JP6765607B2 - Exposure device, exposure method - Google Patents

Description

The present invention relates to an exposure apparatus and an exposure method. More specifically, the present invention irradiates an exposure light through a mask on which a mask pattern is formed on a work coated with a photosensitizer to expose the work to a mask pattern. The present invention relates to an exposure apparatus and an exposure method for transferring light.

Conventionally, a mirror element having a reflecting surface that reflects illumination light and a plurality of drive units that apply a force to the back surface of the mirror element to deform the reflecting surface are provided, and the reflecting surface can be deformed into various shapes. An exposure apparatus including the above-mentioned optical system is disclosed (see, for example, Patent Documents 1 and 2). In the exposure apparatus of Patent Document 1, the reflecting surface of the mirror element is deformed into various shapes by a plurality of drive units arranged on the back surface of the mirror element, and the optical axis that is difficult to correct by a normal imaging characteristic correction mechanism. The non-rotational symmetric aberration component such as the astigmatism above is corrected.

In the exposure apparatus of Patent Document 2, the displacement amount between the work and the mask and the strain amount of the work are calculated based on the deviation amount of the alignment mark between the work and the mask, and the work is based on the calculated displacement amount. It is known that the mask pattern is exposed according to the shape of the exposed area of the work by adjusting the alignment between the mask and the mask and correcting the curvature of the reflector based on the calculated strain amount. ..

Further, conventionally, a bent mirror having a structure in which the reflective mirror is bonded to the reflective mirror base by an adhesive applied to the back surface of the reflective mirror (see, for example, Patent Document 3) and the point of action of the lever means are bonded to the back surface of the mirror. , A light irradiation device is disclosed in which a weight is attached to the point of emphasis of the adhesive means to correct the bending of the mirror (see, for example, Patent Document 4).

Japanese Unexamined Patent Publication No. 2013-161992 Japanese Unexamined Patent Publication No. 2011-123461 Japanese Unexamined Patent Publication No. 2011-107438 JP-A-2010-197671

By the way, in the exposure apparatus described in Patent Document 2, if the curvature of the plane mirror is corrected in response to the strain of the work, the illuminance distribution of the exposure light deteriorates, so that it is required to improve the deterioration of the illuminance distribution. ..

Further, although the adhesive used for adhering the reflective mirror generally has high rigidity when dried, the toughness tends to decrease and the adhered portion tends to be brittle. Therefore, when an external force such as vibration acts on the reflection mirror, the reflection mirror may be peeled off from the base. The peeling of the reflection mirror from the base is directly linked to the disturbance of the luminous flux of the reflected light, which may have a serious adverse effect on the exposure performance.

However, according to Patent Documents 3 and 4, although there is a description about adhesion between a member such as a mirror base or a point of action of a lever means and a reflective mirror, there is a description about management after adhesion such as peeling of an adhesive. Absent.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to be able to accurately perform exposure transfer of a mask pattern according to the shape of an exposed area of the work even when the work is distorted. An object of the present invention is to provide an exposure apparatus and an exposure method capable of improving the illuminance distribution of exposure light and improving the exposure accuracy.

The above object of the present invention is achieved by the following configuration.
(1) Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
An alignment detection system that detects the alignment mark of the work and the alignment mark of the mask,
An illuminance measuring means provided on the work support portion and measuring the illuminance applied to the work support portion,
An exposure apparatus that irradiates the work with exposure light from the light source through the mask and transfers the pattern of the mask to the work.
The alignment mark of the work and the alignment mark of the mask are detected by the alignment detection system, and the illuminance irradiated to the work support portion by the illuminance measuring means by irradiating the exposure light is measured.
The feed mechanism relatively moves the work and the mask based on the amount of misalignment between the mask and the work calculated from the amount of misalignment of both alignment marks detected by the alignment detection system. Then, while correcting the alignment between the work and the mask,
The mirror bending mechanism corrects the curvature of the reflecting mirror according to the calculated strain amount of the work, and the feed mechanism corrects the gap between the mask and the work.
An exposure apparatus characterized in that the correction is repeated so that the amount of misalignment between the mask and the work, the amount of misalignment of the work after strain correction, and the amount of decrease in illuminance are equal to or less than an allowable value.
(2) A detection light source that irradiates directional light from the exposed surface side of the reflecting mirror toward the reflecting mirror, and a reflecting plate on which the directional light reflected by the reflecting mirror is projected. An imaging means that captures the directional light reflected on the reflector via the reflector, and a displacement amount of the directional light that is imaged when the curvature of the reflector is corrected. A control unit for detecting light sources and a curvature correction amount detection system having
The exposure apparatus according to (1), wherein the mirror bending mechanism corrects the curvature of the reflecting mirror while detecting the displacement amount of the light having directivity by the curvature correction amount detecting system.
(3) Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
An exposure apparatus that irradiates the work with exposure light from the light source through the mask and transfers the pattern of the mask to the work.
The pattern transferred to the work is measured and
Based on the measured pattern, the feed mechanism corrects the gap between the work and the mask, and the mirror bending mechanism corrects the curvature of the reflector.
An exposure apparatus characterized in that the correction is repeated so that the amount of misalignment between the mask and the work, the amount of misalignment of the work after strain correction, and the amount of decrease in illuminance are equal to or less than an allowable value.
(4) The exposure apparatus according to (3), wherein the feed mechanism further corrects the alignment between the work and the mask based on the measured pattern.
(5) A work support portion that supports the work, a mask support portion that supports the mask, and an illumination optical system provided with a reflecting mirror that reflects the exposure light from the light source are provided, and the exposure light from the light source is masked. An exposure device that irradiates a work through a work and transfers a mask pattern to the work. The reflecting mirror is held by a holding member that holds the reflecting mirror through a pad bonded by an adhesive, and the reflecting mirror and the pad. An exposure apparatus comprising: a detection wire that is fixedly arranged in a light source and can be broken when the adhesive between the reflector and the pad is peeled off, and a detection device that detects the breakage of the detection wire.
(6) Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
An alignment detection system that detects the alignment mark of the work and the alignment mark of the mask,
An illuminance measuring means provided on the work support portion and measuring the illuminance applied to the work support portion,
This is an exposure method in which an exposure light from the light source is applied to the work through the mask to transfer the pattern of the mask to the work by using an exposure apparatus including the above.
A step of detecting the alignment mark of the work and the alignment mark of the mask by the alignment detection system, and
A step of calculating the amount of misalignment between the mask and the work and the amount of strain of the work based on the amount of misalignment of both alignment marks detected by the alignment detection system.
A step of correcting the alignment between the work and the mask by the feed mechanism based on the amount of misalignment between the mask and the work.
The mirror bending mechanism corrects the curvature of the reflecting mirror according to the amount of strain of the work, and the feed mechanism corrects the gap between the mask and the work.
An exposure method characterized in that the correction is repeated so that the amount of misalignment between the mask and the work, the amount of misalignment of the work after strain correction, and the amount of decrease in illuminance are equal to or less than an allowable value.
(7) Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
This is an exposure method in which an exposure light from the light source is applied to the work through the mask to transfer the pattern of the mask to the work by using an exposure apparatus including the above.
The process of measuring the pattern transferred to the work and
Based on the measured pattern, the mirror bending mechanism corrects the curvature of the reflector, and the feed mechanism corrects the gap between the mask and the work.
An exposure method characterized by repeating the above correction so that the amount of misalignment between the mask and the work, the amount of misalignment of the work after strain correction, and the amount of decrease in illuminance are equal to or less than an allowable value.

According to the exposure apparatus and the exposure method of the present invention, the curvature of the reflecting mirror is corrected by the mirror bending mechanism and the gap between the mask and the work is corrected by the feed mechanism according to the amount of strain of the work. That is, by performing the gap correction, it is possible to reduce the amount of curvature correction of the reflector, and it is possible to reduce the influence of the exposure light on the illuminance distribution caused by correcting the curvature of the reflector, and improve the illuminance distribution. It is possible to perform high-resolution exposure.

