JP6805897B2 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- JP6805897B2 JP6805897B2 JP2017043303A JP2017043303A JP6805897B2 JP 6805897 B2 JP6805897 B2 JP 6805897B2 JP 2017043303 A JP2017043303 A JP 2017043303A JP 2017043303 A JP2017043303 A JP 2017043303A JP 6805897 B2 JP6805897 B2 JP 6805897B2
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- light emitting
- phosphor
- light
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- emitting element
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/02345—Wire-bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
- H01S5/02234—Resin-filled housings; the housings being made of resin
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Description
(発光装置の構成)
図1は、実施の形態に係る発光装置1の垂直断面図である。発光装置1は、凹部10aを有するケース10と、凹部10aの底部に露出するようにケース10に含まれるリードフレーム11と、リードフレーム11上に搭載された発光素子12と、リードフレーム11と発光素子12の電極を電気的に接続するボンディングワイヤー13と、凹部10a内に充填され、発光素子12を封止する封止樹脂14と、封止樹脂14中に含まれる粒子状の蛍光体15とを有する。
上記の実施の形態によれば、従来の発光装置よりも太陽光に近い演色性に優れた光を発する発光装置を提供することができる。
10 ケース
11 リードフレーム
12 発光素子
13 ボンディングワイヤー
14 封止樹脂
15 蛍光体
Claims (5)
- ピーク波長が411nm以上かつ421nm以下の光を発する発光素子と、
445nm以上かつ490nm以下のピーク波長を有する蛍光を発する第1の蛍光体、491nm以上かつ600nm以下のピーク波長を有する蛍光を発する第2の蛍光体、及び601nm以上かつ670nm以下のピーク波長を有する蛍光を発する第3の蛍光体を含む蛍光体と、
を有し、
前記発光素子のみの発光スペクトルと前記蛍光体のみの発光スペクトルが、71nm以上かつ81nm以下の重なり代を有して重なり、
前記重なり代は、前記発光素子のみの発光スペクトルにおけるピークの高さの0.1%の高さの点のうちの長波長側の点と、前記蛍光体のみの発光スペクトルにおける最も高いピークの高さの0.1%の高さの点のうちの短波長側の点との波長の差である、
発光装置。 - 前記重なり代が71nm以上かつ79nm以下である、
請求項1に記載の発光装置。 - 前記重なり代が73nm以上かつ75nm以下である、
請求項2に記載の発光装置。 - 色温度が5000〜6500Kの光を基準光としたときの演色評価数Rf、RgがそれぞれRf≧97、99≦Rg≦102を満たす光を発する、
請求項1〜3のいずれか1項に記載の発光装置。 - 前記第1の蛍光体として、2種のアルカリ土類ハロリン酸塩蛍光体を含み、
前記第2の蛍光体として、β−サイアロン蛍光体及びCa固溶α−サイアロン蛍光体を含み、
前記第3の蛍光体として、CASON蛍光体及びCASN蛍光体を含む、
請求項1〜4のいずれか1項に記載の発光装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017043303A JP6805897B2 (ja) | 2017-03-07 | 2017-03-07 | 発光装置 |
US15/820,180 US10381530B2 (en) | 2017-03-07 | 2017-11-21 | Light emitting device |
Applications Claiming Priority (1)
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---|---|---|---|
JP2017043303A JP6805897B2 (ja) | 2017-03-07 | 2017-03-07 | 発光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018148101A JP2018148101A (ja) | 2018-09-20 |
JP6805897B2 true JP6805897B2 (ja) | 2020-12-23 |
Family
ID=63446514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017043303A Active JP6805897B2 (ja) | 2017-03-07 | 2017-03-07 | 発光装置 |
Country Status (2)
Country | Link |
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US (1) | US10381530B2 (ja) |
JP (1) | JP6805897B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018093161A (ja) * | 2016-12-02 | 2018-06-14 | 豊田合成株式会社 | 発光装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6806030B2 (ja) * | 2017-10-24 | 2020-12-23 | 豊田合成株式会社 | 照明装置 |
DE112018006827T5 (de) | 2018-01-11 | 2020-09-17 | Ecosense Lighting Inc. | Vielkanalsysteme zum bereitstellen von einstellbarem licht und funktionellen diodenemisionen |
US10991855B2 (en) * | 2018-04-16 | 2021-04-27 | Lextar Electronics Corporation | White light emitting device |
JP2020053664A (ja) * | 2018-09-20 | 2020-04-02 | 豊田合成株式会社 | 発光装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101562022B1 (ko) * | 2009-02-02 | 2015-10-21 | 삼성디스플레이 주식회사 | 발광 다이오드 유닛, 이를 포함하는 표시 장치 및 발광 다이오드 유닛 제조 방법 |
US8884512B2 (en) * | 2009-09-17 | 2014-11-11 | Kabushiki Kaisha Toshiba | White light emitting lamp and white LED lighting apparatus including the same |
JP5370047B2 (ja) * | 2009-09-25 | 2013-12-18 | 三菱化学株式会社 | 白色発光装置のための演色性改善方法および白色発光装置 |
US8217406B2 (en) * | 2009-12-02 | 2012-07-10 | Abl Ip Holding Llc | Solid state light emitter with pumped nanophosphors for producing high CRI white light |
JP5105132B1 (ja) * | 2011-06-02 | 2012-12-19 | 三菱化学株式会社 | 半導体発光装置、半導体発光システムおよび照明器具 |
EP3176836B1 (en) * | 2012-10-04 | 2024-04-10 | Seoul Semiconductor Co., Ltd. | White light emitting device, lighting system, and dental lighting system |
JP2015082596A (ja) * | 2013-10-23 | 2015-04-27 | 株式会社東芝 | 発光装置 |
KR102184381B1 (ko) * | 2014-03-21 | 2020-11-30 | 서울반도체 주식회사 | 자외선 발광 다이오드를 이용한 발광 소자 및 이를 포함하는 조명장치 |
DE102014108188A1 (de) * | 2014-06-11 | 2015-12-17 | Osram Gmbh | Optoelektronisches Halbleiterbauteil |
JP6384302B2 (ja) | 2014-12-05 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
JP6106307B2 (ja) | 2016-04-12 | 2017-03-29 | シャープ株式会社 | 発光装置、並びに、当該発光装置を用いた照明器具及び表示装置 |
-
2017
- 2017-03-07 JP JP2017043303A patent/JP6805897B2/ja active Active
- 2017-11-21 US US15/820,180 patent/US10381530B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018093161A (ja) * | 2016-12-02 | 2018-06-14 | 豊田合成株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
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US20180261733A1 (en) | 2018-09-13 |
US10381530B2 (en) | 2019-08-13 |
JP2018148101A (ja) | 2018-09-20 |
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