74 is, for example, a touch panel and is disposed at a predetermined position on the device main body 2. The display means 74 displays images captured by the imaging means 70 or allows the operator to input processing conditions, etc.

The control means 80 controls each component of the processing device 1. For example, the control means 80 is connected to a drive circuit (not shown) that drives the pulse motors of the machining feed means 40, the output feed means 50, and the cutting feed means 60, and controls the drive circuit. Thus, the position of the chuck table 10 in the X-axis direction and the positions of the processing means 20 in the Y-axis direction and Z-axis direction are determined. Additionally, the control means 80 performs a kerf check to detect chipping of the wafer 200 on the chuck table 10 and the width of the processing groove based on the image data captured by the imaging means 70.

However, in order to accurately measure the size of chipping or machining grooves when checking the kerf, it is necessary to accurately obtain the pixel size of the imaging means 70. For this reason, in this embodiment, the pixel size of the imaging means 70 is measured and calculated using the inspection jig 100 shown in FIG. 2.

The inspection jig 100 is a jig for measuring and calculating the pixel size of the imaging means 70 formed in the processing device 1. As shown in Fig. 2, the inspection jig 100 is provided with a plate body 101 formed in a substantially rectangular shape. This plate body 101 is formed of a material (for example, quartz) with a low coefficient of thermal expansion, and the surface of the plate body (101) is coated with a material (for example, chrome) that is stronger in light reflection than quartz. Additionally, on the surface of the plate body 101, a first pattern 102, a second pattern 103, and a third pattern 104 extending along the longitudinal direction of the plate body 101, and a pattern in the width direction of each of these patterns are formed. A two-dimensional code 105 is formed in which the actual size of the width is recorded.

The first pattern 102, the second pattern 103, and the third pattern 104 are grooves formed on the surface of the plate 101 by etching, dicing, or laser processing, and the coating chrome is removed to form the grooves. Quartz on the floor is exposed. The widths of the first pattern 102, the second pattern 103, and the third pattern 104 in the width direction are formed differently according to the blade width of the cutting blade 21 used for processing the wafer 200. It is done. In this embodiment, the width La of the first pattern 102 is formed to be 20 [μm], the width Lb of the second pattern 103 is 10 [μm], and the width of the third pattern 104 is 10 [μm]. (Lc) is formed as 5 [㎛].

The two-dimensional code 105 stores various information about the inspection jig 100. In this embodiment, the actual measured values of each width (La, Lb, Lc) of the above-described first pattern 102, second pattern 103, and third pattern 104 are stored. For this reason, there is no need to manufacture the widths of various patterns at a predetermined length with high precision, making it possible to facilitate the processability of the inspection jig 100. Additionally, in the present embodiment, since the two-dimensional code 105 is formed on the surface of the inspection jig 100, the two-dimensional code 105 is photographed by the imaging means 70 to capture the two-dimensional code 105 stored in the two-dimensional code 105. Various information about the inspection jig 100 can be obtained. For this reason, for example, even in the case of having a plurality of inspection jigs, misreading of the inspection jigs can be prevented.

In order to measure and calculate the pixel size of the imaging means 70 using the inspection jig 100, the control means 80 includes a storage means 81 and an image reading means 82, as shown in FIG. 3. ), measuring means (83), and calculating means (84). The image reading means 82 uses the imaging means 70 to read various information (actual value of the width of each pattern) of the two-dimensional code 105 formed on the surface of the inspection jig 100. The storage means 81 stores the actual measurement value of the width of each pattern read from the two-dimensional code 105 by the image reading means 82. The measuring means 83 measures the number of pixels corresponding to the width La of the first pattern 102 displayed on the screen 75 of the display means 74, for example. The calculating means 84 calculates the pixel size by dividing the actual measured value of the width La of the first pattern 102 stored in the storage means 81 by the number of pixels measured by the measuring means 83. The calculated pixel size is, for example, to confirm that the precision of the pixel size measure (not shown), which is calculated by dividing the amount of change in the pixel by the amount of movement of the axis in a predetermined axis direction (e.g., X-axis direction), is high. It is used.

Next, an inspection method for measuring the pixel size of the imaging means 70 will be described. Fig. 4 is a flow chart showing the procedure of the inspection method. Fig. 5 is a schematic diagram of image data of the inspection jig displayed on the screen. First, the operator places the inspection jig 100 on the holding surface 11 of the chuck table 10 and holds the chuck table 10 (step S1; holding step). For example, as shown in FIG. 2, the inspection jig 100 is mounted so that its longitudinal direction is substantially parallel to the X-axis direction. In this case, the first pattern 102 (second pattern 103, third pattern 104) formed on the surface of the inspection jig 100 also extends substantially along the X-axis direction. In addition, the operator is not limited to placing the inspection jig 100 on the chuck table 10, and for example, a transfer mechanism (not shown) may be used to transfer the wafer 200.