Further, according to the exposure apparatus and the exposure method of the present invention, the curvature of the reflecting mirror is corrected by the mirror bending mechanism and the gap between the mask and the work is corrected by the feed mechanism based on the measured pattern. That is, by performing the gap correction, it is possible to reduce the amount of curvature correction of the reflector, and it is possible to reduce the influence of the exposure light on the illuminance distribution caused by correcting the curvature of the reflector, and improve the illuminance distribution. It is possible to perform high-resolution exposure.

Further, according to the exposure apparatus of the present invention, the reflecting mirror is held by a holding member that holds the reflecting mirror through a pad bonded by an adhesive, is fixed to the reflecting mirror and the pad, and is arranged and arranged, and the adhesive is used. Since it is provided with a detection wire that can be broken when the adhesive between the reflector and the pad is peeled off and a detection device that detects the breakage of the detection wire, the adhesive peeling between the reflector and the pad is detected by the disconnection of the detection wire. be able to. As a result, it is possible to prevent the light flux of the reflected light from being disturbed by the reflecting mirror and maintain the exposure performance.

It is a front view of the exposure apparatus which concerns on this invention. It is a figure which shows the illumination optical system and the curvature correction amount detection system of 1st Embodiment which concerns on this invention. (A) is a plan view showing a reflector support structure of an illumination optical system, (b) is a cross-sectional view taken along line AA of (a), and (c) is B of (a). It is sectional drawing along the-B line. It is a figure which shows the state which operated the support mechanism of the reflector support structure of FIG. It is a figure which shows the flowchart of the exposure method of this embodiment. It is a figure which shows the positional relationship between a mask and a work after alignment adjustment. (A) is a diagram showing a state before correcting the curvature of the reflector, (b) is an image taken by the camera on the left of (a), and (c) is a diagram on the right of (a). It is an image drawing of a camera. (A) is a diagram showing a state after correcting the curvature of the reflector, (b) is an image taken by the camera on the left of (a), and (c) is a diagram on the right of (a). It is an image drawing of a camera. It is a figure which shows the displacement amount of the laser beam projected on the reflector. It is a figure which shows the illumination optical system and the curvature correction amount detection system of 2nd Embodiment. It is a figure which shows the illumination optical system and the curvature correction amount detection system of 3rd Embodiment. It is a figure which shows the flowchart of the exposure method of this embodiment. It is a figure which shows the flowchart which concerns on the exposure apparatus and the exposure method of 4th Embodiment. It is a figure which shows the flowchart which concerns on the exposure method of 5th Embodiment. (A) is a plan view showing a reflector support structure of the illumination optical system according to the exposure apparatus of the sixth embodiment, and (b) is a cross-sectional view taken along the line AA of (a). c) is a cross-sectional view taken along the line BB of (a). (A) is an enlarged view of the reflector support structure, (b) is an enlarged view showing a state in which one detection wire is arranged on a plurality of pads and a mirror, and (c) is provided between the pad and the mirror. It is an enlarged view which shows the slack of the detected detection wire.

(First Embodiment)
Hereinafter, an embodiment of the exposure apparatus according to the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram showing an exposure apparatus of the present invention.
As shown in FIG. 1, the proximity exposure apparatus PE uses a mask M smaller than the work W as an exposed material, holds the mask M on the mask stage 1, and holds the work W on the work stage (work support portion) 2. The pattern of the mask M is formed by irradiating the mask M with light for pattern exposure from the illumination optical system 3 while holding the mask M and the work W in close proximity to each other and arranging them facing each other with a predetermined exposure gap. The exposure is transferred onto the work W. Further, the work stage 2 is step-moved with respect to the mask M in two axial directions (horizontal direction) in the X-axis direction and the Y-axis direction, and exposure transfer is performed step by step.

In order to move the work stage 2 in steps in the X-axis direction, an X-axis stage feed mechanism 5 for step-moving the X-axis feed base 5a in the X-axis direction is installed on the device base 4. On the X-axis feed base 5a of the X-axis stage feed mechanism 5, a Y-axis stage feed mechanism 6 for step-moving the Y-axis feed base 6a in the Y-axis direction is installed in order to move the work stage 2 in steps in the Y-axis direction. Has been done. A work stage 2 is installed on the Y-axis feed base 6a of the Y-axis stage feed mechanism 6. The work W is held on the upper surface of the work stage 2 in a state of being vacuum-sucked by a work chuck or the like. Further, on the side portion of the work stage 2, a substrate side displacement sensor 15 for measuring the height of the lower surface of the mask M is arranged. Therefore, the substrate side displacement sensor 15 can move together with the work stage 2 in the X and Y axis directions.

A plurality of (four in the embodiment shown in the figure) guide rails 51 of the X-axis linear guides are arranged on the device base 4 in the X-axis direction, and each guide rail 51 has a lower surface of the X-axis feed base 5a. A slider 52 fixed to is straddled. As a result, the X-axis feed base 5a is driven by the first linear motor 20 of the X-axis stage feed mechanism 5 and can reciprocate in the X-axis direction along the guide rail 51. Further, a plurality of Y-axis linear guide guide rails 53 are arranged on the X-axis feed base 5a in the Y-axis direction, and each guide rail 53 has a slider 54 fixed to the lower surface of the Y-axis feed base 6a. Is straddled. As a result, the Y-axis feed base 6a is driven by the second linear motor 21 of the Y-axis stage feed mechanism 6 and can reciprocate in the Y-axis direction along the guide rail 53.

Since the work stage 2 is moved in the vertical direction between the Y-axis stage feed mechanism 6 and the work stage 2, the vertical coarse movement device 7 having a relatively coarse positioning resolution but a large movement stroke and movement speed and the vertical coarse movement A vertical fine movement device 8 is installed, which enables positioning with higher resolution than the device 7 and finely adjusts the gap between the facing surfaces of the mask M and the work W to a predetermined amount by finely moving the work stage 2 up and down. ..

The vertical roughing device 7 moves the work stage 2 up and down with respect to the fine movement stage 6b by an appropriate drive mechanism provided in the fine movement stage 6b described later. The stage coarse movement shafts 14 fixed to the four positions on the bottom surface of the work stage 2 engage with the linear motion bearings 14a fixed to the fine movement stage 6b and are guided in the vertical direction with respect to the fine movement stage 6b. It is desirable that the vertical coarsening device 7 has high repetitive positioning accuracy even if the resolution is low.

The vertical fine movement device 8 includes a fixing base 9 fixed to the Y-axis feed base 6a and a guide rail 10 of a linear guide attached to the fixing base 9 with its inner end side inclined diagonally downward. A ball screw nut (not shown) is connected to the slide body 12 that reciprocates along the guide rail 10 via the slider 11 straddling the guide rail 10, and the upper end surface of the slide body 12 is connected. Is slidably in contact with the flange 12a fixed to the fine movement stage 6b in the horizontal direction.

Then, when the screw shaft of the ball screw is rotationally driven by the motor 17 attached to the fixing base 9, the nut, the slider 11, and the slide body 12 are integrally moved in an oblique direction along the guide rail 10. , The flange 12a slightly moves up and down.
The vertical fine movement device 8 may drive the slide body 12 by a linear motor instead of driving the slide body 12 by the motor 17 and the ball screw.

A total of three vertical fine movement devices 8 are installed, one on one end side (left end side in FIG. 1) of the Z-axis feed base 6a in the Y-axis direction and two on the other end side, and each is independently driven and controlled. It has become so. As a result, the vertical fine movement device 8 independently finely adjusts the heights of the flanges 12a at the three locations based on the measurement results of the gap amount between the mask M and the work W at the plurality of locations by the gap sensor 27, and the work stage 2 Fine-tune the height and tilt of.
If the height of the work stage 2 can be sufficiently adjusted by the vertical fine movement device 8, the vertical coarse movement device 7 may be omitted.
Therefore, in the present embodiment, the vertical coarse movement device 7 and the vertical fine movement device 8 constitute the feed mechanism of the present invention that relatively drives the mask M and the work W in the vertical direction.

Further, on the Y-axis feeder 6a, a bar mirror 19 facing the Y-axis laser interferometer 18 that detects the position of the work stage 2 in the Y direction and an X-axis laser that detects the position of the work stage 2 in the X-axis direction. A bar mirror (both not shown) facing the interferometer is installed. The bar mirror 19 facing the Y-axis laser interferometer 18 is arranged along the X-axis direction on one side of the Y-axis feeder 6a, and the bar mirror facing the X-axis laser interferometer is the Y-axis feeder 6a. It is arranged along the Y-axis direction on one end side.

The Y-axis laser interferometer 18 and the X-axis laser interferometer are respectively arranged so as to face the corresponding bar mirrors and are supported by the device base 4. Two Y-axis laser interferometers 18 are installed so as to be separated from each other in the X-axis direction. The two Y-axis laser interferometers 18 detect the position of the Y-axis feed base 6a and, by extension, the work stage 2 in the Y-axis direction and the yawing error via the bar mirror 19. Further, the X-axis laser interferometer detects the position of the X-axis feeder 5a and, by extension, the work stage 2 in the X-axis direction via the opposing bar mirrors.

The mask stage 1 is inserted into the mask base frame 24 made of a substantially rectangular frame and the opening at the center of the mask base frame 24 through a gap in the X, Y, θ directions (in the X, Y plane). A movably supported mask frame 25 is provided, and the mask base frame 24 is held in a fixed position above the work stage 2 by a support column 4a projecting from the device base 4.

A frame-shaped mask holder (mask support portion) 26 is provided on the lower surface of the central opening of the mask frame 25. That is, a plurality of mask holder suction grooves connected to a vacuum suction device (not shown) are provided on the lower surface of the mask frame 25, and the mask holder 26 is sucked onto the mask frame 25 via the plurality of mask holder suction grooves. Be retained.

A plurality of mask suction grooves (not shown) for sucking the peripheral portion on which the mask pattern of the mask M is not drawn are provided on the lower surface of the mask holder 26, and the mask M passes through the mask suction grooves. It is detachably held on the lower surface of the mask holder 26 by a vacuum suction device (not shown).

Further, the mask frame 25 is equipped with a CCD camera 30 for alignment adjustment that captures the alignment mark Ma of the mask M and the alignment mark Wa of the work W.
Further, the work stage 2 is provided with a plurality of illuminance sensors 95 as illuminance measuring means for measuring the illuminance of the exposure light applied to the work stage 2.

As shown in FIG. 2, the illumination optical system 3 of the exposure apparatus PE of the present embodiment is a light source for irradiating ultraviolet rays, for example, a high-pressure mercury lamp 61, and a reflector that collects the light emitted from the high-pressure mercury lamp 61. A multi-lamp unit 60 including 62, a plane mirror 63 for changing the direction of the optical path EL, an exposure control shutter unit 64 for controlling the opening and closing of the irradiation optical path, and an exposure control shutter unit 64 arranged on the downstream side. An optical integrator 65 that emits the light collected by the reflector 62 so as to have a uniform illuminance distribution as much as possible in the irradiation region, a flat mirror 66 for changing the direction of the optical path EL emitted from the optical integrator 65, and the like. It includes a collimation mirror 67 that irradiates the light from the high-pressure mercury lamp 61 as parallel light, and a flat mirror 68 that irradiates the parallel light toward the mask M. A DUV cut filter, a polarizing filter, and a bandpass filter may be arranged between the optical integrator 65 and the exposed surface. Further, as the light source, the high-pressure mercury lamp may be a single lamp, or may be composed of an LED.

When the exposure control shutter unit 64 is opened and controlled at the time of exposure, the light emitted from the multi-lamp unit 60 passes through the flat mirror 63, the optical integrator 65, the flat mirror 66, the collimation mirror 67, and the flat mirror 68. Then, the surface of the mask M held by the mask holder 26, and thus the surface of the work W, is irradiated as light for pattern exposure, and the exposure pattern of the mask M is exposed and transferred onto the work W.

Here, as shown in FIG. 3, the plane mirrors 66 and 68 are made of a glass material formed in a rectangular shape in a front view. The plane mirror 66 on the integrator side and the plane mirror 68 on the mask side are supported by the mirror deformation unit holding frame 71 by a plurality of mirror deformation units 70 which are mirror bending mechanisms provided on the back side of the plane mirrors 66 and 68. There is. The mirror deformation unit 70 includes a plurality of pads 72, a plurality of holding members 73, and a plurality of motors 74 that are driving devices. The mirror deformation unit 70 is provided at three locations near the center of the back surface of the flat mirrors 66 and 68 and at 16 locations on the peripheral edge portion.

In the mirror deformation unit 70 provided near the center, the pad 72 is fixed to the back surfaces of the flat mirrors 66 and 68 with an adhesive. In the mirror deformation unit 70 provided on the peripheral edge portion, the pad 72 is fixed with an adhesive to the support portion 75 provided so as to sandwich the front and back surfaces of the flat mirrors 66 and 68. Further, each holding member 73 whose one end is fixed to the pad 72 is provided with a ball joint 76 as a bending mechanism that allows bending of ± 0.5 deg or more at a position closer to the pad 72, and is a mirror deformation unit. A motor 74 is attached to the other end opposite to the holding frame 71. The central holding member 73 of the flat mirrors 66 and 68 may have a structure fixed to the mirror deformation unit holding frame 71.

Further, the guide members 77 and 78 are attached to the rectangular mirror deformation unit holding frame 71 at the positions of two sides orthogonal to each other, and the side surface of the support portion 75 facing the guide members 77 and 78 is formed on the side surface. A rolling member 79 is attached. Further, a low friction mechanism 80 such as Teflon (registered trademark) is applied to the guide surfaces 77a and 78a of the guide members 77 and 78 that guide the rolling member 79.

Further, a plurality of contact sensors 81 are attached to the back surface of each position of the plane mirrors 66 and 68 that reflect the exposure light at the position of the alignment mark (not shown) on the mask side.

As a result, the plane mirrors 66 and 68 drive the motor 74 of each mirror deformation unit 70 while sensing the displacement amount of the plane mirrors 66 and 68 by the contact sensor 81, so that each mirror deformation unit 70 has its length. The support portion 75 is linearly moved by changing the displacement. Then, due to the difference in the length of each mirror deformation unit 70, the planar mirrors 66 and 68 are guided by the two guide members 77 and 78 via the rolling member 79 provided on the support portion 75, and the curvature thereof is locally measured. Can be corrected.

At that time, as shown in FIG. 4, since each mirror deformation unit 70 is provided with a ball joint 76, the portion on the support portion side can be three-dimensionally rotatable, and each pad 72. Can be tilted along the surface of the planar mirrors 66,68. Therefore, the glass material is prevented from peeling off the adhesion between the pads 72 and the flat mirrors 66 and 68, the stress of the flat mirrors 66 and 68 between the pads 72 having different movement amounts is suppressed, and the average fracture stress value is small. Even in the case of, when the curvature of the plane mirrors 66 and 68 is locally corrected, the plane mirrors 66 and 68 can be bent in the order of 10 mm without damaging the plane mirrors 66 and 68, and the curvature can be adjusted. It can be changed significantly.