Next, the two-dimensional code 105 of the inspection jig 100 is read by the imaging means 70, and the first pattern 102, second pattern 103, and third pattern 104 of the inspection jig 100 are read. The actual measured value of each width is stored in the storage means 81 (Step S2: Reading Step). In this case, when the operator operates the processing device 1, the control means 80 operates the processing transfer means 40 and the calculation transfer means 50, so that the two-dimensional code 105 of the inspection jig 100 is moved. The imaging means 70 is arranged, and the two-dimensional code 105 is imaged at this position. The image reading means 82 reads the actual measured value of the width of each pattern registered in the two-dimensional code 105 from the captured image, and stores the read actual measured value of the width of each pattern in the storage means 81. This reading step may be performed at least before the calculation step described later. For example, the actual measured value of the width of each pattern registered in the two-dimensional code 105 may be read in advance before performing the holding step.

Next, the first pattern 102 of the inspection jig 100 is made parallel to the imaging means 70 (step S3; parallel alignment step). In this embodiment, for example, the direction in which the first pattern 102 extends is parallel to the direction in which the inspection jig 100 (chuck table 10) moves relative to the imaging means 70. says that Specifically, as shown in FIG. 2, the direction in which the first pattern 102 extends is the direction in which the inspection jig 100 (chuck table 10) moves with respect to the imaging means 70 whose position is fixed. Make it parallel to (X axis direction). In this case, the control means 80 performs angle adjustment by rotating the chuck table 10 so that the Y coordinates of one side wall 102a of the first pattern 102 coincide at at least two points. For example, the control means 80 performs angle adjustment by rotating the chuck table 10 so that the Y coordinates of the corner portions located on one side wall 102a of the first pattern 102 match each other. . As a result, the direction in which the first pattern 102 extends and the X-axis direction become parallel. In addition, although not shown, the direction in which the first pattern 102 extends is the direction in which the imaging means 70 moves with respect to the inspection jig 100 (chuck table 10) whose position is fixed (Y axis). direction) may be parallel to the direction. In addition, in this embodiment, the first pattern 102 is illustrated, but of course, other patterns (second pattern 103 or third pattern 104) may be used.

Next, the first pattern 102 of the inspection jig 100 is captured by the imaging means 70, and the number of pixels corresponding to the width of the first pattern 102 is displayed on the screen 75 of the display means 74. Measure (step S4; measurement step). In this case, the operator instructs the first pattern 102 to be imaged and confirms that the first pattern 102 is actually being imaged. When the imaging means 70 captures the image of the first pattern 102 of the inspection jig 100, as shown in FIG. 3, an inspection including the first pattern 102 is displayed on the screen 75 of the display means 74. Image data of the jig 100 is displayed. As shown in FIG. 5 , the image data of the inspection jig 100 displayed on the screen 75 is an aggregate of pixels (pixels) P imaged by a plurality of imaging elements formed on the imaging body 72. In this embodiment, each pattern (first pattern 102) has different light reflectivity from the surface of the plate body 101. For this reason, the measuring means 83 distinguishes the surface of the first pattern 102 and the plate body 101, as shown in FIG. 5, by performing image processing, for example, and determines the surface of the first pattern 102. Measure the number of pixels (Lp) arranged in the width direction. In this example of FIG. 5, the number of pixels (Lp) corresponding to the width of the first pattern 102 is 12 [pixels].

Next, the calculating means 84 calculates the pixel size (length per unit pixel (P)) (step S5; calculation step). Specifically, in the reading step, the calculating means 84 calculates the actual measured value of the width La of the first pattern 102 read and input by the image reading means 82 in the measuring step by measuring means ( 83) The pixel size is calculated by dividing the width La of the measured first pattern 102 by the number of pixels Lp corresponding to this measurement.

However, the pixel size of the imaging means 70 may vary between the center and the outside of the lens due to, for example, distortion of the lens of the optical system 71. For this reason, in this embodiment, the widths of the first pattern 102, the second pattern 103, and the third pattern 104 are equal to the blade width of the cutting blade 21 used for processing the wafer 200. Each is formed differently. According to this configuration, for example, when using the cutting blade 21 with a blade width of 20 [μm], the pixel size is calculated using the first pattern 102 having a width corresponding to the blade width, and , when using the cutting blade 21 with a blade width of 5 [μm], the pixel size can be calculated using the third pattern 104 having a width corresponding to the blade width. For this reason, when performing a kerf check after cutting, for example, using the calculated pixel size, the influence of lens distortion, etc. can be reduced and an accurate kerf check can be performed. In addition, the configuration is not limited to the above, and the first pattern 102, the second pattern 103, and the third pattern 104 are used to calculate the pixel size corresponding to each pattern, and the calculated By setting the pixel size to an average value, the pixel size considering lens distortion, etc. can be calculated, allowing accurate kerf checks.