Further, in the present embodiment, as shown in FIG. 2, a curvature correction amount detection system 90 for determining whether or not the curvature correction is properly performed when the curvatures of the plane mirrors 66 and 68 are corrected is provided. ing. The curvature correction amount detection system 90 irradiates the laser beam L as directional light from the exposed surface side (in the present embodiment, near the mask) to the planar mirror 68 in the optical path EL of the light beam of the exposure light. A plurality of (four in this embodiment) laser pointers 91 as laser light sources, a reflector 92 arranged so as to be retractable from the optical path EL of the light beam of the exposure light in the vicinity of the optical integrator 65, and a flat mirror 66. , 68 and the camera 93 as an imaging means for capturing the laser light L reflected on the reflecting plate 92 via the collimation mirror 67, and the exposed surface side of the flat mirror 68 (below the mask M in this embodiment). The illuminance sensor 95 as an illuminance measuring means for measuring the illuminance of the exposure light reflected by the plane mirrors 66 and 68 and the collimation mirror 67, and the mirror deformation of the camera 93, the illuminance sensor 95, and the plane mirrors 66 and 68. Detects the displacement amounts S1 and S2 of the laser beam L, which is provided between the unit 70 and the motor 74 and is imaged when the curvature of the plane mirror 68 is corrected, and the illuminance of the exposure light measured by the illuminance sensor 95. It also has a control unit 94 that controls the motor 74 of the mirror deformation unit 70 of the plane mirrors 66 and 68.

The laser pointer 91 is attached to the upper part of the CCD camera 30, for example, for detecting the alignment, and moves in synchronization with the movement of the CCD camera 30 to a position where the alignment mark on the mask side can be seen.

Since the reflector 92 is arranged near the integrator, which becomes the most focused light by being reflected by the collimation mirror 67, the four laser pointers reflected by the plane mirror 68, the collimation mirror 67, and the plane mirror 66. The laser beam L from 91 can be captured by the reflector 92 having a relatively small area. Further, the reflector 92 is arranged so as to be retractable from the optical path EL of the light flux by a drive mechanism (not shown) when the mask M is irradiated with the light flux of the exposure light from the light source during normal exposure. Further, by making the reflector 92 a reflective surface having a low reflectance, the visibility of the laser beam L in the camera 93 can be improved.

The camera 93 is arranged at a position away from the optical path EL of the light flux from the light source so as not to affect the light flux of the exposure light.

Further, the control unit 94 detects the position of the laser beam L imaged by the camera 93 when the curvature of the plane mirror 68 is corrected as the displacement amounts S1 and S2 before and after the curvature correction, and the displacement amount. After confirming whether S1 and S2 are appropriate for the calculated strain amount, a control signal is given to the motor 74 of the mirror deformation unit 70 of the plane mirror 68. Further, the control unit 94 detects the illuminance of the exposure light measured by the illuminance sensor 95 after correcting the curvature of the plane mirror 68, and mirrors the plane mirror 66 so as to suppress variations in the illuminance of the exposure light. A control signal is given to the motor 74 of the deformation unit 70.
As described above, the plane mirrors 66 and 68 of the present embodiment include the mirror deformation unit 70 and constitute the reflecting mirror with the mirror bending mechanism of the present invention.

Next, the exposure method of this embodiment will be described with reference to FIGS. 5 to 9. Here, the work W may be distorted during exposure and the exposed area may not be rectangular, but may be, for example, a parallelogram (see FIG. 6). Hereinafter, the case of exposing to such a work W will be described, but in FIGS. 7 and 8, the CCD camera 30 for detecting the alignment of the work W and the mask M is shown as being at a diagonal position of the work W.

First, the work W is conveyed to the exposure position (step S1), and the alignment mark Wa of the work W and the alignment mark Ma of the mask M are detected by the four CCD cameras 30 (step S2). Then, a control unit (not shown) determines the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W based on the amount of misalignment of both alignment marks Wa and Ma detected by each CCD camera 30. Calculated separately. Then, it is determined whether or not the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W are equal to or less than the permissible values (step S3).

If the amount of misalignment between the center of the mask M and the center of the work W exceeds the permissible value, the amount of correction by the alignment mechanism of the mask M (not shown) is calculated as a command value, and the amount of strain of the work W is the permissible value. If it exceeds, the correction amount of the plane mirror 68, specifically, the movement amount of each mirror deformation unit 70 is calculated as a command value.

Then, in step S4, by driving and controlling the alignment mechanism of the mask M, the work W and the mask M are aligned (misalignment correction). As a result, for example, as shown in FIG. 6, the total amount of misalignment between the center of each CCD camera 30, that is, each alignment mark Ma of the mask M and each alignment mark Wa of the work W is minimized, and the mask M becomes The deviation between the alignment mark Ma and the alignment mark Wa of the work W is mainly due to the strain of the work W.

Next, in step S5, in order to correspond to the shape of the exposed region of the work W, the curvature of the plane mirror 68 is corrected to correct the declination angle of the exposed light. Specifically, based on the strain amounts α and β of the work W as shown in FIG. 7, a command value regarding the movement amount of each mirror deformation unit 70 is sent to each motor 74, and the contact sensor 81 of the flat mirror 68. Each motor 74 is driven and controlled while checking the amount of displacement.

Further, at the time of this curvature correction, the reflector 92 advances on the optical path of the light flux of the exposure light, and the laser pointer 91 located above the mask M irradiates the laser beam L toward the plane mirror 68. As a result, the camera 93 has the laser light L (black circles in the figure) before the curvature correction and the laser light L'(white circles in the figure) after the curvature correction reflected on the reflector 92 as shown in FIG. And image.

Then, after the correction by the alignment mechanism and the correction by the plane mirror 68 are performed, the alignment mark Wa of the work W and the alignment mark Ma of the mask M are detected by the four CCD cameras 30 again in step S2. Here, as is clear from FIGS. 8 (b) and 8 (c), since the CCD camera 30 is located on the optical path side of the mask M, it cannot receive the light through the plane mirror 68. Therefore, the CCD camera 30 cannot detect the positions of both alignment marks corrected by the bending correction of the plane mirror 68, and is corrected by the alignment mechanism as in FIGS. 7 (b) and 7 (c). The alignment mark Wa of the work W and the alignment mark Ma of the mask M are detected. Therefore, in step S3 after the correction, it is determined whether or not the correction amount by the alignment mechanism based on the misalignment amount between the center of the mask M and the center of the work W is equal to or less than the allowable value.

Further, in step S3, the control unit 94 detects the positions of the laser beams L and L'imaged by the camera 93 as the displacement amounts S1 and S2 before and after the curvature correction, and the displacement amounts S1 and S2. Corresponds to the strain amounts α and β of the work W, specifically, the displacement amounts S1 and S2 of the laser beams L and L'are allowed for the values corresponding to the strain amounts α and β of the work W. Check if it is within the range. Then, a control signal is given to the motor 74 of the mirror deformation unit 70 of the plane mirror 68 until the displacement amounts S1 and S2 are within the permissible range of the values corresponding to the strain amounts α and β of the work W, and the plane mirror 68 Curvature correction is performed by.

Next, when the amount of misalignment and the amount of strain calculated in step S3 are equal to or less than the permissible values, the process proceeds to step S6. If the curvature of the flat mirror 68 is locally corrected by the motor 74 of the flat mirror 68, the illuminance distribution of the exposure light emitted toward the mask M may be deteriorated. Therefore, in step S6, first, the exposure light is irradiated, and the illuminance of the exposure light is measured by the illuminance sensor 95. Then, the control unit 94 gives a command value regarding the amount of movement of each mirror deformation unit 70 of the plane mirror 66 so that the illuminance distribution on the exposed surface side is uniform, specifically, the illuminance variation is within a predetermined range. Is sent to each motor 74, and each motor 74 is driven and controlled while checking the displacement amount of the plane mirror 66 by the contact sensor 81. As a result, the declination angle of the exposure light can be changed and the illuminance distribution can be improved by controlling the motor 74 of the mirror deformation unit 70 of the plane mirror 66 to change the curvature of the plane mirror 66.

After that, the process proceeds to step S7, and the exposure light is irradiated from the illumination optical system 3 toward the mask M, and the exposed region A (for example, the base pattern) of the work W is irradiated. As a result, the pattern of the mask M is exposed and transferred to the surface of the work W in a state of matching the shape of the exposed region A of the work W.

After the above exposure transfer is performed, the work stage 2 is stepped with respect to the mask M in the biaxial directions of the X-axis direction and the Y-axis direction (step S8), and a new step is performed in the same steps as described above for each step. Exposure transfer is performed.

The curvature of the reflecting surface shapes of the plane mirrors 66 and 68 is locally corrected by the mirror deformation unit 70 so as to be a combination of a parabolic curve or an elliptic curve. The shape of the reflecting surface of the collimation mirror 67 is a paraboloid curve or an elliptic curve. As a result, the light emitted from the multi-lamp unit 60 and incident on the work W through the plurality of mirrors 66, 67, 68 and the mask M is parallel light in which the declination angle is corrected and the illuminance distribution is adjusted. Therefore, the exposure accuracy can be improved.

Further, the curvature of the reflecting surface of the plane mirrors 66 and 68 is locally corrected by the mirror deformation unit 70 so as to be a combination of a radial curve or an elliptical curve, and the reflecting surface shape of the collimation mirror 67 is formed into a spherical shape (concave surface). ), The reflected light from the plane mirror 66 becomes parallel light and is incident on the collimation mirror 67, and the reflected light from the collimation mirror 67 proceeds so as to converge on the center of curvature of the collimation mirror 67. As a result, the reflected light of the plane mirror 68 whose curvature has been corrected becomes parallel light with an adjusted declination angle and is incident on the work W, so that the exposure accuracy is improved. At this time, if the center of curvature of the collimation mirror 67 and the focal point of the plane mirror 68 are matched, the declination angle can be further improved.

As described above, according to the exposure apparatus PE and the exposure method of the present embodiment, the two planar mirrors 66,68 of the plurality of mirrors 66,67,68 can correct the curvature of the planar mirrors 66,68. The mirror deformation unit 70 is provided and is arranged in the optical path EL between the integrator 65 and the mask M. Specifically, the plane mirror 66 arranged next to the integrator 65 in the optical path EL order of the exposure light includes a mirror deformation unit 70, and further includes a collimation mirror 67 and a plane mirror 68 including the mirror deformation unit 70. Be placed. As a result, even when the work W is distorted, the pattern of the mask M can be accurately exposed and transferred by correcting the curvature with the mirror deformation unit 70 of the plane mirror 68 according to the shape of the exposed area of the work W. At the same time, the deterioration of the illuminance distribution of the exposure light caused by correcting the curvature with the mirror deformation unit 70 of the plane mirror 68 is suppressed by changing the curvature of the plane mirror 66 to change the declination angle, and the illuminance is suppressed. It is possible to improve the distribution and perform high-resolution exposure.

Further, based on the amount of misalignment between the work W and the alignment marks Wa and Ma of the work W and the mask M detected by the CCD camera 30, the amount of misalignment between the work W and the mask M and the amount of strain of the work W are calculated and calculated. The alignment between the work W and the mask M is adjusted based on the amount of misalignment. As a result, the pattern of the mask M when the work W is distorted can be exposed and transferred with higher accuracy.

In this embodiment, the strain amount of the work W is calculated based on the deviation amount of the alignment marks Wa and Ma of the work W and the mask M detected by the CCD camera 30 using the curvature correction amount detection system 90. However, the present invention is not limited to this. For example, as in the third embodiment described later, the pattern of the mask M is once exposed and transferred to the work W, and the pattern transferred to the work W is measured by a length measuring machine (not shown) to distort the work W. You may calculate the amount.

(Second Embodiment)
Next, a second embodiment of the exposure apparatus according to the present invention will be described with reference to FIG. Since the illumination optical system 3 of the present embodiment has the same configuration as the illumination optical system of the first embodiment, the same or equivalent parts as those of the first embodiment are described by adding the same reference numerals to the drawings. Is omitted or simplified.

In the illumination optical system 3 of the present embodiment, as shown in FIG. 10, a plane mirror 66, a collimation mirror 67, and a plane mirror 68 are arranged on the downstream side of the optical integrator 65 in the optical path EL order of the exposure light. , A plurality of mirror deformation units 70 are arranged on the back surface side of the collimation mirror 67 and the planar mirror 68 arranged next to the collimation mirror 67, and the curvatures of the collimation mirror 67 and the planar mirror 68 can be locally corrected. It has become.

Even in the illumination optical system 3 of the present embodiment having such a configuration, even if the curvature of the plane mirror 68 is locally corrected, the illuminance distribution of the exposure light may be deteriorated. By changing the curvature of the collimation mirror 67, the declination angle of the exposure light can be changed and the illuminance distribution can be improved.

Further, if the reflection surface shape of the collimation mirror 67 is a spherical shape (concave surface) and the curvature of the reflection surface shape of the plane mirror 68 is locally corrected by the mirror deformation unit 70 so as to be a radial curve or an elliptical curve. When the reflected light from the plane mirror 66 is incident on the collimation mirror 67, the reflected light travels so as to converge on the center of curvature of the collimation mirror 67. Then, the reflected light of the plane mirror 68 whose curvature is corrected becomes parallel light whose declination angle and illuminance distribution are adjusted, and is incident on the work W to improve the exposure accuracy. At this time, if the center of curvature of the collimation mirror 67 and the focal point of the plane mirror 68 are matched, the declination angle can be further improved.

As described above, according to the exposure apparatus PE and the exposure method of the present embodiment of the present embodiment, the collimation mirror 67 including the plane mirror 66 and the mirror deformation unit 70 next to the integrator 65 in the optical path EL order of the exposure light. , And the plane mirror 68 including the mirror deformation unit 70 is arranged in this order. Also in this case, the pattern of the mask M can be accurately exposed and transferred according to the shape of the exposed region of the work W, and the illuminance distribution of the exposure light can be improved to improve the exposure accuracy.
Other configurations and effects are the same as those in the first embodiment.

(Third Embodiment)
Next, the exposure apparatus and the exposure method of the third embodiment will be described with reference to FIGS. 11 and 12. In the exposure apparatus PE of the first and second embodiments, the case where the mirror deformation unit 70 is provided on the two planar mirrors 66 and 68, or the collimation mirror 67 and the planar mirror 68 has been described. As shown in FIG. 11, a case where the mirror deformation unit 70 is provided on the plane mirror 68 will be described.
However, the exposure method of the present embodiment can also be applied to the exposure apparatus PE of the first and second embodiments, and in that case, it can be applied to the control of the reflector on the mask side provided with the mirror bending mechanism. it can.

Here, also in the exposure method of the present embodiment, as in the first embodiment, when the work W is distorted during exposure and the exposed area is not rectangular, for example, it is a parallelogram (see FIG. 5). Will be described as an example.

First, the work W is conveyed to the exposure position (step S1), and the alignment mark Wa of the work W and the alignment mark Ma of the mask M are detected by the four CCD cameras 30 (step S2). Then, a control unit (not shown) determines the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W based on the amount of misalignment of both alignment marks Wa and Ma detected by each CCD camera 30. Calculated separately. Then, it is determined whether or not the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W are equal to or less than the permissible values (step S3).

If the amount of misalignment between the center of the mask M and the center of the work W exceeds the permissible value, the amount of correction by the alignment mechanism of the mask M (not shown) is calculated as a command value, and the amount of strain of the work W is the permissible value. If it exceeds, the correction amount of the plane mirror 68, specifically, the movement amount of each mirror deformation unit 70 and the gap amount between the mask M and the work W, that is, the drive amount of the vertical fine movement device 8 is commanded. Calculate as a value.