[Second Embodiment]

Next, the inspection jig 100A according to the second embodiment will be described. Fig. 6 is a plan view showing a configuration example of an inspection jig according to the second embodiment. The inspection jig 100A has a different configuration compared to the inspection jig 100 described above in that it is provided with a pair of reference patterns 106, 106 for parallel alignment. Configurations that are the same as those of the inspection jig 100 are given the same symbols and descriptions are omitted. A pair of reference patterns 106, 106 are formed in the same size and the same shape (cross shape). A pair of reference patterns 106, 106 are arranged in a direction parallel to the longitudinal direction of the above-described first pattern 102, etc. A pair of reference patterns 106, 106, like the above-described first pattern 102, are cross grooves formed on the surface of the plate 101 by etching, dicing or laser processing, and the covered chrome is removed. The quartz at the bottom of the groove is exposed.

The two-dimensional code 105 includes a pair of reference patterns along with the actual measured values of each width (La, Lb, Lc) of the above-described first pattern 102, second pattern 103, and third pattern 104. The distances of (106, 106) and the first pattern (102), second pattern (103), and third pattern (104) are respectively stored.

In the above parallel alignment step, the direction in which the pair of reference patterns 106, 106 are aligned is parallel to the direction in which the inspection jig 100A (chuck table 10) moves relative to the imaging means 70. Do it as In this case, the control means 80 controls the chuck table 10 so that the Y coordinate of a predetermined corner of one reference pattern 106 matches the Y coordinate of a predetermined corner of the other reference pattern 106. Rotate to adjust the angle. As a result, the extending direction of the first pattern 102 and the like become parallel to the X-axis direction.

Additionally, in this embodiment, in the two-dimensional code 105, the distances between a pair of reference patterns 106 and 106 and the first pattern 102, second pattern 103 and third pattern 104 are respectively Since it is stored, it becomes possible to automatically calculate the pixel size, for example, using the kerf check function provided by the processing device 1. In this case, in the measurement step, the recorded predetermined distance is moved from the reference pattern 106, for example, the first pattern 102 is imaged, and the first pattern is displayed on the screen 75 of the display means 74. The number of pixels corresponding to the width (La) of (102) is measured. Then, in the calculation step, the pixel size is calculated. Thereafter, the recorded predetermined distance is moved from the reference pattern 106, for example, the second pattern 103 is imaged, and the number of pixels corresponding to the width (Lb) of the second pattern 103 is measured to determine the pixel. Calculate the size. In addition, the third pattern 104 is imaged, for example, by moving the recorded predetermined distance from the reference pattern 106 and measuring the number of pixels corresponding to the width (Lc) of the third pattern 104 to determine the pixel size. can also be calculated.

[Third Embodiment]

Next, the inspection jig 100B according to the third embodiment will be described. Fig. 7 is a plan view showing a configuration example of an inspection jig according to the third embodiment. In this third embodiment, the inspection jig 100B is provided with a disc-shaped plate body 101B, and on the surface of this plate body 101B, a pair of first reference patterns 107, 107 and a pair of A second reference pattern (108, 108) is formed.

The plate body 101B is different from the plate body 101 in that it has a disk-like shape, but is made of the same material. The first reference patterns 107, 107 have the same size and are formed in the same shape (cross shape). The second reference patterns 108 and 108 are smaller than the first reference patterns 107 and 107, but have the same size and are formed in the same shape (cross shape). The first reference patterns 107, 107 and the second reference patterns 108, 108 are arranged in directions parallel to each other. The first reference patterns 107 and 107 and the second reference patterns 108 and 108 are formed differently according to the blade width of the cutting blade 21 used for processing the wafer 200. In this embodiment, the width Ld of the first reference pattern 107 is formed to be 20 [μm], and the width Le of the second reference pattern 108 is formed to be 5 [μm].

The two-dimensional code 105 includes the first reference patterns 107 and 107, along with the actual measured values of each width (Ld, Le) of the above-mentioned first and second reference patterns 107 and 108. 2 The distances of the reference patterns (108, 108) are respectively stored.

In the above-described parallel alignment step, the direction in which the first reference patterns 107, 107 or the second reference patterns 108, 108 are aligned is determined by the inspection jig 100A (chuck table 10) with respect to the imaging means 70. ) is parallel to the direction in which it moves relatively. In this case, the control means 80 ensures that, for example, the Y coordinate of a predetermined corner of one first reference pattern 107 matches the Y coordinate of a predetermined corner of the other first reference pattern 107. To achieve this, angle adjustment is performed by rotating the chuck table 10. As a result, the direction in which the first reference patterns 107 and 107 are aligned (the direction in which the second reference patterns 108 and 108 are aligned) becomes parallel to the X-axis direction.