Then, in step S4, by driving and controlling the alignment mechanism of the mask M, the work W and the mask M are aligned (misalignment correction). As a result, for example, as shown in FIG. 6, the total amount of misalignment between the center of each CCD camera 30, that is, each alignment mark Ma of the mask M and each alignment mark Wa of the work W is minimized, and the mask M becomes The deviation between the alignment mark Ma and the alignment mark Wa of the work W is mainly due to the strain of the work W.

Next, in step S5, in order to correspond to the shape of the exposed region of the work W, the curvature of the plane mirror 68 is corrected to correct the declination angle of the exposure light, and in step S9, the vertical fine movement is performed. The device 8 corrects the gap amount between the mask M and the work W. Specifically, based on the strain amounts α and β of the work W as shown in FIG. 7, a command value regarding the movement amount of each mirror deformation unit 70 is sent to each motor 74, and the movement amount of the work stage 2 is also sent. The command value related to is sent to the vertical fine movement device 8.

Here, the strain amounts α and β of the work W can be corrected only by correcting the curvature of the plane mirror 68, but in that case, the curvature correction amount of the plane mirror 68 becomes large, and the plane mirror 68 The effect of the correction of the curvature on the illuminance distribution of the exposure light becomes large. Therefore, as in the present embodiment, the curvature correction amount of the plane mirror 68 can be reduced by performing the curvature correction and the gap correction of the plane mirror 68 according to the strain amounts α and β of the work W. Therefore, the illuminance distribution can be improved and exposure at high resolution can be performed.

Each motor 74 is driven and controlled while checking the displacement amount of the plane mirror 68 by the contact sensor 81. Further, at the time of this curvature correction, the reflector 92 advances on the optical path of the light flux of the exposure light, and the laser pointer 91 located above the mask M irradiates the laser beam L toward the plane mirror 68. As a result, the camera 93 has the laser light L (black circles in the figure) before the curvature correction and the laser light L'(white circles in the figure) after the curvature correction reflected on the reflector 92 as shown in FIG. And image.

Then, after the correction by the alignment mechanism, the correction by the plane mirror 68, and the gap correction are performed, the alignment mark Wa of the work W and the alignment mark Ma of the mask M are detected again by the four CCD cameras 30 in step S2. To do. Further, in the second and subsequent steps S2, the exposure light is also irradiated, and the illuminance of the exposure light is measured by the illuminance sensor 95. Here, as is clear from FIGS. 8 (b) and 8 (c), since the CCD camera 30 is located on the optical path side of the mask M, it cannot receive the light through the plane mirror 68. Therefore, the CCD camera 30 cannot detect the positions of both alignment marks corrected by the bending correction of the plane mirror 68, and is corrected by the alignment mechanism as in FIGS. 7 (b) and 7 (c). The alignment mark Wa of the work W and the alignment mark Ma of the mask M are detected. Therefore, in step S3 after the correction, it is determined whether or not the correction amount by the alignment mechanism based on the misalignment amount between the center of the mask M and the center of the work W is equal to or less than the allowable value.

Further, in step S3, the control unit 94 detects the positions of the laser beams L and L'imaged by the camera 93 as the displacement amounts S1 and S2 before and after the curvature correction, and the displacement amounts S1 and S2. Corresponds to the strain amounts α and β of the work W, specifically, the displacement amounts S1 and S2 of the laser beams L and L'are allowed for the values corresponding to the strain amounts α and β of the work W. Check if it is within the range. At the same time, it is confirmed whether or not the amount of decrease in illuminance measured by the illuminance sensor 95 is equal to or less than the allowable value. Then, until the displacement amounts S1 and S2 are within the permissible range of values corresponding to the strain amounts α and β of the work W, and the amount of decrease in illuminance measured by the illuminance sensor 95 is equal to or less than the permissible value, the plane mirror 68 A control signal is given to the motor 74 of the mirror deformation unit 70, and the plane mirror 68 performs curvature correction and gap correction.

Next, when the amount of misalignment, the amount of strain, and the amount of decrease in illuminance calculated in step S3 are equal to or less than the permissible values, the process proceeds to step S7. Then, the exposure light is irradiated from the illumination optical system 3 toward the mask M, and the exposed region A (for example, the base pattern) of the work W is irradiated. As a result, the pattern of the mask M is exposed and transferred to the surface of the work W in a state of matching the shape of the exposed region A of the work W.

After the above exposure transfer is performed, the work stage 2 is stepped with respect to the mask M in the biaxial directions of the X-axis direction and the Y-axis direction (step S8), and a new step is performed in the same steps as described above for each step. Exposure transfer is performed.

As described above, according to the exposure apparatus PE and the exposure method of the present embodiment, the curvature of the plane mirror 68 is corrected by the mirror deformation unit 70 according to the strain amount of the work, and the mask is formed by the feed mechanism. Correct the gap with the work. That is, by performing the gap correction, the amount of curvature correction of the plane mirror 68 can be reduced, and the influence of the exposure light on the illuminance distribution caused by correcting the curvature of the plane mirror 68 can be reduced. Can be improved to perform high-resolution exposure.

Further, the laser pointer 91 that irradiates the laser beam L from the exposed surface side toward the planar mirror 68 from the planar mirror 68, the reflecting plate 92 on which the laser beam L reflected by the planar mirror 68 is projected, and the planar mirror 68. Curvature having a camera 93 that captures the laser beam L reflected on the reflector 92 and a control unit 94 that detects the amount of displacement of the laser beam L imaged when the curvature of the plane mirror 68 is corrected. The correction amount detection system 90 is further provided, and the mirror deformation unit 70 corrects the curvature of the plane mirror 68 while detecting the displacement amount of the laser beam L by the curvature correction amount detection system 90. As a result, it is possible to reliably correct the curvature of the plane mirror 68 according to the strain amount of the work W while imaging the displacement amount of the laser beam L.

An illuminance sensor 95 provided on the work stage 2 for measuring the illuminance applied to the work stage 2 is further provided, and an illuminance sensor 95 is used to measure the illuminance applied to the work stage 2 by irradiating exposure light. By repeating the above corrections so that the amount of displacement of the work W, the amount of displacement of the work W after distortion correction, and the amount of decrease in illuminance are less than the permissible values, the illuminance distribution can be improved more reliably and the illuminance can be improved. Exposure can be performed.

(Fourth Embodiment)
Next, a fourth embodiment of the exposure apparatus and the exposure method according to the present invention will be described with reference to FIG. In the exposure method of the present embodiment, as shown in FIG. 13, the amount of misalignment between the mask and the work and the amount of strain of the work are corrected by a method different from that of FIG. 12 of the third embodiment. The exposure apparatus of the embodiment does not have a curvature correction detection system as compared with those of the first to third embodiments. Other configurations are the same as those in the first to third embodiments, and the same or equivalent parts as those in the first to third embodiments are designated by the same reference numerals in the drawings to omit or simplify the description.

Hereinafter, the exposure method of the present embodiment will also be described as an example in which the work W is distorted during exposure and the exposed area is not rectangular.
In this embodiment, the pattern of the mask M is first exposed and transferred to the work W, and the pattern transferred to the work W is measured by a length measuring machine (not shown) (step S11). Then, based on the measured pattern, the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W are calculated separately. Then, it is determined whether or not the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W are equal to or less than the permissible values (step S12).

Then, when the amount of misalignment between the center of the mask M and the center of the work W exceeds the permissible value, the amount of correction by the alignment mechanism of the mask M is calculated as a command value, and the alignment of the mask M is performed in step S13. By driving and controlling the mechanism, alignment (deviation correction) between the work W and the mask M is performed.

When the strain amount of the work W exceeds the permissible value, the correction amount of the plane mirror 68, specifically, the movement amount of each mirror deformation unit 70 and the gap amount between the mask M and the work W, that is, , The movement amount of the work stage 2 is calculated as a command value.

Then, in step S14, in order to correspond to the shape of the exposed region of the work W, the curvature of the plane mirror 68 is corrected to correct the declination angle of the exposure light, and in step S15, the vertical fine movement device. According to 8, the gap amount between the mask M and the work W is corrected.

Here, also in the present embodiment, the strain amount of the work W can be corrected only by correcting the curvature of the plane mirror 68, but in that case, the curvature correction amount of the plane mirror 68 becomes large and the plane mirror 68 becomes flat. The effect of correcting the curvature of the mirror 68 on the illuminance distribution of the exposure light becomes large. Therefore, as in the present embodiment, the curvature correction amount of the flat mirror 68 can be reduced by performing the curvature correction and the gap correction of the flat mirror 68 according to the strain amount of the work W, and the illuminance can be reduced. The distribution can be improved and high-resolution exposure can be performed.

Then, after the correction by the alignment mechanism, the correction by the plane mirror 68, and the gap correction are performed, the trial exposure is performed again (step S16), and the exposure result is measured (step S17). Then, returning to step S12, here, in addition to the amount of misalignment between the center of the mask M and the center of the work W and the amount of strain of the work W, the illuminance is also determined from the measured pattern. As the illuminance, the illuminance measured by the illuminance sensor 95 at the time of the trial exposure may be used.

Then, it is determined whether or not the amount of misalignment between the mask M and the work W, the amount of misalignment of the work W after strain correction, and the amount of decrease in illuminance are equal to or less than the permissible values, and the amount of misalignment and strain calculated in step S12. If the amount and the amount of decrease in illuminance are not more than the permissible value, the process proceeds to step S18. Then, the exposure light is irradiated from the illumination optical system 3 toward the mask M, and the exposed region A (for example, the base pattern) of the work W is irradiated. As a result, the pattern of the mask M is exposed and transferred to the surface of the work W in a state of matching the shape of the exposed region A of the work W.

After the above exposure transfer is performed, the work stage 2 is stepped with respect to the mask M in the biaxial directions of the X-axis direction and the Y-axis direction (step S19), and a new step is performed in the same steps as described above for each step. Exposure transfer is performed.

As described above, according to the exposure apparatus PE and the exposure method of the present embodiment of the present embodiment, the pattern transferred to the work W is measured, and based on the measured pattern, the mirror deformation unit 70 performs a flat surface. The curvature of the mirror 68 is corrected, and the gap between the mask M and the work W is corrected by the vertical fine movement device 8. That is, by performing the gap correction, the amount of curvature correction of the plane mirror 68 can be reduced, and the influence of the exposure light on the illuminance distribution caused by correcting the curvature of the plane mirror 68 can be reduced. Can be improved to perform high-resolution exposure.

Further, according to the present embodiment, the alignment mechanism of the mask M further corrects the alignment between the work W and the mask M based on the measured pattern, so that the exposure can be performed at a high resolution.
In the present embodiment, the alignment correction is performed based on the measured pattern, but as in the first embodiment, the alignment mark Wa of the work W and the alignment mark Ma of the mask M are performed before the trial exposure. May be detected by the CCD cameras 30 at four locations to correct the amount of misalignment between the center of the mask M and the center of the work W.

Further, by repeating the above correction so that the amount of misalignment between the mask M and the work W, the amount of misalignment of the work W after strain correction, and the amount of decrease in illuminance are equal to or less than the permissible values, the illuminance distribution is more reliably improved. It is possible to perform high-resolution exposure.
Other configurations and effects are the same as those in the third embodiment.

(Fifth Embodiment)
Next, a fifth embodiment of the exposure apparatus and the exposure method according to the present invention will be described with reference to FIG. The exposure method of the present embodiment is a substantial combination of the exposure method of the third embodiment and the exposure method of the fourth embodiment.

That is, first, as in the third embodiment, the positions of the center of the mask M and the center of the work W based on the amount of deviation of both alignment marks Wa and Ma detected by each CCD camera 30 in steps S1 to S3. The amount of deviation and the amount of strain of the work W are calculated separately. Then, in steps S4, S5, and S9, the work W and the mask M are aligned, the curvature of the plane mirror 68 is corrected, and the gap amount between the mask M and the work W is corrected.

Next, in step S6, the exposure light is irradiated, the illuminance of the exposure light is measured by the illuminance sensor 95, and the curvature of the plane mirror 66 is set so that the variation of the illuminance on the exposed surface side is within a predetermined range. Make a correction.

After that, in step S10, a trial exposure is performed to determine whether or not the exposure result is good. If the exposure result is good, exposure transfer is performed in step S18, and further step exposure is performed in step S19.

On the other hand, if the result of the trial exposure is not good in step S10, further, in steps S13 to S15, the alignment of the work W and the mask M, the curvature correction of the plane mirror 68, and the mask M and the work W Correct the gap amount.

Then, further, a trial exposure is performed in step S16, the exposure result is measured (step S17), the exposure result is input from the measuring instrument, and the process returns to step S3, and the trial exposure in step S10 gives a good exposure result. Repeat until.

Therefore, according to the present embodiment, it is possible to correct the strain amount and the illuminance distribution of the work by the curvature correction amount detection system 90, and to correct the strain amount and the illuminance distribution of the work by the actual exposure pattern. Therefore, more accurate exposure can be realized.

(Sixth Embodiment)
Next, a sixth embodiment of the exposure apparatus according to the present invention will be described with reference to FIGS. 15 and 16. In this embodiment, a case where the mirror deformation unit 70 is provided on the plane mirror 68 will be described as an example.

In the present embodiment, as shown in FIGS. 15 and 16, the detection wire 85 is fixed by an adhesive so as to connect the back surface of the flat mirror 68 and the pad 72 adhered to the flat mirror 68. .. As the adhesive, the same adhesive as that for adhering the pad 72 to the flat mirror 68 is used. The detection wire 85 is a flat surface close to the pad-side fixing portion 85a set on the pad 72 and the peripheral edge portion 72a of the pad 72 at a plurality of locations (three locations in the embodiment shown in the figure) for one pad 72. It is bridged between the mirror side fixing portion 85b on the mirror 68, and a plurality of pads 72 (19 locations in the embodiment shown in FIG. 15) are connected by one detection wire 85 and arranged. ..

The detection wire 85 is conductive or non-conducting between both ends of one detection wire 85 fixed to one pad 72 at a plurality of places and arranged to the plurality of pads 72, that is, the detection wire 85. A detection device 86 that can detect the presence or absence of disconnection is connected.

A slight slack is provided in the connection portion 85c of the detection wire 85 that connects the pad-side fixing portion 85a on the pad 72 and the mirror-side fixing portion 85b on the flat mirror 68. As a result, even if the curvature of the flat mirror 68 is corrected by the motor 74 and the shape of the flat mirror 68 changes, the detection wire 85 is prevented from being broken due to the influence of kinking or the like.

The pad-side fixing portion 85a of the pad 72 to which the detection wire 85 is fixed and the detection wire 85 in the vicinity of the mirror-side fixing portion 85b of the flat mirror 68 are thickened or protected by a separate member to be protected by a separate member. The disconnection at 85a and the mirror-side fixing portion 85b may be suppressed.

In the illumination optical system 3 configured in this way, when the adhesive between the pad 72 and the flat mirror 68 is peeled off and the pad 72 is separated from the flat mirror 68, the pad 72 and the flat mirror 68 are arranged. The detection wire 85 is broken. This disconnection is electrically detected by the detection device 86, and a warning is sent to the operator.

Further, since the plurality of pads 72 are connected and arranged by one detection wire 85, it is possible to immediately detect which of the plurality of pads 72 is peeled off. Further, since the detection wires 85 are fixed to each pad 72 at three places, it is possible to detect the peeling of the plane mirror 68 in all directions. As a result, it is possible to prevent the light flux of the reflected light from the plane mirror 68 from being disturbed, and it is possible to maintain highly accurate exposure performance.