Moreover, in this embodiment, since the distance between the first reference patterns 107 and 107 and the second reference patterns 108 and 108 is stored in the two-dimensional code 105, for example, the processing device 1 ) It is possible to automatically calculate the pixel size using the kerf check function provided by . In this case, after parallel alignment is performed using the first reference pattern 107, the first reference pattern 107 is imaged and the width of the first reference pattern 107 is displayed on the screen 75 of the display means 74. The pixel size is calculated by measuring the number of pixels corresponding to (Ld). Thereafter, the recorded predetermined distance is moved from the first reference pattern 107, the second reference pattern 108 is imaged, and the number of pixels corresponding to the width (Le) of the second reference pattern 108 is measured to determine the pixel. You can also calculate the size.

As explained above, according to the present embodiment, by reading the two-dimensional code 105 with the imaging means 70, the actual width of each pattern recorded in the two-dimensional code 105 can be obtained, so that the The pixel size can be accurately calculated by dividing the actual width by the number of pixels corresponding to the width of the pattern. Moreover, even in the case of having a plurality of inspection jigs, since the two-dimensional code 105 formed on the inspection jig can be recognized by the imaging means 70, misreading of the inspection jig can be prevented. Additionally, by recording the actual width of each pattern in the two-dimensional code 105, the pixel size can be measured with high precision even without manufacturing the width of the pattern with high precision to a predetermined length.

Additionally, the present invention is not limited to the above embodiments. In other words, various modifications can be made without departing from the gist of the present invention. For example, in each of the above-described embodiments, the first pattern 102 to the third pattern 104 and the reference pattern 106 to the second reference pattern 108 are formed on the surfaces of the plates 101 and 101B. Although the description has been given by way of example, the groove is not limited to this, and for example, a convex portion formed by printing may be used. In addition, the two-dimensional code 105 is preferably formed on the surfaces of the plates 101 and 101B in order to be read by the imaging means 70, but a separate reading means (for example, a portable device such as a barcode reader) is used. As long as it has a configuration, it may be formed on the back surface or side surface of the plate body 101, 101B, and a reading step may be performed in advance.

1: Processing device
10: Chuck table (maintenance means)
20: processing means
21: cutting blade
70: imaging means
71: Optical system
72: imaging body
74: indication means
75 : screen
80: control means
81: means of memory
82: Image reading means
83: means of measurement
84: operation means
100, 100A, 100B: Inspection jig
101, 101B: plate body
102: first pattern
102a: side wall
103: second pattern
104: Third pattern
105: two-dimensional code
106: Reference pattern
107: first reference pattern
108: second reference pattern
200: wafer

Claims (4)

A plate-shaped inspection jig for measuring the pixel size of an imaging means of a processing device that cuts a wafer with a cutting blade,
Equipped with a pattern on the surface and a two-dimensional code recording the width of the pattern,
The width of the pattern is an inspection jig formed to match the blade width of the cutting blade used to process the wafer. According to claim 1,
The pattern is an inspection jig containing multiple patterns with different widths. A processing device including a control means, a holding means, a processing means, an imaging means, and a screen for displaying the captured image, and cutting a wafer with a cutting blade, for measuring the pixel size of the imaging means. As a testing method,
A holding step for holding, on the holding means, an inspection jig having a two-dimensional code with a pattern and the width of the pattern written on the surface;
a reading step of reading the two-dimensional code by the imaging means and storing the width of the pattern in the control means;
A parallel aligning step that aligns the pattern and the imaging means,
a measurement step of imaging the pattern and measuring the number of pixels corresponding to the width of the pattern on the screen;
A calculation step is provided for calculating the pixel size by dividing the width of the pattern read and input in the reading step by the number of pixels measured in the measurement step,
An inspection method in which the width of the pattern is formed to match the blade width of the cutting blade used to process the wafer. An inspection method for measuring the pixel size of an imaging means in a processing device comprising at least a control means, a holding means, a processing means, an imaging means, and a screen for displaying a captured image, comprising:
A holding step for holding, on the holding means, an inspection jig having a plurality of patterns with different widths on the surface and a two-dimensional code recording the widths of the patterns;
a reading step of reading the two-dimensional code by the imaging means and storing the width of the pattern in the control means;
a parallel aligning step that aligns the pattern and the imaging means;
a measurement step of imaging the pattern and measuring the number of pixels corresponding to the width of the pattern on the screen;
A calculation step is provided for calculating the pixel size by dividing the width of the pattern read and input in the reading step by the number of pixels measured in the measurement step,
The calculation step is an inspection method in which the pixel size corresponding to each pattern is calculated, and these calculated pixel sizes are used as an average value.

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