As described above, according to the exposure apparatus PE of the present embodiment, the flat mirror 68 is held by the holding member 73 that holds the flat mirror 68 via the pad 72 adhered by the adhesive, and the flat mirror 68 and the flat mirror 68 In order to provide a detection wire 85 that is fixed to the pad 72 and arranged and can be broken when the adhesive is peeled off from the flat mirror 68 and the pad 72, and a detection device 86 that detects the breakage of the detection wire 85. , The adhesive peeling between the flat mirror 68 and the pad 72 can be detected by the disconnection of the detection wire 85. As a result, it is possible to prevent the light flux of the reflected light from being disturbed by the flat mirror 68 and maintain the exposure performance.

Further, since the detection wires 85 are arranged between the pad 72 and the flat mirror 68 at a plurality of positions (three places in the embodiment shown in the figure) with respect to one pad 72, the flat mirror 68 and the pad Adhesive peeling with 72 can be reliably detected.

Further, the flat mirror 68 is held by the holding member 73 by a plurality of pads 72 bonded with an adhesive, and one continuous detection wire 85 is fixed to the plurality of pads 72 and the flat mirror 68 and arranged. Therefore, it is possible to monitor and detect the adhesive peeling of a plurality of pads 72 (19 places in the embodiment shown in the figure) with one detection wire 85.

Further, since the detection wire 85 has a slack between the mirror-side fixing portion 85b with the plane mirror 68 and the pad-side fixing portion 85a with the pad 72 to allow the posture change of the plane mirror 68, the plane mirror 68 It is possible to prevent the detection performance from being affected by the change in posture, and the reliability of adhesive peeling detection is improved.

Further, since the motor 74 capable of deforming the reflecting surface of the flat mirror 68 is further provided, the curvature of the flat mirror 68 can be corrected, and the adhesive peeling due to the curvature correction can be detected.

In the present embodiment, even when the pad 72 is attached to the support portion 75 sandwiching the front and back surfaces of the flat mirror 68, the detection wire 85 is adhered to the flat mirror 68 and the pad 72. Not limited to this, the support portion 75 and the pad 72 may be adhered to each other.
Further, in the present embodiment, the detection wire 85 is applied to the plane mirror 68 whose curvature is corrected by the motor 74, but the present invention is not limited to this, and the pad 72 is adhered to the reflector to use the reflector as a holding member. If it is a structure to be held, it can be applied to a structure having no driving means.
Further, the holding member may have any configuration as long as the reflector is held via the pad.
Further, the reflecting mirror of the present embodiment is not limited to a flat mirror, and may be a convex mirror or a concave mirror.

The present invention is not limited to the above-described embodiment, and can be appropriately modified, improved, and the like.

1 Mask stage (mask support)
2 Work stage (work support)
3 Illumination optical system 60 Multi-lamp unit (light source)
65 Optical integrator 66,68 Planar mirror (reflector with mirror bending mechanism)
67 Collimation mirror (concave reflector, reflector with mirror bending mechanism)
70 Mirror deformation unit (mirror bending mechanism)
72 Pad 73 Holding member 74 Motor (driving device)
85 Detection wire 85a Pad side fixing part 85b Mirror side fixing part 86 Detection device 95 Illuminance sensor EL Optical path M Mask PE Exposure device W Work

Claims (5)

Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
An alignment detection system that detects the alignment mark of the work and the alignment mark of the mask,
An illuminance measuring means provided on the work support portion and measuring the illuminance applied to the work support portion,
An exposure apparatus that irradiates the work with exposure light from the light source through the mask and transfers the pattern of the mask to the work.
The alignment mark of the work and the alignment mark of the mask are detected by the alignment detection system, and the misalignment amount of the mask and the work and the work are calculated from the misalignment of both alignment marks detected by the alignment detection system. And the amount of strain is calculated, and the illuminance irradiated to the work support portion by the illuminance measuring means by irradiating the exposure light is measured.
The feed mechanism, based on the positional deviation amount of the said calculated the mask workpiece, the workpiece and by relatively moving the said masks, as well as correcting the alignment of said workpiece and said mask,
Depending on the strain amount of the calculated work, the mirror bending mechanism, as well as correcting the curvature of the reflector, the feed mechanism, and corrects the gap between the between the mask workpiece,
The amount of misalignment between the mask and the work, the amount of deviation after correction of the curvature of the reflector and the correction of the gap according to the amount of strain of the work, and the amount of illuminance generated by correcting the curvature of the reflector. Repeat the above correction so that the amount of decrease is less than the allowable value .
An exposure apparatus having a control unit for controlling . A detection light source that irradiates directional light from the exposed surface side of the reflecting mirror toward the reflecting mirror, a reflecting plate on which the directional light reflected by the reflecting mirror is projected, and the reflection. An imaging means for capturing the directional light reflected on the reflecting plate through a mirror and a displacement amount of the directional light imaged when the curvature of the reflecting mirror is corrected are detected. A curvature correction amount detection system including the control unit is further provided.
Claim wherein the control unit, said mirror bending mechanism, while detecting the displacement amount of the light having the directivity in the curvature correction quantity detection system, and performs control for correcting the curvature of the reflector The exposure apparatus according to 1. Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
An exposure apparatus that irradiates the work with exposure light from the light source through the mask and transfers the pattern of the mask to the work.
The pattern transferred to the work is measured and
Based on the measured pattern, the feed mechanism, alignment correction of the workpiece and the mask, and performs gap correction of the workpiece and the mask, it said mirror bending mechanism, corrects the curvature of the reflector And
The amount of misalignment between the mask and the work, the amount of deviation after correction of the curvature of the reflector and the correction of the gap according to the amount of strain of the work, and the decrease in illuminance caused by correcting the curvature of the reflector. Repeat the above correction so that the amount is less than the allowable value .
An exposure apparatus having a control unit for controlling . Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
An alignment detection system that detects the alignment mark of the work and the alignment mark of the mask,
An illuminance measuring means provided on the work support portion and measuring the illuminance applied to the work support portion,
This is an exposure method in which an exposure light from the light source is applied to the work through the mask to transfer the pattern of the mask to the work by using an exposure apparatus including the above.
A step of detecting the alignment mark of the work and the alignment mark of the mask by the alignment detection system, and
A step of calculating the amount of misalignment between the mask and the work and the amount of strain of the work based on the amount of misalignment of both alignment marks detected by the alignment detection system.
A step of correcting the alignment between the work and the mask by the feed mechanism based on the amount of misalignment between the mask and the work.
A step of correcting the curvature of the reflecting mirror by the mirror bending mechanism and correcting a gap between the mask and the work by the feed mechanism according to the strain amount of the work.
A step of irradiating the exposure light and measuring the illuminance applied to the work support portion by the illuminance measuring means.
With
The amount of misalignment between the mask and the work, the amount of deviation after correction of the curvature of the reflector and the correction of the gap according to the amount of strain of the work, and the amount of illuminance generated by correcting the curvature of the reflector. An exposure method characterized by repeating the above correction so that the amount of reduction is equal to or less than an allowable value. Work support part that supports the work and
The mask support part that supports the mask and
A feed mechanism that relatively moves the work and the mask in the horizontal and vertical directions,
An illumination optical system having a light source and a reflecting mirror that reflects a luminous flux of exposure light from the light source.
A mirror bending mechanism capable of correcting the curvature of the reflector and
This is an exposure method in which an exposure light from the light source is applied to the work through the mask to transfer the pattern of the mask to the work by using an exposure apparatus including the above.
The process of measuring the pattern transferred to the work and
Based on the measured pattern, the mirror bending mechanism corrects the curvature of the reflector, and the feed mechanism corrects the alignment between the work and the mask and the gap between the mask and the work. With the process of
The amount of misalignment between the mask and the work, the amount of deviation after correction of the curvature of the reflector and the correction of the gap according to the amount of strain of the work, and the decrease in illuminance caused by correcting the curvature of the reflector. An exposure method characterized by repeating the above correction so that the amount becomes equal to or less than an allowable value.

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